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公开(公告)号:US12051883B2
公开(公告)日:2024-07-30
申请号:US17787976
申请日:2020-12-23
CPC分类号: H01S5/0085 , G02F1/0151 , G02F1/025 , H01S5/026 , H01S5/0265 , H01S5/11 , H01S5/185 , G02F2201/12 , H01S5/18
摘要: This disclosure relates to a spatial light modulator, etc., the spatial light modulator being capable of dynamically controlling the phase distribution of light, and provided with a structure having a smaller pixel arrangement period and suitable for high-speed operation. The spatial light modulator includes a substrate. The substrate has a front surface, a back surface, and through-holes arranged one-dimensionally or two-dimensionally and penetrating between the front surface and the back surface. The spatial light modulator further includes layered structures each covering the inner walls of the through-holes. Each layered structure includes a first electroconductive layer on the inner wall, a dielectric layer on the first electroconductive layer and having optical transparency, and a second electroconductive layer on the dielectric layer and having optical transparency. At least one of the first and second electroconductive layers is electrically isolated for each group including one or more through-holes.
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公开(公告)号:US20240222929A1
公开(公告)日:2024-07-04
申请号:US18496613
申请日:2023-10-27
发明人: Young-Tak HAN , Seok Jun YUN , Seo Young LEE , Sang Ho PARK , Yongsoon BAEK , Jang Uk SHIN , Dong-Hun LEE
IPC分类号: H01S5/0233 , H01S5/02315 , H01S5/026
CPC分类号: H01S5/0233 , H01S5/02315 , H01S5/0265 , H01S5/12
摘要: Provided is an optical communication device according to an embodiment of the inventive including a carrier substrate, a printed circuit board provided on one side of the carrier substrate in a first direction, electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate, an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board, and capacitors, which are provided on the interposer and each of which is shorter than each of the electro-absorption modulator-integrated laser chips and is thicker than the electro-absorption modulator-integrated laser chip.
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公开(公告)号:US11984700B2
公开(公告)日:2024-05-14
申请号:US17960679
申请日:2022-10-05
发明人: Yifei Zhang , Thomas Hamish Barter
CPC分类号: H01S5/0265 , G02B27/0172 , G02F1/17 , G09G3/02 , H01S5/0085 , H01S5/0427 , G02B6/0031 , G02B2027/0112 , G02B2027/0118 , G02B2027/014 , G02B2027/0178 , G02F2201/06 , G02F2203/48 , G09G2310/06 , G09G2320/02 , G09G2320/041 , G09G2330/021
摘要: A display system includes an integrated laser and modulator device and a display assembly. The integrated laser and modulator device includes a laser component configured to facilitate light emission responsive to applied current and a modulator component configured to selectively modulate light responsive to applied signal. The modulator component is integrally coupled to the laser component via a bridging structure that intervenes between the laser component and the modulator component. At least a portion of the bridging structure facilitates power reflectivity into a laser cavity of the laser component. The bridging structure facilitates transmission of light emitted by the laser component into the modulator component for modulation by the modulator component to provide modulated light. The display assembly is configured to direct the modulated light provided by the integrated laser and modulator device to illuminate pixels to form an image.
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公开(公告)号:US11901698B2
公开(公告)日:2024-02-13
申请号:US16957654
申请日:2018-12-21
发明人: Selina Farwell , Robert Griffin , Samuel Davies
IPC分类号: H01S5/00 , H01S5/062 , H01S5/026 , H01S5/042 , H01S5/0625 , H01S5/068 , H01S5/12 , G02F1/025
CPC分类号: H01S5/06246 , H01S5/0261 , H01S5/042 , H01S5/062 , H01S5/0625 , H01S5/06258 , H01S5/06817 , H01S5/124 , G02F1/025 , H01S5/026 , H01S5/0265 , H01S5/12 , H01S2301/02
摘要: A method of operating an optoelectronic device comprising an optical waveguide section, the optical waveguide section comprising a semiconductor core, the method comprising the steps of determining (401) a range for a negative bias voltage for the waveguide section for which an optical loss of the core is lower than an optical loss at zero bias for an operating wavelength range of the device, selecting (402) a bias voltage within the range and applying (403) the selected bias voltage to the waveguide section.
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公开(公告)号:US20240030686A1
公开(公告)日:2024-01-25
申请号:US18255941
申请日:2021-12-09
发明人: Lars Nähle , Christoph Eichler
CPC分类号: H01S5/4031 , H01S5/4087 , H01S5/0265 , H01S5/101 , H01S5/1021 , H01S5/22
摘要: In an embodiment a light-emitting semiconductor chip includes a semiconductor body having a plurality of emitter units, wherein each emitter unit has an active region which is arranged in a resonator having an outcoupling side and a rear side and which is configured to emit light at the outcoupling side along a radiation emission direction, wherein, in each emitter unit, the active region is completely penetrated by at least one recess in the semiconductor body, wherein, in each emitter unit, in a region of the active region the recess has a recess width measured along the radiation emission direction, and wherein recess widths of the emitter units are at least partially different.
