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    WAVELENGTH DIVISION MULTIPLEXER
    32.
    发明申请
    WAVELENGTH DIVISION MULTIPLEXER 有权

    公开(公告)号：US20220308296A1

    公开(公告)日：2022-09-29

    申请号：US17833299

    申请日：2022-06-06

    Applicant: Acacia Communications, Inc.

    Inventor： Long Chen ,  Christopher Doerr ,  Li Chen

    IPC: G02B6/42 ,  G02B6/293 ,  G02B6/12

    Abstract: An integrated wavelength division multiplexer is described. The integrated wavelength division multiplexer may include a first waveguide core defining a first propagation axis and configured to guide light of a first wavelength and light of a second wavelength, and a second waveguide core defining a second propagation axis and configured to guide the light of the second wavelength. A first portion of the second propagation axis for which the first waveguide core and second waveguide core may be overlapping is oriented at a non-zero angle relative to the first propagation axis. The first waveguide core and second waveguide core may be configured relative to each other to adiabatically couple the light of the second wavelength between the first and second waveguide cores.

    Techniques to combine two integrated photonic substrates
    35.
    发明授权
    Techniques to combine two integrated photonic substrates 有权

    公开(公告)号：US11409059B1

    公开(公告)日：2022-08-09

    申请号：US17080742

    申请日：2020-10-26

    Applicant: Acacia Communications, Inc.

    Inventor： Diedrik Vermeulen ,  Christopher Doerr

    IPC: G02B6/42 ,  G02B6/125 ,  G02B6/12

    Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

    Cantilevers with one- or two-dimensional actuation for on-chip active waveguide coupling alignment
    37.
    发明授权
    Cantilevers with one- or two-dimensional actuation for on-chip active waveguide coupling alignment 有权

    公开(公告)号：US10895690B1

    公开(公告)日：2021-01-19

    申请号：US16420655

    申请日：2019-05-23

    Applicant: Acacia Communications, Inc.

    Inventor： Christopher Doerr ,  Li Chen ,  Long Chen

    IPC: G02B6/12 ,  G02B6/35 ,  G02B6/42 ,  G02B6/26

    Abstract: Photonic integrated circuits including controllable cantilevers are described. Such photonic integrated circuits may be used in connection with other optical devices, in which light is transferred between the photonic integrated circuit and one of these optical device. The photonic integrated circuit may comprise an optical waveguide having an end disposed proximate to a facet of the cantilever. The orientation of the cantilever may be actively controlled in one or two dimensions, thus adjusting the orientation of the optical waveguide. Actuation of the cantilever may be performed, for example, thermally and/or electrostatically. Orientation of the cantilever may be performed in such a way to align the optical waveguide with an optical device.

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