Multi-band antenna and communications device having the same
    32.
    发明授权
    Multi-band antenna and communications device having the same 有权
    具有相同的多频带天线和通信设备

    公开(公告)号:US08165551B2

    公开(公告)日:2012-04-24

    申请号:US12883699

    申请日:2010-09-16

    IPC分类号: H04B1/06 H04K3/00

    CPC分类号: H01Q1/243 H01Q1/525 H01Q9/42

    摘要: A multi-band antenna is adapted for disposing on a substrate with a ground plane and a matching circuit disposed thereon, and includes a feed-in section, a coupling section, a grounding section, a multiple-bend arm, and a conductor section. The feed-in section is connected electrically to the matching circuit. The coupling section is connected electrically to the feed-in section and is disposed spacedly from the ground plane. The grounding section is connected electrically to the ground plane. The multiple-bend arm is connected electrically to the coupling section and the grounding section and cooperates with the grounding section to form a signal path for signals in a first frequency band. The conductor section is connected electrically to the multiple-bend arm and cooperates with a portion of the multiple-bend arm to form a signal path for signals in a second frequency band.

    摘要翻译: 多频带天线适于布置在具有接地平面和布置在其上的匹配电路的基板上,并且包括馈入部分,耦合部分,接地部分,多弯臂和导体部分。 馈电部分与匹配电路电连接。 耦合部分电连接到馈入部分并且与接地平面间隔开设置。 接地部分与地平面电连接。 多弯臂电连接到耦合部分和接地部分,并与接地部分配合,以形成第一频带信号的信号路径。 导体部分电连接到多弯臂并且与多弯臂的一部分配合以形成用于第二频带中的信号的信号路径。

    Multi-Band Antenna and Communications Device Having the Same
    33.
    发明申请
    Multi-Band Antenna and Communications Device Having the Same 有权
    多频带天线和具有相同功能的通信设备

    公开(公告)号:US20110263217A1

    公开(公告)日:2011-10-27

    申请号:US12883699

    申请日:2010-09-16

    CPC分类号: H01Q1/243 H01Q1/525 H01Q9/42

    摘要: A multi-band antenna is adapted for disposing on a substrate with a ground plane and a matching circuit disposed thereon, and includes a feed-in section, a coupling section, a grounding section, a multiple-bend arm, and a conductor section. The feed-in section is connected electrically to the matching circuit. The coupling section is connected electrically to the feed-in section and is disposed spacedly from the ground plane. The grounding section is connected electrically to the ground plane. The multiple-bend arm is connected electrically to the coupling section and the grounding section and cooperates with the grounding section to form a signal path for signals in a first frequency band. The conductor section is connected electrically to the multiple-bend arm and cooperates with a portion of the multiple-bend arm to form a signal path for signals in a second frequency band.

    摘要翻译: 多频带天线适于布置在具有接地平面和布置在其上的匹配电路的基板上,并且包括馈入部分,耦合部分,接地部分,多弯臂和导体部分。 馈电部分与匹配电路电连接。 耦合部分电连接到馈入部分并且与接地平面间隔开设置。 接地部分与地平面电连接。 多弯臂电连接到耦合部分和接地部分,并与接地部分配合,以形成第一频带信号的信号路径。 导体部分电连接到多弯臂并且与多弯臂的一部分配合以形成用于第二频带中的信号的信号路径。

    DUAL-BAND ANTENNA AND ANTENNA DEVICE HAVING THE SAME
    34.
    发明申请
    DUAL-BAND ANTENNA AND ANTENNA DEVICE HAVING THE SAME 有权
    双带天线和具有该天线的天线设备

    公开(公告)号:US20110084882A1

    公开(公告)日:2011-04-14

    申请号:US12709830

    申请日:2010-02-22

    IPC分类号: H01Q5/00 H01Q1/38

    CPC分类号: H01Q1/243 H01Q5/378

    摘要: A dual-band antenna includes first and second connecting sections coupled to a ground unit, and first, second, and third radiator sections. The first connecting section extends in a direction from the ground unit toward an inner wall face of a housing of an electronic device. The first radiator section is connected to the first connecting section and is disposed to extend along the inner wall face. A feed-in section extends between the second connecting section and the inner wall face, and has a portion extending parallel to the first radiator section. The second radiator section is connected to the feed-in section and is disposed to extend along the inner wall face. The third radiator section is connected to the second radiator section, extends between the second radiator section and the feed-in section, and has a portion extending parallel to the second radiator section.