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公开(公告)号:US11849265B2
公开(公告)日:2023-12-19
申请号:US17300096
申请日:2021-03-05
申请人: Mohammad A. Mazed
发明人: Mohammad A. Mazed
IPC分类号: H04B10/27 , H04Q11/00 , H04B10/272 , H04J14/02 , H01S3/101 , H04B10/516 , H01S5/026 , H01S5/0625
CPC分类号: H04Q11/0067 , H01S3/101 , H04B10/272 , H04B10/5161 , H04J14/0223 , H04J14/0256 , H04J14/0282 , H04Q11/0005 , H01S5/0265 , H01S5/06256 , H01S5/06258 , H04Q2011/0016 , H04Q2011/0032 , H04Q2011/0064
摘要: An intelligent subsystem coupled with a Super System on Chip (SSoC)/microprocessor, a radio transceiver, a voice processing module/voice processing algorithm, a display component, one or more camera sensors/computational cameras for three-dimensional (3-D) sensing of the surroundings, a near-field communication device, a biometric sensor, an artificial eye, a biological lab-on-chip (LOC)/DNA sequencing biomodule, an intelligent learning algorithm and an algorithm for three-dimensional (3-D) perception is disclosed. The Super System on Chip (SSoC) includes memristors. The intelligent subsystem can respond to a user's interests and/or preferences, provide telepresence and perceive the surroundings. Furthermore, the intelligent subsystem is sensor-aware or context-aware.
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公开(公告)号:US11838702B2
公开(公告)日:2023-12-05
申请号:US17300098
申请日:2021-03-05
申请人: Mohammad A. Mazed
发明人: Mohammad A. Mazed
IPC分类号: H04B10/27 , H04Q11/00 , H04B10/272 , H04J14/02 , H01S3/101 , H04B10/516 , H01S5/026 , H01S5/0625
CPC分类号: H04Q11/0067 , H01S3/101 , H04B10/272 , H04B10/5161 , H04J14/0223 , H04J14/0256 , H04J14/0282 , H04Q11/0005 , H01S5/0265 , H01S5/06256 , H01S5/06258 , H04Q2011/0016 , H04Q2011/0032 , H04Q2011/0064
摘要: An intelligent subsystem comprising a microprocessor, a foldable/stretchable display, radio modules/transceivers, a first set of computer implementable instructions for intelligent learning (that can include (i) artificial intelligence or an artificial neural network and (ii) fuzzy logic) and a second set of computer implementable instructions in natural language is disclosed. The intelligent subsystem can (i) respond to a user's interests and/or preferences and (ii) provide a peer-to-peer transaction. Furthermore, the intelligent subsystem can be sensor-aware or context-aware.
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公开(公告)号:US20230387666A1
公开(公告)日:2023-11-30
申请号:US18321086
申请日:2023-05-22
申请人: Xuan Sun
发明人: Xuan Sun
CPC分类号: H01S5/50 , H01S5/141 , H01S5/0657 , H01S5/1071 , H01S5/0265 , G02B6/12004 , G02B2006/12121 , G02B2006/1204
摘要: A fully integrated photonic coherent microwave generator includes an external laser cavity on a suitable material waveguide platform (e.g., LiNbO3) operationally integrated with a III-V gain element. Operational components include a tunable high-Q resonator (e.g., LiNbO3 microresonator) and one or more end mirrors to form an integrated semiconductor external-cavity laser. Operationally coupled electrical components enable coherent microwave and phase-locked laser comb outputs as follows. An optical detector converts the beating of generated laser-comb modes into microwaves with a fundamental frequency equal to the free-spectral range fR of the microresonator. The external laser cavity enables high-speed electro-optic modulation of laser modes directly inside the laser cavity. Phase locking of the lasing modes is accomplished via electro-optic modulation and electro-optic comb generation directly inside the laser cavity. Highly coherent microwaves are generated via phase-locked comb-like lasing modes.
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公开(公告)号:US11818520B2
公开(公告)日:2023-11-14
申请号:US17300100
申请日:2021-03-05
申请人: Mohammad A. Mazed
发明人: Mohammad A. Mazed
IPC分类号: H04B10/27 , H04Q11/00 , H04B10/272 , H04J14/02 , H01S3/101 , H04B10/516 , H01S5/026 , H01S5/0625
CPC分类号: H04Q11/0067 , H01S3/101 , H04B10/272 , H04B10/5161 , H04J14/0223 , H04J14/0256 , H04J14/0282 , H04Q11/0005 , H01S5/0265 , H01S5/06256 , H01S5/06258 , H04Q2011/0016 , H04Q2011/0032 , H04Q2011/0064
摘要: An intelligent subsystem comprising a system-on-a-chip (that can include a microprocessor and a graphic/graphical processor), a foldable/stretchable display, radio modules/transceivers, a first set of computer implementable instructions for intelligent learning (that can include (i) artificial intelligence or an artificial neural network and (ii) fuzzy logic) and a second set of computer implementable instructions in natural language is disclosed. The intelligent subsystem can (i) respond to a user's interests and/or preferences and (ii) provide a peer-to-peer transaction. Furthermore, the intelligent subsystem can be sensor-aware or context-aware.
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公开(公告)号:US11764543B2
公开(公告)日:2023-09-19
申请号:US16989907
申请日:2020-08-11
CPC分类号: H01S5/18302 , G02F1/212 , H01S5/0071 , H01S5/0085 , H01S5/0265 , H01S5/02255 , H01S5/34313 , G02F2203/10 , H01S5/18308 , H01S5/18341 , H01S5/3095
摘要: An optoelectronic device includes a substrate and first thin film layers disposed on the substrate and patterned to define a vertical-cavity surface-emitting laser (VCSEL), which is configured to emit optical radiation along an optical axis perpendicular to the substrate. Second thin film layers are disposed over the first thin film layers and are patterned to define an optical modulator in which the optical radiation propagates in a direction parallel to the substrate, and an optical coupler configured to couple the optical radiation from the VCSEL into the optical modulator.
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