ELECTRONIC DEVICE WITH THERMOELECTRIC CELL MODULE
    31.
    发明申请
    ELECTRONIC DEVICE WITH THERMOELECTRIC CELL MODULE 审中-公开
    具有热电池模块的电子设备

    公开(公告)号:US20130108893A1

    公开(公告)日:2013-05-02

    申请号:US13368612

    申请日:2012-02-08

    摘要: An electronic device includes a bottom housing, a heat-generating component placed on the bottom housing, and a thermoelectric cell module placed on the bottom housing and corresponding to the heat-generating component. The thermoelectric cell module includes a first thermoelectric sheet sensing a temperature of the heat-generating component, a second thermoelectric sheet sensing a temperature of the bottom housing, and a conductive member electrically connecting the first thermoelectric sheet and the second thermoelectric sheet.

    摘要翻译: 电子装置包括底壳体,放置在底壳体上的发热部件和放置在底壳体上并对应于发热部件的热电电池模块。 热电池模块包括感测发热部件的温度的第一热电板,感测底部壳体的温度的第二热电板,以及电连接第一热电板和第二热电板的导电部件。

    BONDING STRUCTURE
    32.
    发明申请
    BONDING STRUCTURE 审中-公开
    结合结构

    公开(公告)号:US20130084431A1

    公开(公告)日:2013-04-04

    申请号:US13534213

    申请日:2012-06-27

    IPC分类号: B32B3/10 B32B37/00 B32B38/10

    摘要: A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.

    摘要翻译: 接合结构包括第一连接体,粘合剂和第二连接体。 第一连接体具有经受一个或多个凹槽的接合表面。 第二连接体通过粘合剂结合到第一连接体的接合表面。 第一连接体的接合表面限定粘合剂接收槽,粘合剂容纳在粘合剂接收槽中并与第二连接体结合; 粘合剂容纳槽限定从粘合剂容纳槽的一部分的底表面凹陷的初始粘合剂接收部分; 初始粘合剂接收部分用于接收注入的粘合剂,初始粘合剂接收部分的深度稍微大于粘合剂接收槽的深度,以允许当施加外力作用时胶水流入和膨胀到粘合剂接收槽中。

    ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF
    33.
    发明申请
    ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF 审中-公开
    电子设备外壳及其制造方法

    公开(公告)号:US20120155052A1

    公开(公告)日:2012-06-21

    申请号:US13152412

    申请日:2011-06-03

    IPC分类号: H05K7/00 B23P13/00 B23P17/00

    摘要: An electronic device includes a bottom housing and a display panel. The bottom housing includes a bottom wall, a side wall, a support plate, and a plurality of reinforcement portions. The side wall extends from an edge of the bottom wall. The support plate extends toward a center of the bottom housing from a top end of the side wall, and defines an assembly groove. The side wall includes a plurality of side plates connecting with each other. The reinforcement portions are positioned at the corners of the bottom housing Each of the reinforcement portions is sandwiched between the bottom wall and the support plate, and connecting two adjacent side plates. A manufacturing method for an electronic device housing is also provided.

    摘要翻译: 电子设备包括底壳和显示面板。 底部壳体包括底壁,侧壁,支撑板和多个加强部分。 侧壁从底壁的边缘延伸。 支撑板从侧壁的顶端朝向底壳体的中心延伸,并且限定了组装槽。 侧壁包括彼此连接的多个侧板。 加强部分位于底部壳体的角部。每个加强部分夹在底壁和支撑板之间,并连接两个相邻的侧板。 还提供了一种用于电子设备外壳的制造方法。

    ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF
    34.
    发明申请
    ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF 失效
    电子设备外壳及其制造方法

    公开(公告)号:US20120147532A1

    公开(公告)日:2012-06-14

    申请号:US12979473

    申请日:2010-12-28

    IPC分类号: H05K7/00 H05K13/00

    CPC分类号: G06F1/1626 Y10T29/49002

    摘要: An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.

    摘要翻译: 电子设备壳体包括底部壳体,支撑框架,显示面板和侧框架。 底部壳体包括基板和从基板的周边延伸的四个侧壁。 支撑框架焊接到底部壳体的侧壁。 支撑框架被容纳在底部壳体中并且由至少两个支撑板构成,每个的两个端部焊接到相邻支撑板的端部。 支撑框架在至少两个支撑板的接头处形成至少两条焊接线,并且每个焊接线对应于一个侧壁的中间部分。 显示面板位于夹在支撑框架和侧框架之间的支撑框架上。 侧框架连接到底部外壳的顶部边缘。

    ELECTRONIC DEVICE WITH CLIP CARD INSTALLATION ASSEMBLY
    35.
    发明申请
    ELECTRONIC DEVICE WITH CLIP CARD INSTALLATION ASSEMBLY 失效
    具有夹子卡安装组件的电子设备

    公开(公告)号:US20120134127A1

    公开(公告)日:2012-05-31

    申请号:US13178663

    申请日:2011-07-08

    IPC分类号: H05K7/00

    CPC分类号: H05K5/0247

    摘要: An electronic device includes a housing and an installation assembly. The housing defines an opening. The installation assembly includes a fixing member and a holding member. The fixing member includes a base and a fixing portion protruding from the base. The base defines an entrance corresponding to the opening. The holding member comprising a holding portion and an engaging portion formed on an end of the holding portion. The fixing portion runs through the opening, and the base abuts against an outer surface of the housing with the entrance corresponding to the first opening. The engaging portion is engaged with the fixing portion to fix the holding member to the fixing member in the housing, and the engaging portion abuts against an inner surface of the housing, such that the installation assembly is fixed the housing surrounding the first opening.

