公开(公告)号：US11071201B2

公开(公告)日：2021-07-20

申请号：US16764311

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： James Dunlop

IPC: H05K1/11 ,  H01R12/53 ,  H05K1/02

Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

公开(公告)号：USD924170S1

公开(公告)日：2021-07-06

申请号：US29733196

申请日：2020-04-30

Applicant: Samtec, Inc.

Designer： Jean Karlo Williams Barnett ,  Jignesh H. Shah ,  Eric Zbinden

公开(公告)号：US20210045244A1

公开(公告)日：2021-02-11

申请号：US16965135

申请日：2019-03-15

Applicant: Samtec, Inc.

Inventor： Norman S. MCMORROW ,  Keith R. GUETIG ,  Jignesh H. SHAH

IPC: H05K1/14 ,  H05K1/11

Abstract: A printed circuit board (PCB) assembly includes a first PCB, a high-speed PCB, and a high-speed interconnect electrically and physically connecting the first PCB and the high-speed PCB.

公开(公告)号：US20210013653A1

公开(公告)日：2021-01-14

申请号：US16977201

申请日：2019-05-08

Applicant: Samtec, Inc.

Inventor： Yasuo SASAKI ,  Kevin R. MEREDITH

IPC: H01R13/03 ,  H05K7/20

Abstract: A connector includes a thermal metamaterial. The thermal metamaterial provides heat flow paths from inside of the connector to outside of the connector. In addition, an electrical connector includes an electrically insulating housing, an electrically conductive contact included in the electrically insulating housing, and a metamaterial thermally connected to one of the electrically insulating housing or the electrically conductive contact. The metamaterial thermally cools the electrical connector.

公开(公告)号：US20200350731A1

公开(公告)日：2020-11-05

申请号：US16758579

申请日：2018-10-24

Applicant: SAMTEC, INC.

Inventor： Jonathan E. BUCK ,  John MONGOLD ,  Madhumitha RENGARAJAN

IPC: H01R13/6471 ,  H01R12/72 ,  H01R13/6474 ,  H01R43/20

Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.

公开(公告)号：USD888670S1

公开(公告)日：2020-06-30

申请号：US35001522

申请日：2018-04-20

Applicant: SAMTEC, INC.

Designer： Chadrick P. Faith ,  Liam P. Parkes

公开(公告)号：US20200185862A1

公开(公告)日：2020-06-11

申请号：US16789520

申请日：2020-02-13

Applicant: Samtec, Inc.

Inventor： John A. MONGOLD ,  Jonathan E. BUCK

IPC: H01R13/6477 ,  H03H7/38 ,  H01R13/41 ,  H01R12/72 ,  H01R13/646 ,  H01R13/514 ,  H01R13/631

Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.

公开(公告)号：USD879724S1

公开(公告)日：2020-03-31

申请号：US29647260

申请日：2018-05-11

Applicant: Samtec, Inc.

Designer： Jonathan E. Buck ,  John A. Mongold

公开(公告)号：US10534145B2

公开(公告)日：2020-01-14

申请号：US16135254

申请日：2018-09-19

Applicant: Samtec, Inc.

Inventor： Eric J. Zbinden ,  Thomas A. Hall, III

IPC: G02B6/42 ,  G02B6/38

Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

公开(公告)号：US20190305482A1

公开(公告)日：2019-10-03

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/627 ,  G02B6/42

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.