INDEPENDENTLY OPERATED PIEZOELECTRIC ULTRASOUND ELEMENTS ARRANGED IN A CHECKERBOARD PATTERN

    公开(公告)号:US20220110529A1

    公开(公告)日:2022-04-14

    申请号:US17555351

    申请日:2021-12-17

    Abstract: Described herein are arrays of piezoelectric ultrasound elements. The piezoelectric ultrasound elements may be arranged in a checkerboard pattern. The piezoelectric ultrasound elements in one column may be shifted along the vertical dimension of the array with respect to piezoelectric ultrasound elements in an adjacent column. A piezoelectric ultrasound element in one column may be coupled to a different circuit than all other piezoelectric ultrasound elements in the column. The circuit may be, for example, an analog-to-digital converter or a circuit configured to transmit ultrasound signals from the array. Each piezoelectric ultrasound element in a column may be configured so that it can operate at a different frequency from each of the other piezoelectric ultrasound elements in the column. There array may include at least 1,000 piezoelectric ultrasound elements. The array may be monolithically integrated with a substrate comprising different circuits for each piezoelectric ultrasound element in the array.

    Multilevel bipolar pulser
    32.
    发明授权

    公开(公告)号:US11294044B2

    公开(公告)日:2022-04-05

    申请号:US16109457

    申请日:2018-08-22

    Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

    Methods and apparatuses for azimuthal summing of ultrasound data

    公开(公告)号:US11808897B2

    公开(公告)日:2023-11-07

    申请号:US17493775

    申请日:2021-10-04

    Abstract: Aspects of the technology described herein related to controlling, using control circuitry, modulation circuitry to modulate and delay first ultrasound data generated by first ultrasound transducers positioned at a first azimuthal position of an ultrasound transducer array of an ultrasound device and second ultrasound data generated by second ultrasound transducers positioned at a second azimuthal position of the ultrasound transducer array of the ultrasound device, such that the first ultrasound data is delayed by a first delay amount and the second ultrasound data is delayed by a second delay amount that is different from the first delay amount. The first and second ultrasound data received from the modulation circuitry may be filtered and summed. The ultrasound transducer array, the control circuitry, the modulation circuitry, the filtering circuitry, and the summing circuitry may be integrated onto a semiconductor chip or one or more semiconductor chips packaged together.

    METHODS AND APPARATUS FOR CONFIGURING AN ULTRASOUND SYSTEM WITH IMAGING PARAMETER VALUES

    公开(公告)号:US20220354467A1

    公开(公告)日:2022-11-10

    申请号:US17871875

    申请日:2022-07-22

    Abstract: Aspects of the technology described herein relate to configuring an ultrasound system with imaging parameter values. In particular, certain aspects relate to configuring an ultrasound system to produce a plurality of sets of ultrasound images, each respective set of the plurality of sets of ultrasound images being produced with a different respective set of a plurality of sets of imaging parameter values; obtaining, from the ultrasound system, the plurality of sets of ultrasound images; determining a set of ultrasound images from among the plurality of sets of ultrasound images that has a highest quality; and based on determining the set of ultrasound images from among the plurality of sets of ultrasound images that has the highest quality, automatically configuring the ultrasound system to produce ultrasound images using a set of imaging parameter values with which the set of ultrasound images that has the highest quality was produced.

    ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES

    公开(公告)号:US20220313219A1

    公开(公告)日:2022-10-06

    申请号:US17845940

    申请日:2022-06-21

    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

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