    摘要翻译: 双频天线包括耦合到接地单元的第一和第二连接部分以及第一,第二和第三散热器部分。 第一连接部分在从地面单元朝向电子设备的壳体的内壁面的方向上延伸。 第一散热器部分连接到第一连接部分并且设置成沿着内壁面延伸。 进料部分在第二连接部分和内壁面之间延伸,并且具有平行于第一散热器部分延伸的部分。 第二散热器部分连接到馈入部分并且设置成沿着内壁面延伸。 第三散热器部分连接到第二散热器部分,在第二散热器部分和馈入部分之间延伸,并且具有平行于第二散热器部分延伸的部分。

    Dual-band dual-feed antenna
    35.
    发明申请
    Dual-band dual-feed antenna 审中-公开
    双频双馈天线

    公开(公告)号:US20090213011A1

    公开(公告)日:2009-08-27

    申请号:US12231711

    申请日:2008-09-04

    IPC分类号: H01Q1/38

    摘要: An antenna includes an open loop conductor, a pair of feeding points, and a conductive arm. The open loop conductor includes a loop element that has opposite first and second ends, and first and second feeding elements, each of which is connected to a respective one of first and second ends of the loop element. Each of the feeding points is provided on a respective one of the first and second feeding elements. The conductive arm extends from the open loop conductor.

    摘要翻译: 天线包括开环导体,一对馈电点和导电臂。 开环导体包括具有相对的第一和第二端的环形元件,以及第一和第二馈电元件,每个馈送元件连接到环形元件的第一端和第二端中的相应一个。 每个馈送点设置在第一和第二馈送元件的相应的一个上。 导电臂从开环导体延伸。

    Capacitively loaded antenna
    36.
    发明申请
    Capacitively loaded antenna 审中-公开
    电容式天线

    公开(公告)号:US20090179802A1

    公开(公告)日:2009-07-16

    申请号:US12231625

    申请日:2008-09-03

    IPC分类号: H01Q1/38

    摘要: An antenna includes a dielectric substrate, a radiating element, feeding and grounding elements, and a screw. The radiating element is formed on the dielectric substrate. Each of the feeding and grounding elements is formed on the dielectric substrate and is connected electrically to the radiating element. The screw extends through the dielectric substrate and is connected electrically to the radiating element.

    摘要翻译: 天线包括介电基片,辐射元件,馈电和接地元件以及螺钉。 辐射元件形成在电介质基片上。 馈电和接地元件中的每一个形成在电介质基板上并且电连接到辐射元件。 螺钉延伸穿过电介质基片并与辐射元件电连接。

    METHOD OF MANUFACTURING SPACER
    38.
    发明申请
    METHOD OF MANUFACTURING SPACER 有权
    制造间隔的方法

    公开(公告)号:US20060252190A1

    公开(公告)日:2006-11-09

    申请号:US10908240

    申请日:2005-05-04

    IPC分类号: H01L21/8234

    摘要: A method of manufacturing a spacer for a substrate having a gate structure formed thereon. The method comprises steps of forming a first oxide layer over the substrate and forming a nitride layer on the first oxide layer. A first asymmetric etching process is performed to remove a portion of the nitride layer until a portion of a top surface of the first oxide layer is exposed. A second asymmetric etching process is performed to remove a portion of the first oxide layer by using the remaining nitride layer as a mask until about 50% to 90% portion of the first oxide layer is removed. A quick wet etching process is performed to remove a portion of the remaining first oxide located on the top of the gate structure and on the substrate.

