公开(公告)号：USD906838S1

公开(公告)日：2021-01-05

申请号：US29686209

申请日：2019-04-02

Applicant: Apple Inc.

Designer： Megan J. Burmeister ,  Vijay Karthik Koneru ,  Christopher Wiita ,  Duy P. Le ,  Hamish Thain ,  Bart Jansen ,  Michael Rodriguez ,  Christopher Kuh ,  Guillaume Raoult ,  Elvin Chu ,  Martin Gschwandtl ,  Robert Brunner

公开(公告)号：US20200153088A1

公开(公告)日：2020-05-14

申请号：US16740753

申请日：2020-01-13

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: H01Q1/24 ,  G06F1/16 ,  B29C45/14 ,  H04M1/02

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

公开(公告)号：US20200100011A1

公开(公告)日：2020-03-26

申请号：US16272982

申请日：2019-02-11

Applicant: APPLE INC.

Inventor： John R. Bruss ,  Duy P. Le ,  Sean S. Corbin ,  Robert A. Boyd

IPC: H04R1/10

Abstract: An earbud tip for an in-ear headphone can include an outer body; an inner tube extending at least partially within the outer body, the tube having opposing first and second ends and first and second openings at the opposing first and second ends, respectively, the first opening configured to emit audio signals provided by a speaker of an in-ear headphone into a user's ear canal during operation of the in-ear headphone and when the earbud tip seals the user's ear canal and the second opening configured to be removably coupled to a portion of the in-ear headphone; and one or more channels extending from an outer periphery of the earbud tip to the inner tube.

公开(公告)号：US20190036201A1

公开(公告)日：2019-01-31

申请号：US16147703

申请日：2018-09-29

Applicant: Apple Inc.

Inventor： Matthew D. Hill ,  Michael B. Wittenberg ,  Shane Bustle ,  Duy P. Le

IPC: H01Q1/24 ,  H04M1/02 ,  G06F1/16 ,  B29C45/14 ,  B29C37/00 ,  B29L31/34

CPC classification number: H01Q1/243 ,  B29C37/0082 ,  B29C45/14311 ,  B29C45/14467 ,  B29L2031/34 ,  B29L2031/3437 ,  G06F1/1626 ,  G06F1/1633 ,  G06F1/1656 ,  G06F2200/1633 ,  H04M1/0249 ,  H04M1/0283

Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

公开(公告)号：US20150315715A1

公开(公告)日：2015-11-05

申请号：US14585021

申请日：2014-12-29

Applicant: Apple Inc.

Inventor： Lucy Elizabeth Browning ,  Masashige Tatebe ,  Shi Hua Zhang ,  Michael W. Barnstead ,  Richard M. Bretherton ,  Takahiro Oshima ,  Sean A. Backs ,  Duy P. Le ,  Andrew J. Meschke ,  Thomas Johannessen

IPC: C25D5/02 ,  H05K5/04

CPC classification number: C25D5/022 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/32 ,  C23C18/38 ,  C25D5/16 ,  C25D5/48 ,  C25D11/022 ,  C25D11/16 ,  C25D11/24 ,  C25D11/243 ,  C25D11/26 ,  H05K5/0243 ,  H05K5/04 ,  Y10T428/24033 ,  Y10T428/31678

Abstract: Manufacturing methods related to anodizing of metal parts are described. In particular, pre-anodizing and post-anodizing methods for forming a consistent and defect-free interface between metal and non-metal sections of a part are described. Methods involve preventing residues from various manufacturing processes from entering a gap or space at the interface between the metal and non-metal section of the part and that can disrupt subsequent anodizing and anodic film dyeing processes. In particular embodiments, methods involve forming a barrier layer or filler layer between the metal and non-metal sections. Portions of the barrier layer or filler layer can be removed prior to anodizing. The resultant part has a well-defined and uniform space between the metal and non-metal sections that is free from visual defects.

Abstract translation: 描述与金属部件的阳极氧化相关的制造方法。 特别地，描述了用于在零件的金属和非金属部分之间形成一致且无缺陷的界面的预阳极氧化和后阳极氧化方法。 方法包括防止各种制造过程的残留物进入部件的金属和非金属部分之间的界面处的间隙或空间，并且可能破坏随后的阳极氧化和阳极膜染色过程。 在具体实施方案中，方法包括在金属和非金属部分之间形成阻挡层或填料层。 在阳极氧化之前可以去除阻挡层或填料层的一部分。 所得部件在没有视觉缺陷的金属和非金属部分之间具有明确且均匀的空间。

公开(公告)号：USD1057420S1

公开(公告)日：2025-01-14

申请号：US29910086

申请日：2023-08-15

Applicant: Apple Inc.

Designer： Christina J. Smiechowski ,  Duy P. Le ,  Jeffrey Scott Croyle ,  Matthew Phillip Casebolt ,  Matthew Vincent Costello ,  Christopher Wiita ,  Elvin Chu ,  Guillaume Raoult ,  Zu-Ning Chen ,  Christopher Kuh ,  Robert Brunner

公开(公告)号：USD1047978S1

公开(公告)日：2024-10-22

申请号：US29880712

申请日：2023-07-26

Applicant: Apple Inc.

Designer： Ryan Ott ,  Robert Boyd ,  Duy P. Le ,  Jeffrey Scott Croyle ,  Matthew Phillip Casebolt ,  Matthew Vincent Costello ,  James Swasey ,  Guillaume Raoult ,  Christopher Kuh ,  Robert Brunner

Abstract: FIG. 1 is a top perspective view of an earphone showing the claimed design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top view thereof.
The broken lines in the figures show portions of the earphone that form no part of the claimed design.

公开(公告)号：USD1034541S1

公开(公告)日：2024-07-09

申请号：US29886779

申请日：2023-03-13

Applicant: Apple Inc.

Designer： Vijay Karthik Koneru ,  Christopher Wiita ,  Duy P. Le ,  Robert Boyd ,  Sean Stewart Corbin ,  Guillaume Raoult ,  Elvin Chu ,  Martin Gschwandtl ,  Christopher Kuh ,  Robert Brunner

Abstract: FIG. 1 is a top front perspective view of a case with earphones showing the claimed design;
FIG. 2 is a bottom rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the case and earphones that form no part of the claimed design.

公开(公告)号：USD995490S1

公开(公告)日：2023-08-15

申请号：US29850597

申请日：2022-08-22

Applicant: Apple Inc.

Designer： Ryan Ott ,  Robert Boyd ,  Duy P. Le ,  Jeffrey Scott Croyle ,  Matthew Phillip Casebolt ,  Matthew Vincent Costello ,  James Swasey ,  Guillaume Raoult ,  Christopher Kuh ,  Robert Brunner

Abstract: FIG. 1 is a top perspective view of an earphone showing the claimed design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a top view thereof.
The broken lines in the figures show portions of the earphone that form no part of the claimed design.

公开(公告)号：USD990167S1

公开(公告)日：2023-06-27

申请号：US29846199

申请日：2022-07-14

Applicant: Apple Inc.

Designer： Kjell Ferdinand Ekman ,  Christina J. Smiechowski ,  Duy P. Le ,  Jeffrey Scott Croyle ,  Matthew Phillip Casebolt ,  Matthew Vincent Costello ,  Ryan Ott ,  Robert Boyd ,  James Swasey ,  Guillaume Raoult ,  Christopher Kuh ,  Robert Brunner

Abstract: FIG. 1 is a top front perspective view of a case with earphones showing the claimed design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.