Abstract:
A method, a system and an arrangement for handling component tapes in connection with mounting components onto circuit boards in a component mounting machine are disclosed, which utilizes a carrier for carrying component tapes. Each component tape is held by a component tape reel. The component mounting machine utilizes component magazines from which components, carried by the component tape, are supplied for use in a mounting process of the component mounting machine. The component tape of each component tape reel is loaded into a tape guide for guiding the component tape in the component mounting machine, and the component tape reels are arranged in the carrier, which thereaft is placed in the magazine. The tape guides are then mounted in the magazine such that the component tape loaded therein may interact with feeding devices provided in the magazine. Thereby, the magazine is loaded with components and prepared for the ensuing mounting process.
Abstract:
System for handling components in connection with circuit board assembly in a component mounting machine. The system comprises a number of component tapes provided on component tape reels, and a number of tape guides arranged for receiving component tapes of a given component tape width and for bringing the component tape in position for feeding of the component tape and for picking components from the component tape in the component mounting machine. The tape guides have a similar geometrical outline and basic configuration, and each tape guide comprises a component exposure device for exposing a component at a picking position by removing the portion of the cover tape covering the component. The tape guides are divided into sub-sets of tape guides, wherein the tape guides of each individual sub-set have component exposure devices of the same design, which design is dependent on the configurations of the component tapes intended for that sub-set of tape guides. Each tape guide also comprises visual marking for indicating the sub-set to which the tape guide belongs.
Abstract:
A device is proposed for applying material such as solder paste and glue in discrete points, particularly for applying solder paste on electronic circuit boards. The device comprises a pump house (202-205; 301, 307), a tube or a channel (206) by means of which material is fed to the pump house, a nozzle (111, 205) for feeding material from the pump house (202-205; 301, 307). Suitable upper and lower valve devices are arranged to block, at predetermined times, the feeding of material to and from the pump house (202-205; 301, 307). The lower valve device may possibly be replaced by a restriction device. As is conventional the pump house (202-205; 301, 307) comprises an outer pump cylinder (203; 307) and an inner piston (204; 301). The displacement of the piston (201; 301) is obtained by the fact that the piston is connected to a magnetostrictive rod (202; 308). This rod (202; 308) cooperates with a coil (208) arranged around the rod (202; 308). When an electric current is fed to this coil (208) the length of the rod will increase. A very rapid application of the material is achieved.
Abstract:
The invention relates to a method and an apparatus for calibrating a positioning system including a control computer (1405) for producing command value signals to a positioning apparatus which positions an object against a work surface. Sensors (1406,1407) detect the location of the positioning system and convert it to an actual value signal which can be fed back to the control computer. A calibration plane (601) placed on the work surface contains a number of calibration points (602,603), the command value positions of which are entered into the control computer. The positions of at least some calibration points are sensed by a calibration probe (605) corresponding to the object and the actual values for the positions of said points are compared with the command values for the positions of these points on the work surface entered into the control computer. The differences obtained between the actual values and the command values for the positions of the calibration points are stored in the control computer and are used for compensation of the errors of the positioning system by interpolation. The calibration plane preferably consists of a calibration board of electrically insulating material and the calibration probe is an electrically conducting component, the center of which is placed on the calibration board straight above a point, the position of which corresponds to the command value for a calibration point entered into the control unit. The position of the center of the component in one coordinate direction in relation to the calibration point is determined by placing the component in two extreme positions located in the coordinate directions on either side of the calibration point, in which positions the component electrically connects test areas on the calibration board, said areas being connected to detector means and being electrically conducting, whereafter the detected actual value of the position of the calibration point is compared with the command value, entered into the control unit, and any difference that may occur is entered into the control unit as a correction.
Abstract:
A jetting apparatus for jetting droplets of viscous medium onto a substrate and a method of improving the performance of the jetting apparatus are provided. The jetting apparatus includes a jetting outlet through which the droplets are jetted, a flow generator for producing a flow of air past the jetting outlet for removing viscous medium residue at the jetting outlet, a receptacle for receiving viscous medium residue transported by the air flow away from the jetting outlet, and a flow path for the air flow between the jetting outlet and the flow generator, via the receptacle. A flow sensor is arranged in the flow path for measuring the air flow. An air flow signal representative of the air flow is obtained, the air flow signal is evaluated for determining at least one status of the jetting apparatus, and an indication of the status is provided.
Abstract:
A component tube holding arrangement for holding one or more component tubes and for vibratory feeding of components in a picking position in a component mounting machine, as well as a combination of such a component tube holding arrangement and a vibratory feed magazine. The arrangement comprises a support surface for supporting component tubes, a reception portion for receiving component tubes, and at least one component stop at the reception portion defining a picking position for fed components. The arrangement also comprises identification means holding information of the identity of the arrangement. The arrangement is further arranged to be releasably mountable in a component mounting machine or in a vibratory feed magazine arranged to be loaded into the component mounting machine. The component tube holding arrangement lacks component feeding means and is arranged for allowing vibratory feeding means provided in the magazine.
Abstract:
This invention relates to a positioning system for positioning a positioning unit along a longitudinal axis. The positioning system comprises a linear guide arrangement for enabling a linearly guided motion parallel to said axis, wherein the positioning unit is operatively connected to said guide arrangement. Furthermore, the positioning system comprises a motor, wherein the motor comprises a moving motor member operatively connected to said linear guide arrangement and an elongated stationary motor member extending parallel to said axis. The moving motor member is adapted to move along the stationary motor member for providing motion parallel to said axis. Moreover, the positioning system further comprises a force transmission arrangement which operatively connects said moving motor member to the positioning unit. The force transmission arrangement is arranged to provide an engagement between said positioning unit and said moving motor. The engagement is rigid in a direction parallel to said axis for instantaneous transmission of a linear force, and is resilient in directions other than said direction parallel to said axis, whereby transmission to the positioning unit of forces arising from thermal expansion of the motor is reduced or eliminated.
Abstract:
A method and a system for jetting droplets of viscous medium, such as solder paste, onto a substrate, such as an electronic circuit board. The volume of the droplets are adjusted by regulating the amount of viscous medium that is fed into a jetting nozzle for subsequent jetting of the viscous medium droplets therefrom. The exit velocity of the jetted droplets is adjusted or maintained substantially constant by regulating the velocity with which the viscous medium is impacted. Furthermore, the rate at which viscous medium is fed, for instance by a feed screw, into the nozzle is adjusted in order to regulate the feeding time required for feeding the viscous medium into the jetting nozzle, for instance in order to maintain a constant feeding time.
Abstract:
This invention relates to a device for jetting droplets of a particle filled viscous medium. The device has a nozzle, an eject mechanism connected to the nozzle, a medium feeding mechanism connected to the eject mechanism, a particle filled viscous medium container connected to the medium feeding mechanism, and a filter arranged between an outlet of the particle filled viscous medium container and the medium feeding mechanism.