Abstract:
Methods and systems for interfacing packet and circuit telephony operations in a distributed telecommunications network. Initially, one or more digital circuit switches can be associated with the distributed telecommunications network. Thereafter, one or more network transmission elements within the distributed telecommunications network can be connected to one or more of the digital circuit switches. One or more broadband switches can then be associated with one or more of the network transmission elements, such that the broadband switches thereof interface with network transmission elements and the digital circuit switches to coordinate combined circuit and packet signaling, routing and calling processing services among varying terminals of the distributed telecommunications network.
Abstract:
Integrated circuit devices having fixed and programmable logic portions are made by combining a hardware description language representation of the fixed logic and a hardware description language representation of the programmable logic to create a single hardware description language representation of a device. This allows multiple portions of programmable logic, distributed where needed in whatever size needed, to be interspersed among the fixed logic. Because the behavior of the programmable logic, rather than of the user programming, is being represented, a programmable logic architecture is provided that lacks behaviors, such as combinational loops, that would cause compilation of the hardware description language to generate errors.
Abstract:
An electrical monitor comprising a via array and method for determining and reducing an electrically charged state of a semiconductor process wafer the method including providing a metal filled via array including a plurality of interspersed electrically isolated dummy metal portions to form a via array monitor; exposing the semiconductor process wafer including the via array monitor to an electrical charge altering process including to produce an electrically charged state over at least a portion of the semiconductor wafer; carrying out electrical measurements of the via array monitor to determine a level of the electrically charged state; and, carrying out an electrically charge neutralizing process to reduce a level of the electrically charged state to a predetermined acceptable level prior to carrying out a subsequent process.