Magnetic field sensor with magnetoresistance elements and conductive-trace magnetic source
    33.
    发明授权
    Magnetic field sensor with magnetoresistance elements and conductive-trace magnetic source 有权
    具有磁阻元件和导电迹线磁源的磁场传感器

    公开(公告)号:US09322887B1

    公开(公告)日:2016-04-26

    申请号:US14556523

    申请日:2014-12-01

    Abstract: In an embodiment, a magnetic field sensor comprises a substrate and a first magnetoresistive element supported by the substrate. The magnetic field sensor also includes a second magnetoresistive element supported by the substrate and coupled in series with the first magnetoresistive element to form a voltage node between the first and second magnetoresistive elements, and at which an output voltage is provided that changes in response to an external magnetic field. The magnetic field sensor also includes a magnetic source that produces a local magnetic field having a strength sufficient to bias the first magnetoresistive element to a resistive value that is substantially resistant to changing in response to the external magnetic field. In embodiments, additional magnetoresistive elements are included to form an H-bridge circuit.

    Abstract translation: 在一个实施例中,磁场传感器包括衬底和由衬底支撑的第一磁阻元件。 磁场传感器还包括由衬底支撑并与第一磁阻元件串联耦合的第二磁阻元件,以在第一和第二磁阻元件之间形成电压节点,并且提供输出电压,其响应于 外部磁场。 磁场传感器还包括产生具有足以将第一磁阻元件偏置到基本上抵抗外部磁场变化的电阻值的强度的局部磁场的磁源。 在实施例中,包括附加的磁阻元件以形成H桥电路。

    PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER

    公开(公告)号:US20250140673A1

    公开(公告)日:2025-05-01

    申请号:US18495060

    申请日:2023-10-26

    Abstract: According to one aspect of the present disclosure, a voltage isolated integrated circuit (IC) package configuration includes a first package comprising a transformer and a mold material enclosing the transformer to form a first package body, wherein the first package comprises a first lead set to permit electrical connection to the transformer. In some embodiments, a second package comprising a lead frame, two or more semiconductor die supported by the lead frame, and a mold material enclosing the two or more semiconductor die to form a second package body, wherein the lead frame comprises a second lead set to permit electrical connection to the two or more semiconductor die. In some embodiments, the one or more leads of the first lead set is directly electrically connected to one or more leads of the second lead set, wherein the first package and the second package are mechanically coupled together.

    METHOD AND APPARATUS FOR MAGNETIC SENSOR PRODUCING A CHANGING MAGNETIC FIELD

    公开(公告)号:US20220196763A1

    公开(公告)日:2022-06-23

    申请号:US17654624

    申请日:2022-03-14

    Abstract: Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

    Magnetic field sensor with stray field immunity and large air gap performance

    公开(公告)号:US11215681B2

    公开(公告)日:2022-01-04

    申请号:US16507544

    申请日:2019-07-10

    Abstract: A system includes a ring magnet having magnetic segments and configured to rotate about an axis of rotation, wherein adjacent segments have different magnetic polarities, The system can further include a substrate positioned so that a top surface of the substrate is substantially parallel to the axis of rotation and a center plane passing through the ring magnet and perpendicular to the axis of rotation of the ring magnet intersects the top surface at an intersection line. The system can further include four magnetic field sensing elements supported by the substrate and electrically coupled to form a first bridge circuit, wherein two of the four magnetic field sensing elements are positioned on one side of the intersection line and the other two of the four magnetic field sensing elements are positioned on the other side of the intersection line.

    Coil actuated pressure sensor and deflectable substrate

    公开(公告)号:US11061084B2

    公开(公告)日:2021-07-13

    申请号:US16295131

    申请日:2019-03-07

    Abstract: A pressure sensor includes a conductive substrate having a cavity which forms a thin portion that can be deformed by a pressure differential. A magnetic field sensor has at least one coil responsive to a changing coil drive signal and positioned proximate to the thin portion of the substrate that induces eddy currents in the thin portion that generate a reflected magnetic field. Magnetic field sensing elements detect the reflected magnetic field and generate a magnetic field signal. The magnetic field sensor is positioned so that deformation of the thin portion of the substrate causes a distance between the thin portion of the substrate and the magnetic field sensor to change.

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