摘要:
An electronic device includes a bottom housing, a heat-generating component placed on the bottom housing, and a thermoelectric cell module placed on the bottom housing and corresponding to the heat-generating component. The thermoelectric cell module includes a first thermoelectric sheet sensing a temperature of the heat-generating component, a second thermoelectric sheet sensing a temperature of the bottom housing, and a conductive member electrically connecting the first thermoelectric sheet and the second thermoelectric sheet.
摘要:
A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.
摘要:
An electronic device includes a bottom housing and a display panel. The bottom housing includes a bottom wall, a side wall, a support plate, and a plurality of reinforcement portions. The side wall extends from an edge of the bottom wall. The support plate extends toward a center of the bottom housing from a top end of the side wall, and defines an assembly groove. The side wall includes a plurality of side plates connecting with each other. The reinforcement portions are positioned at the corners of the bottom housing Each of the reinforcement portions is sandwiched between the bottom wall and the support plate, and connecting two adjacent side plates. A manufacturing method for an electronic device housing is also provided.
摘要:
An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.
摘要:
An electronic device includes a housing and an installation assembly. The housing defines an opening. The installation assembly includes a fixing member and a holding member. The fixing member includes a base and a fixing portion protruding from the base. The base defines an entrance corresponding to the opening. The holding member comprising a holding portion and an engaging portion formed on an end of the holding portion. The fixing portion runs through the opening, and the base abuts against an outer surface of the housing with the entrance corresponding to the first opening. The engaging portion is engaged with the fixing portion to fix the holding member to the fixing member in the housing, and the engaging portion abuts against an inner surface of the housing, such that the installation assembly is fixed the housing surrounding the first opening.
摘要:
A housing includes a bottom shell, a support frame and protection blocks. The support frame is fixed on the bottom shell. The protection blocks are fixed between the bottom shell and the support frame. The support frame includes reinforcement side walls and receiving portions. The receiving portions are defined in the connecting portions of the adjoining reinforcement side walls. The protection blocks are received in the corresponding receiving portions. The bottom shell includes a bottom plate and four side plates extending from a periphery of the bottom plate. The support frame resists the four side plates.
摘要:
An attachment frame for a display module includes a bezel attaching to the display module and at least one pair of tabs positioned on the inner sides of the bezel. Each tab includes a fixing portion connected to the bezel, a mounting portion fixed to the display module, and a connecting portion connecting the fixing portion and the mounting portion. Each tab forms a plurality of first strengthening ribs extending from the connecting portion to the mounting portion and a plurality of second strengthening ribs extending from the connecting portion to the fixing portion.
摘要:
An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second housing.
摘要:
A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.
摘要:
An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.