公开(公告)号：US20240348961A1

公开(公告)日：2024-10-17

申请号：US18626024

申请日：2024-04-03

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  G01V3/08 ,  H01F7/02 ,  H04B1/38 ,  H04B1/3827 ,  H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C13/005 ,  E05F1/1261 ,  E05F3/20 ,  G01V3/081 ,  H01F7/02 ,  H04R1/023 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1091 ,  H05K5/0086 ,  H05K5/0217 ,  H05K5/0226 ,  H05K5/03 ,  A45C2011/001 ,  E05Y2201/224 ,  E05Y2999/00 ,  H04B1/38 ,  H04B2001/3866 ,  H04R1/1025 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2460/11

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11540039B2

公开(公告)日：2022-12-27

申请号：US17207497

申请日：2021-03-19

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11445302B2

公开(公告)日：2022-09-13

申请号：US17086716

申请日：2020-11-02

Applicant: Apple Inc.

Inventor： Michael B. Nussbaum ,  Jason C. Della Rosa ,  Glenn K. Trainer

IPC: H04R9/02 ,  H04R1/02 ,  H05K7/20

Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

公开(公告)号：US20220155875A1

公开(公告)日：2022-05-19

申请号：US17649582

申请日：2022-02-01

Applicant: APPLE INC.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Jason C. Della Rosa ,  Christopher J. Stringer ,  Molly J. Anderson ,  Erik L. Wang

IPC: G06F3/02 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  H04R1/28 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  H01H13/02

Abstract: A voice-controlled electronic device that includes an axisymmetric device housing having a longitudinal axis bisecting opposing top and bottom surfaces and a side surface extending between the top and bottom surfaces. The device can further include a plurality of microphones disposed within the device housing and distributed radially around the longitudinal axis; a processor configured to execute computer instructions stored in a computer-readable memory for interacting with a user and processing voice commands received by the plurality of microphones and first and second transducers configured to generate sound waves within different frequency ranges.

公开(公告)号：US20220070576A1

公开(公告)日：2022-03-03

申请号：US17067611

申请日：2020-10-09

Applicant: Apple Inc.

Inventor： Jason C. Della Rosa ,  Alexander R. Gould ,  Ethan W. Juhnke ,  John H. Sheerin ,  Glenn K. Trainer ,  Ariel A. Massias ,  Edward V. Anderson ,  Pablo Seoane Vieites ,  Junyi Yang

IPC: H04R1/28 ,  H04R9/06 ,  H04R1/02 ,  H04R5/02

Abstract: An electronic speaker comprising: a device housing defining an interior cavity and including a sidewall extending around the interior cavity between an upper portion and a lower portion of the device housing; first and second sound channels formed at opposing locations along the sidewall, each of the first and second sound channels comprising a plurality of openings formed through the sidewall; a passive radiator array comprising first and second passive radiators disposed within the interior cavity, spaced apart from each other in an opposing relationship and aligned to project sound through the first and second sound channels; an active driver disposed in the device housing and configured to generate sound in response to an electrical signal, the active driver comprising driver housing disposed at least partially between the first and second passive radiators, a magnet disposed within the driver housing, a voice coil and a diaphragm facing downwards towards the lower surface of the device housing; and an annular sound channel disposed along the bottom portion of the device housing adjacent to the diaphragm of the active driver.

公开(公告)号：US20210243514A1

公开(公告)日：2021-08-05

申请号：US17234441

申请日：2021-04-19

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US11012770B2

公开(公告)日：2021-05-18

申请号：US16584940

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US10986433B2

公开(公告)日：2021-04-20

申请号：US16584894

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US10827273B2

公开(公告)日：2020-11-03

申请号：US16698136

申请日：2019-11-27

Applicant: Apple Inc.

Inventor： Michael B. Nussbaum ,  Jason C. Della Rosa ,  Glenn K. Trainer

IPC: H04R9/02 ,  H04R1/02 ,  H05K7/20

Abstract: Electronics devices according to embodiments of the present technology may include a first loudspeaker and a second loudspeaker disposed in a housing. The housing may define a first internal volume between a first end of the housing and a backside of the first loudspeaker. The housing may define a second internal volume between a second end of the housing and a backside of the second loudspeaker. The first loudspeaker and the second loudspeaker may be positioned within the housing so a front side of the first loudspeaker faces a front side of the second loudspeaker. A duct may be defined by the housing, which may access the first internal volume at a first end and may access the second internal volume at a second end. The electronic device may also include a processor configured to deliver signals to the first loudspeaker and the second loudspeaker.

公开(公告)号：US10257608B2

公开(公告)日：2019-04-09

申请号：US15613003

申请日：2017-06-02

Applicant: Apple Inc.

Inventor： Jason C. Della Rosa ,  Ethan L. Huwe ,  Glenn K. Trainer ,  Simon K. Porter

IPC: F21V3/00 ,  F21V5/00 ,  G06F3/01 ,  G06F3/02 ,  G06F3/16 ,  H04R1/02 ,  H04R1/26 ,  H04R1/28 ,  H04R1/30 ,  H04R1/40 ,  H04R3/00 ,  H04R3/12 ,  H04R5/02 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H05K1/02 ,  H05K1/14 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H04R31/00 ,  G06F3/041 ,  H01H13/02 ,  G06F3/0354 ,  H03K17/96

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.