公开(公告)号：USD768214S1

公开(公告)日：2016-10-04

申请号：US29534617

申请日：2015-07-30

Applicant: STI Co., Ltd.

Designer： Yuhho Cho ,  Chan Il Jung ,  Jung Jin Mun ,  Su Kon Han ,  Jinoh Hong

公开(公告)号：US11794461B2

公开(公告)日：2023-10-24

申请号：US17675520

申请日：2022-02-18

Applicant: STI CO., LTD.

Inventor： Eun Su Jeon ,  Kyu Yong Han ,  Sang Pil Park ,  Jae Hwan Kim

IPC: B32B41/00 ,  B32B37/02 ,  B32B38/18 ,  B32B39/00

CPC classification number: B32B37/02 ,  B32B38/18 ,  B32B39/00 ,  B32B41/00 ,  B32B2309/70

Abstract: Disclosed is a lamination system. A lamination system, which bonds a panel and a bonding target panel to from a panel assembly, according to one embodiment of the present invention may include a transfer which moves along a transfer shuttle and supports any one among the panel, the bonding target panel, and the panel assembly, a bonding chamber which is provided parallel to the transfer shuttle and bonds the panel and the bonding target panel, and a first robot which transfers any one among the panel, the bonding target panel, and the panel assembly between the transfer and the bonding chamber.

公开(公告)号：US09964690B2

公开(公告)日：2018-05-08

申请号：US15064063

申请日：2016-03-08

Applicant: STI Co., Ltd.

Inventor： Myung Dong Jo ,  Kwang Hwan Kim

IPC: F21V8/00 ,  G02F1/1333

CPC classification number: G02B6/0085 ,  G02B6/0073 ,  G02F1/133308 ,  G02F1/133385 ,  G02F2001/133314

Abstract: A heat dissipating case for a liquid crystal display panel includes: a case provided with a space part therein and provided with a liquid crystal panel mounted to an upper surface of the case; a heat sink chassis mounting hole formed through a lower surface of the case, wherein a heat sink chassis is fitted into the heat sink chassis mounting hole; a base chassis provided on a lower part of the space part, the base chassis being provided with: an LED module attaching member mounted thereto; and the heat sink chassis mounted to a lower surface thereof; and an upper protruding part formed by protruding from an upper surface of the base chassis.

公开(公告)号：US20170168226A1

公开(公告)日：2017-06-15

申请号：US15064063

申请日：2016-03-08

Applicant: STI Co., Ltd.

Inventor： Myung Dong JO ,  Kwang Hwan Kim

IPC: F21V8/00 ,  G02F1/1333

CPC classification number: G02B6/0085 ,  G02B6/0073 ,  G02F1/133308 ,  G02F1/133385 ,  G02F2001/133314

Abstract: A heat dissipating case for a liquid crystal display panel includes: a case provided with a space part therein and provided with a liquid crystal panel mounted to an upper surface of the case; a heat sink chassis mounting hole formed through a lower surface of the case, wherein a heat sink chassis is fitted into the heat sink chassis mounting hole; a base chassis provided on a lower part of the space part, the base chassis being provided with: an LED module attaching member mounted thereto; and the heat sink chassis mounted to a lower surface thereof; and an upper protruding part formed by protruding from an upper surface of the base chassis.