公开(公告)号：US11833542B2

公开(公告)日：2023-12-05

申请号：US16562821

申请日：2019-09-06

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: G10K1/00 ,  B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12 ,  B81B7/00

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81C1/00158 ,  G10K9/12 ,  G10K11/18 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20220133274A1

公开(公告)日：2022-05-05

申请号：US17578370

申请日：2022-01-18

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  A61B8/14 ,  A61N7/00 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00 ,  B81C1/00 ,  G01S7/52 ,  B06B1/02 ,  A61N7/02

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US20240407759A1

公开(公告)日：2024-12-12

申请号：US18806916

申请日：2024-08-16

Applicant: BFLY Operations, Inc

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  A61B8/08 ,  A61B8/14 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00 ,  G01S7/52 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US12076189B2

公开(公告)日：2024-09-03

申请号：US17890985

申请日：2022-08-18

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  A61B8/14 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00 ,  G01S7/52 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00 ,  A61B8/08

CPC classification number: A61B8/4494 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/54 ,  A61N7/00 ,  A61N7/02 ,  B06B1/02 ,  B81C1/00246 ,  G01S7/52019 ,  G01S7/52034 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/02 ,  G01S15/8915 ,  G01S15/8977 ,  H04R1/00 ,  A61B8/485

Abstract: A hand-held ultrasound device, for placement on a subject, includes a semiconductor device and a housing to support the semiconductor device. The semiconductor device includes: a plurality of ultrasonic transducer elements; a plurality of pulsers coupled to the plurality of ultrasonic transducer elements; a plurality of waveform generators configured to drive the plurality of pulsers; receive processing circuitry configured to process ultrasound signals received by the plurality of ultrasonic transducer elements; and a plurality of independently controllable registers configured to store a plurality of different parameters for the waveform generators.

公开(公告)号：US11684949B2

公开(公告)日：2023-06-27

申请号：US17086311

申请日：2020-10-30

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00 ,  G10K11/18 ,  G10K9/12 ,  B81B7/00

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81C1/00158 ,  G10K9/12 ,  G10K11/18 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US11647985B2

公开(公告)日：2023-05-16

申请号：US17209126

申请日：2021-03-22

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Gregory Corteville

IPC: A61B8/14 ,  A61B8/00 ,  A61B8/13 ,  A61B8/08 ,  G03B27/42 ,  G03B27/52 ,  B06B1/02 ,  G01S7/00 ,  G01S7/52 ,  G01S15/89 ,  A61N7/02 ,  A61N7/00

CPC classification number: A61B8/4444 ,  A61B8/13 ,  A61B8/14 ,  A61B8/4477 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/54 ,  A61B8/56 ,  A61N7/02 ,  B06B1/0292 ,  G01S7/003 ,  G01S7/5208 ,  G01S7/52084 ,  G01S15/8915 ,  G03B27/423 ,  G03B27/52 ,  A61B8/4411 ,  A61N2007/0078 ,  Y10T29/49005

Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.

公开(公告)号：US11439364B2

公开(公告)日：2022-09-13

申请号：US15638331

申请日：2017-06-29

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  G01S15/89 ,  A61B8/14 ,  G01S15/02 ,  G01S7/52 ,  B81C1/00 ,  B06B1/02 ,  A61N7/02 ,  A61N7/00 ,  H04R1/00 ,  A61B8/08

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.

公开(公告)号：US20220110529A1

公开(公告)日：2022-04-14

申请号：US17555351

申请日：2021-12-17

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Nevada J. Sanchez ,  Gregory L. Charvat ,  Tyler S. Ralston

IPC: A61B5/01 ,  A61B8/00 ,  A61B8/08 ,  A61N7/00 ,  A61N7/02 ,  A61B8/13

Abstract: Described herein are arrays of piezoelectric ultrasound elements. The piezoelectric ultrasound elements may be arranged in a checkerboard pattern. The piezoelectric ultrasound elements in one column may be shifted along the vertical dimension of the array with respect to piezoelectric ultrasound elements in an adjacent column. A piezoelectric ultrasound element in one column may be coupled to a different circuit than all other piezoelectric ultrasound elements in the column. The circuit may be, for example, an analog-to-digital converter or a circuit configured to transmit ultrasound signals from the array. Each piezoelectric ultrasound element in a column may be configured so that it can operate at a different frequency from each of the other piezoelectric ultrasound elements in the column. There array may include at least 1,000 piezoelectric ultrasound elements. The array may be monolithically integrated with a substrate comprising different circuits for each piezoelectric ultrasound element in the array.

公开(公告)号：US20240100565A1

公开(公告)日：2024-03-28

申请号：US18523949

申请日：2023-11-30

Applicant: BFLY OPERATIONS, INC.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G10K9/12 ,  G10K11/18

CPC classification number: B06B1/02 ,  B06B1/0292 ,  B81B3/0021 ,  B81B7/0077 ,  B81C1/00158 ,  G10K9/12 ,  G10K11/18 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2203/0118 ,  B81C2203/0735 ,  B81C2203/0771

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20230079579A1

公开(公告)日：2023-03-16

申请号：US17890985

申请日：2022-08-18

Applicant: BFLY Operations, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: A61B8/00 ,  A61B8/14 ,  A61N7/00 ,  G01S15/02 ,  G01S15/89 ,  H04R1/00 ,  B81C1/00 ,  G01S7/52 ,  B06B1/02 ,  A61N7/02

Abstract: A hand-held ultrasound device, for placement on a subject, includes a semiconductor device and a housing to support the semiconductor device. The semiconductor device includes: a plurality of ultrasonic transducer elements; a plurality of pulsers coupled to the plurality of ultrasonic transducer elements; a plurality of waveform generators configured to drive the plurality of pulsers; receive processing circuitry configured to process ultrasound signals received by the plurality of ultrasonic transducer elements; and a plurality of independently controllable registers configured to store a plurality of different parameters for the waveform generators.