公开(公告)号：US20220285256A1

公开(公告)日：2022-09-08

申请号：US17677505

申请日：2022-02-22

Applicant: STMicroelectronics Pte Ltd

Inventor： Jing-En LUAN

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A method of forming a wafer-level package includes singulating a wafer into a plurality of reconstituted integrated circuit dice, affixing a carrier to a front side of the plurality of integrated circuit dice, and forming a laser direct structuring (LDS) activatable resin over a back side of the plurality of integrated circuit dice, over side edges of the plurality of integrated circuit die, and over adjacent portions of the carrier. Desired areas of the LDS activatable resin are activated to form conductive areas within the LDS activatable resin, at least one of the conductive areas associated with each integrated circuit die being formed to contact a respective a respective pad of that integrated circuit die and to run alongside to and in contact with a side of the LDS activatable resin in contact with a side edge of that integrated circuit die.

公开(公告)号：US20220107392A1

公开(公告)日：2022-04-07

申请号：US17551001

申请日：2021-12-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： David GANI

IPC: G01S7/48 ,  G01J1/42 ,  G01S7/481 ,  G01S17/08 ,  G01S7/493 ,  G01S7/497 ,  G01S7/487 ,  G01S17/04

Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.

公开(公告)号：US11244892B2

公开(公告)日：2022-02-08

申请号：US16550775

申请日：2019-08-26

Applicant: STMicroelectronics Pte Ltd

Inventor： Daniel Yap ,  Hung Meng Loh

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48

Abstract: A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.

公开(公告)号：US20210399157A1

公开(公告)日：2021-12-23

申请号：US17344520

申请日：2021-06-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L31/12 ,  H01L31/0203 ,  H01L31/02 ,  H01L31/18

Abstract: The present disclosure is directed to a sensor die with an embedded light sensor and an embedded light emitter as well as methods of manufacturing the same. The light emitter in the senor die is surrounded by a resin. The sensor die is incorporated into semiconductor device packages as well as methods of manufacturing the same. The semiconductor device packages include a first optically transmissive structure on the light sensor of the sensor die and a second optically transmissive structure on the light emitter of the sensor die. The first optically transmissive structure and the second optically transmissive structure cover and protect the light sensor and the light emitter, respectively. A molding compound is on a surface of a sensor die and covers sidewalls of the first and second optically transmissive structures on the sensor die.

公开(公告)号：US11193821B2

公开(公告)日：2021-12-07

申请号：US16213197

申请日：2018-12-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent Herard ,  David Gani

IPC: H01J40/14 ,  G01J1/02 ,  G01J1/42

Abstract: One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.

公开(公告)号：US20210247344A1

公开(公告)日：2021-08-12

申请号：US17236750

申请日：2021-04-21

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Malek Brahem ,  Hatem Majeri ,  Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.

公开(公告)号：US20210214211A1

公开(公告)日：2021-07-15

申请号：US17115137

申请日：2020-12-08

Applicant: STMicroelectronics Pte Ltd

Inventor： Ravi Shankar ,  Tien Choy Loh ,  Ananya Venkatesan

IPC: B81B3/00 ,  G01L1/18 ,  G01L9/00

Abstract: A blind opening is formed in a bottom surface of a semiconductor substrate to define a thin membrane suspended from a substrate frame. The thin membrane has a topside surface and a bottomside surface. A stress structure is mounted to one of the topside surface or bottomside surface of the thin membrane. The stress structure induces a bending of the thin membrane which defines a normal state for the thin membrane. Piezoresistors are supported by the thin membrane. In response to an applied pressure, the thin membrane is bent away from the normal state and a change in resistance of the piezoresistors is indicative of the applied pressure.

公开(公告)号：US11009477B2

公开(公告)日：2021-05-18

申请号：US16397635

申请日：2019-04-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01K7/01 ,  G01K7/16 ,  G01K7/18 ,  G01K7/20 ,  G01L9/12 ,  H01L25/00 ,  H01L27/02 ,  H01L29/78 ,  G01N27/22 ,  H01L25/065 ,  G01L19/00 ,  G01D21/02

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US20210020555A1

公开(公告)日：2021-01-21

申请号：US16927776

申请日：2020-07-13

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Laurent HERARD ,  David PARKER ,  David GANI

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides devices and methods in which a semiconductor chip has a reduced size and thickness. The device is manufactured by utilizing a sacrificial or dummy silicon wafer. A recess is formed in the dummy silicon wafer where the semiconductor chip is mounted in the recess. The space between the dummy silicon wafer and the chip is filled with underfill material. The dummy silicon wafer and the backside of the chip are etched using any suitable etching process until the dummy silicon wafer is removed, and the thickness of the chip is reduced. With this process, the overall thickness of the semiconductor chip can be thinned down to less than 50 μm in some embodiments. The ultra-thin semiconductor chip can be incorporated in manufacturing flexible/rollable display panels, foldable mobile devices, wearable displays, or any other electrical or electronic devices.

公开(公告)号：US20200185356A1

公开(公告)日：2020-06-11

申请号：US16795099

申请日：2020-02-19

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jian ZHOU

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/10 ,  H01L21/50

Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.