公开(公告)号：US06541832B2

公开(公告)日：2003-04-01

申请号：US09766197

申请日：2001-01-19

申请人： Anthony L. Coyle

发明人： Anthony L. Coyle

IPC分类号： H01L2978

CPC分类号： B81B7/0077 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/01029

摘要： Low-cost plastic cavity-up land-grid array packages and ball-grid array packages are provided, suitable for wire-bonded chips having micromechanical components. The packages feature a thermal heat spreader and a protective lid. The package structure disclosed is flexible with regard to materials and geometrical detail, and provides solutions to specific functions such as storage space for chemical compounds within the enclosed cavity of the package.