    摘要翻译: 电子设备包括壳体和安装组件。 壳体限定开口。 安装组件包括固定构件和保持构件。 固定构件包括基部和从基部突出的固定部。 底座限定了与开口对应的入口。 保持构件包括保持部和形成在保持部的端部上的接合部。 固定部分穿过开口,并且基座与对应于第一开口的入口抵靠外壳的外表面。 接合部与固定部接合,将保持部件固定在壳体内的固定部件上,并且卡合部抵靠壳体的内表面,使得安装组件固定围绕第一开口的壳体。

    HOUSING AND AN ELECTRONIC DEVICE USING THE SAME
    36.
    发明申请
    HOUSING AND AN ELECTRONIC DEVICE USING THE SAME 失效
    住房和使用该房屋的电子设备

    公开(公告)号:US20120069497A1

    公开(公告)日:2012-03-22

    申请号:US12947997

    申请日:2010-11-17

    IPC分类号: H05K7/00 B65D90/20

    CPC分类号: H05K5/0017 G06F1/1626

    摘要: A housing includes a bottom shell, a support frame and protection blocks. The support frame is fixed on the bottom shell. The protection blocks are fixed between the bottom shell and the support frame. The support frame includes reinforcement side walls and receiving portions. The receiving portions are defined in the connecting portions of the adjoining reinforcement side walls. The protection blocks are received in the corresponding receiving portions. The bottom shell includes a bottom plate and four side plates extending from a periphery of the bottom plate. The support frame resists the four side plates.

    摘要翻译: 壳体包括底壳,支撑框架和保护块。 支撑架固定在底壳上。 保护块固定在底壳和支撑框架之间。 支撑框架包括加强侧壁和接收部分。 接收部分限定在邻接的加强件侧壁的连接部分中。 保护块被接收在相应的接收部分中。 底壳包括底板和从底板的周边延伸的四个侧板。 支撑框架抵抗四个侧板。

    ATTACHMENT FRAME FOR A DISPLAY MODULE AND PORTABLE ELECTRONIC DEVICE USING THE SAME
    37.
    发明申请
    ATTACHMENT FRAME FOR A DISPLAY MODULE AND PORTABLE ELECTRONIC DEVICE USING THE SAME 有权
    用于显示模块和便携式电子设备的附件框架

    公开(公告)号:US20120044436A1

    公开(公告)日:2012-02-23

    申请号:US12961697

    申请日:2010-12-07

    IPC分类号: G02F1/1333

    CPC分类号: G06F1/1656

    摘要: An attachment frame for a display module includes a bezel attaching to the display module and at least one pair of tabs positioned on the inner sides of the bezel. Each tab includes a fixing portion connected to the bezel, a mounting portion fixed to the display module, and a connecting portion connecting the fixing portion and the mounting portion. Each tab forms a plurality of first strengthening ribs extending from the connecting portion to the mounting portion and a plurality of second strengthening ribs extending from the connecting portion to the fixing portion.

    摘要翻译: 用于显示模块的附接框架包括附接到显示模块的边框和位于边框内侧上的至少一对突片。 每个突片包括连接到挡板的固定部分,固定到显示模块的安装部分和连接固定部分和安装部分的连接部分。 每个翼片形成从连接部分延伸到安装部分的多个第一加强肋和从连接部分延伸到固定部分的多个第二加强肋。

    ELECTRONIC DEVICE HOUSING
    38.
    发明申请
    ELECTRONIC DEVICE HOUSING 审中-公开
    电子设备外壳

    公开(公告)号:US20120031665A1

    公开(公告)日:2012-02-09

    申请号:US12964915

    申请日:2010-12-10

    申请人: BIN DAI FA-GUANG SHI

    发明人: BIN DAI FA-GUANG SHI

    IPC分类号: H05K5/00

    CPC分类号: H05K5/0004 H04M1/026

    摘要: An electronic device housing includes a first housing and a second housing. The first housing forms a welding portion. The second housing defines a receiving groove in the periphery for receiving the welding portion. The welding portion is welded to an inner wall of the receiving groove of the second housing.

    摘要翻译: 电子设备壳体包括第一壳体和第二壳体。 第一壳体形成焊接部分。 所述第二壳体在所述周边中限定用于接收所述焊接部分的接收槽。 焊接部分焊接到第二壳体的接收槽的内壁。

    Fixing device
    39.
    发明授权
    Fixing device 有权
    固定装置

    公开(公告)号:US09004474B2

    公开(公告)日:2015-04-14

    申请号:US13246976

    申请日:2011-09-28

    IPC分类号: B25B5/06 B23Q3/00 B23Q3/06

    CPC分类号: B23Q3/06

    摘要: A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.

    摘要翻译: 用于固定工件的固定装置包括基座,将工件压向基座的第一按压块,第二按压块,第一支撑构件,第二支撑构件和侧按压块。 工件包括具有内表面和外表面的待加工的预处理部分,在加工过程中预处理部分的内表面和外表面被夹在非刚性材料之间,以避免产生切屑。

    Electronic device housing and manufacturing method thereof
    40.
    发明授权
    Electronic device housing and manufacturing method thereof 有权
    电子设备外壳及其制造方法

    公开(公告)号:US08737045B2

    公开(公告)日:2014-05-27

    申请号:US12965856

    申请日:2010-12-11

    申请人: Bin Dai Fa-Guang Shi

    发明人: Bin Dai Fa-Guang Shi

    摘要: An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.

    摘要翻译: 电子设备壳体包括底部壳体,支撑框架和塑料侧框架。 支撑框架固定在底部壳体上,以在底部壳体和塑料侧框架之间形成接收槽。 塑料侧框架通过在接收槽中注入塑料材料而一体地形成。 还提供了一种用于电子设备外壳的制造方法。