公开(公告)号：US20130039733A1

公开(公告)日：2013-02-14

申请号：US13207609

申请日：2011-08-11

Applicant: Bucknell C. Webb

Inventor： Bucknell C. Webb

IPC: H01L21/67 ,  B25J11/00

CPC classification number: H01L21/67132

Abstract: Pick and place tape release techniques and tools that allow thin, fragile semiconductor dies to be removed from wafer tape with reduced tape release forces applied to the semiconductor dies. For example, a method for removing semiconductor die from wafer tape includes mounting a wafer ring having wafer tape and one or more dies attached to the wafer tape, and aligning an ejector pin assembly under a target die to be removed from the wafer tape. The ejector pin assembly includes a vacuum housing, an ejector pin, a suction plate, and an aperture formed in the suction plate in alignment with the ejector pin. A vacuum is generated in the vacuum housing to draw the tape against a surface of the suction plate. The ejector pin is extended through the vacuum housing out from the aperture of the suction plate to push against a backside of the target die and release the tape from the backside of the target die, and as the tape is released from the backside of the target die, the tape is drawn down against the suction plate by suction force of the vacuum.

Abstract translation: 拾取和放置磁带释放技术和工具，其允许薄的，脆弱的半导体管芯从晶片带去除，同时减小施加到半导体管芯上的剥离力。 例如，从晶片带除去半导体管芯的方法包括安装具有晶片带的晶片环和安装在晶片带上的一个或多个管芯，以及使靶组件下方的顶针组件对准晶片带。 顶针组件包括真空壳体，顶针，吸板和形成在吸板中的与顶针对准的孔。 在真空壳体中产生真空以将带材吸附在吸盘的表面上。 顶针从吸板的孔径延伸穿过真空壳体，以推压目标管芯的背面并从目标管芯的背面释放带，并且当带从靶的背面释放时 模具，胶带通过真空的吸力被吸引到吸盘上。

公开(公告)号：US20090294955A1

公开(公告)日：2009-12-03

申请号：US12538123

申请日：2009-08-08

Applicant: Bucknell C. Webb

Inventor： Bucknell C. Webb

IPC: H01L23/34

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H05K7/20472 ,  Y10T29/49117 ,  H01L2924/00

Abstract: An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit.

公开(公告)号：US07545647B2

公开(公告)日：2009-06-09

申请号：US12037067

申请日：2008-02-25

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20 ,  H01L23/36

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。

公开(公告)号：US20090027860A1

公开(公告)日：2009-01-29

申请号：US11781854

申请日：2007-07-23

Applicant: Bucknell C. Webb

Inventor： Bucknell C. Webb

IPC: H05K7/20 ,  F28F3/02 ,  H01R43/00

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H05K7/20472 ,  Y10T29/49117 ,  H01L2924/00

Abstract: An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit.

Abstract translation: 集成电路封装包括：衬底; 位于所述基板上的电子电路，所述电子电路包括至少一个电平的形貌; 位于电子电路上方的冷却装置; 设置在所述电子电路和所述冷却装置之间的兼容接口，其中所述柔性接口包括第一表面和第二表面，并且其中所述第一表面与所述电子电路热接触，并且其中所述柔性接口由柔性材料 使得第一表面基本上符合电子电路的形貌。

公开(公告)号：US20080298016A1

公开(公告)日：2008-12-04

申请号：US12180711

申请日：2008-07-28

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.

Abstract translation: 一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。

公开(公告)号：US07355855B2

公开(公告)日：2008-04-08

申请号：US11151830

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark D. Schultz ,  Bucknell C. Webb

IPC: H05K7/20

CPC classification number: H01L23/433 ,  A01H5/02 ,  A01H6/42 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，用于从电子设备提供热路径，并且其中多个弹簧元件提供机械顺应性。 在一个替代方案中，该结构还包括设置在电子设备上的固体导热层，其中多个弹簧元件联接到固体导热层。

公开(公告)号：US07264041B2

公开(公告)日：2007-09-04

申请号：US11151831

申请日：2005-06-14

Applicant: John P. Karidis ,  Mark Schultz ,  Bucknell C. Webb

Inventor： John P. Karidis ,  Mark Schultz ,  Bucknell C. Webb

IPC: F28D15/02

CPC classification number: H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a heat path from the electronic device and provides mechanical compliance. The structure further includes a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements, and a liquid with vaporizing capability disposed with the space contained.