    摘要翻译: 一种制造其上形成有栅极结构的衬底的间隔物的方法。 该方法包括在衬底上形成第一氧化物层并在第一氧化物层上形成氮化物层的步骤。 执行第一非对称蚀刻工艺以去除氮化物层的一部分,直到暴露第一​​氧化物层的顶表面的一部分。 通过使用剩余的氮化物层作为掩模来执行第二非对称蚀刻工艺以去除第一氧化物层的一部分,直到除去第一氧化物层的约50%至90%的部分。 执行快速湿蚀刻工艺以去除位于栅极结构的顶部上和衬底上的剩余第一氧化物的一部分。

    Optical semiconductor component
    39.
    发明申请
    Optical semiconductor component 有权
    光半导体元件

    公开(公告)号:US20050224815A1

    公开(公告)日:2005-10-13

    申请号:US10821967

    申请日:2004-04-12

    申请人: Hung-Yuan Su Jen Weng

    发明人: Hung-Yuan Su Jen Weng

    摘要: An optical semiconductor component has multiple conducting wire holders, multiple chip carriers secured, multiple semiconductor chips, a first curved surface made of the conducting wire holders, the semiconductor chips being placed at its focus, multiple connecting components made of the conducting wire holders, and a second curved surface surrounded by a package body, the semiconductor chips being placed at its focus. The chip carriers are independent components and have a multi-layer structure. The middle layer is an insulator used to separate the chip from the conducting wire holder electrically or thermally. Hence, when connected with a metal radiator, the chip carrier does not cause electric leakage. Further, the connecting components of the present invention are mutually independent, which can provide multiple photodiodes with different driving voltages to connect with each other in series or parallel.

    摘要翻译: 光半导体元件具有多个导线保持器,多个芯片载体固定,多个半导体芯片,由导线保持器制成的第一弯曲表面,半导体芯片放置在其焦点处,由导线保持器制成的多个连接部件和 由封装体包围的第二弯曲表面,半导体芯片被放置在其焦点处。 芯片载体是独立的部件,具有多层结构。 中间层是用于将芯片与导线保持器电或热分离的绝缘体。 因此,当与金属散热器连接时,芯片载体不会导致漏电。 此外,本发明的连接部件是相互独立的,其可以提供具有不同驱动电压的多个光电二极管,以串联或并联连接。

    Method and apparatus for wafer analysis
    40.
    发明授权
    Method and apparatus for wafer analysis 有权
    晶圆分析方法及装置

    公开(公告)号:US06785617B2

    公开(公告)日:2004-08-31

    申请号:US09905416

    申请日:2001-07-13

    申请人: Hung-Jen Weng

    发明人: Hung-Jen Weng

    IPC分类号: G01B528

    CPC分类号: H01L22/20 G01B5/28

    摘要: The present invention discloses method and apparatus for wafer analysis. First, a plurality of specific distribution maps, which respectively refer to a defect pattern distribution in a pattern group, is defined. Next, a plurality of distribution features is defined so that each specific distribution map correlates to one of the distribution features. Then, each pattern group on the wafer is compared to each specific distribution map in order to relate each pattern group to at least one of the specific distribution maps, and relate each pattern group on the wafer indirectly to at least one of the distribution features while allocating each distribution feature indirectly related to each pattern group with a respective relative value. Finally, the relative values of each distribution feature are totaled on the wafer respectively to obtain total values of the distribution features. With the method and apparatus disclosed in the present invention, it is easier to detect defective patterns on the wafer systematically and effectively.

    摘要翻译: 本发明公开了用于晶片分析的方法和装置。 首先,定义了分别涉及模式组中的缺陷模式分布的多个特定分布图。 接下来,定义多个分布特征,使得每个特定分布图与分布特征之一相关。 然后,将晶片上的每个图案组与每个特定分布图进行比较,以将每个图案组与特定分布图中的至少一个相关联,并将晶片上的每个图案组间接地与分布特征中的至少一个相关联, 分配与每个模式组间接相关的每个分布特征具有相应的相对值。 最后,分别在晶圆上分别分配各分布特征的相对值,得到分布特征的总值。 利用本发明公开的方法和装置,系统地且有效地检测晶片上的有缺陷的图案更容易。