Abstract translation: 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中至少一个弹簧元件包括弹簧部分，提供来自电子设备的热路径并提供机械顺应性。 该结构还包括用于在顶层和电子设备之间容纳空间的密封件，其中容纳的空间包括多个弹簧元件，以及具有包含空间的蒸发能力的液体。

公开(公告)号：US07136243B2

公开(公告)日：2006-11-14

申请号：US11015130

申请日：2004-12-17

Applicant: Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Anthony P. Praino ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

IPC: G11B5/09 ,  G11B21/02

CPC classification number: G11B5/59633 ,  G11B5/5565 ,  G11B21/106

Abstract: Improvements in placement of timing patterns in self-servowriting include correcting for systematic errors due to geometric effects. A correction is made for varying systematic errors, such as when the recording head has spatially separate read and write elements. Further, servopattern rotation due to residual or unmeasured systematic errors is reduced by using a once per revolution clock index derived from the motor drive current waveform or any other sensor. In one aspect of correcting for systematic errors in the writing of timing patterns on a storage medium of a storage device, a time interval between a trigger pattern written at a first radial position of the storage medium and a rotational index is measured. The rotational index is related to the rotational orientation of the storage medium with respect to a fixed frame of the storage device. The location of another trigger pattern to be written is shifted, using the measured time interval to determine the shift in location for the another trigger pattern.

Abstract translation: 自我维护中定时模式布局的改进包括纠正由于几何效应引起的系统误差。 对变化的系统误差进行校正，例如当记录头具有空间上分离的读和写元件时。 此外，通过使用从电动机驱动电流波形或任何其他传感器导出的每转一次的时钟指数来减少由于残余或未测量的系统误差引起的伺服模式旋转。 在对存储装置的存储介质上的定时模式的写入进行校正系统错误的一个方面，测量在存储介质的第一径向位置上写入的触发模式与旋转指标之间的时间间隔。 旋转指数与存储介质相对于存储装置的固定框架的旋转取向有关。 使用测量的时间间隔来移动要写入的另一个触发模式的位置，以确定另一个触发模式的位置偏移。

公开(公告)号：US06735031B2

公开(公告)日：2004-05-11

申请号：US09774914

申请日：2001-01-31

Applicant: Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Bucknell C. Webb ,  Edward J. Yarmchuk

IPC: G11B502

CPC classification number: G11B5/59633 ,  G11B5/012

Abstract: A method for writing timing marks on a rotatable storage medium, such as on a disk in a disk drive, includes the steps of: 1) during a rotation of the disk, detecting the passage of at least a portion of a first timing mark located at a first radius of the disk, and 2) writing a second timing mark at a second radius of the disk, the location of the second timing mark being based at least in part on a stored calculation of a delay from the time of passage of the first timing mark during a rotation of the rotatable storage medium. The location of the second timing mark is calculated based on alternative time intervals between detected timing marks and on various functions of the time intervals.

Abstract translation: 在诸如盘驱动器中的盘上的可旋转存储介质上写入定时标记的方法包括以下步骤：1）在盘的旋转期间，检测位于第一定时标记的至少一部分的通过 在所述盘的第一半径处，以及2）在所述盘的第二半径处写入第二定时标记，所述第二定时标记的位置至少部分地基于存储的从所述盘的通过时间开始的延迟的计算 在可旋转存储介质旋转期间的第一定时标记。 基于检测到的定时标记之间的替代时间间隔和时间间隔的各种功能来计算第二定时标记的位置。

公开(公告)号：US5901003A

公开(公告)日：1999-05-04

申请号：US628910

申请日：1996-04-08

Applicant: Timothy Joseph Chainer ,  Anthony Paul Praino ,  Mark Delorman Schultz ,  Bucknell C. Webb ,  Edward John Yarmchuk

Inventor： Timothy Joseph Chainer ,  Anthony Paul Praino ,  Mark Delorman Schultz ,  Bucknell C. Webb ,  Edward John Yarmchuk

IPC: G11B5/55 ,  G11B5/596 ,  G11B19/04 ,  G11B21/10 ,  G11B5/09

CPC classification number: G11B19/04 ,  G11B21/106 ,  G11B5/5565 ,  G11B5/59633

Abstract: Improvements in placement of timing patterns in self servo writing include correcting for random and systematic errors due to geometric effects. In a disk drive having a recording head with separate read and write elements, a method for determining separation between the elements and for correcting for such errors as a function of skew angle between the head and the disk. Errors resulting from misalignment and non-parallelism of the elements as well as misalignment of the head on it its actuator are also detected and corrected. Errors due to changes in rotational velocity of the disk and misplacement of timing patterns with respect to adjacent timing patterns are detected and corrected. In general, a single revolution process may be used to both write and detect random errors on each track and corrected on subsequent tracks.

Abstract translation: 自动写入中定时模式布置的改进包括纠正由于几何效应引起的随机和系统误差。 在具有具有分离的读取和写入元件的记录头的磁盘驱动器中，确定元件之间的间隔并用于校正这种错误的方法，其作为头部和盘之间的歪斜角的函数。 元件的不对准和不平行度导致的误差以及头部在其致动器上的未对准性也被检测和校正。 检测并纠正由于盘的旋转速度的变化引起的错误和定时图案相对于相邻的定时图案的错位。 通常，可以使用单次旋转处理来写入和检测每个轨道上的随机误差并在随后的轨道上进行校正。