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    Electronic system with heat dissipation structure
    31.
    发明授权
    Electronic system with heat dissipation structure 有权
    具有散热结构的电子系统

    公开(公告)号：US07990720B2

    公开(公告)日：2011-08-02

    申请号：US12614452

    申请日：2009-11-09

    申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： G06F1/181 ,  G06F1/20

    摘要： An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

    摘要翻译： 诸如计算机系统的电子系统包括限定其侧面的开口的壳体，布置在壳体中的母板，位于母板侧的硬盘和覆盖壳体的开口的散热结构。 主板包括面向壳体的开口的印刷电路板，安装在印刷电路板上并朝向开口的第一电子部件和第二电子部件。 散热结构包括与壳体接合的基部和从基部延伸到壳体外部的翅片。 底座包括接触第一和第二电子部件的第一接合部分和接触硬盘的第二接合部分。 第一接合部分和第二接合部分彼此处于不同的高度。

    Heat dissipation device
    32.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号：US07967059B2

    公开(公告)日：2011-06-28

    申请号：US12241063

    申请日：2008-09-30

    申请人： Yi-Jiun Li ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Yi-Jiun Li ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.

    摘要翻译： 散热装置包括底座，翅片组，连接基座和翅片组的多个热管，覆盖翅片组的风扇盖和位于风扇盖侧面的风扇。 热管接收在基座中并延伸穿过翅片组。 热管被容纳在翅片组的两个相对侧并且夹在风扇盖和翅片组之间。 风扇盖包括主体和从主体延伸的一对侧壁。 侧壁各自包括形成在其外表面上的多个散热片，用于增加散热装置的散热面。

    Heat dissipation device
    34.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号：US07447025B2

    公开(公告)日：2008-11-04

    申请号：US11163820

    申请日：2005-11-01

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

    摘要翻译： 散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。 通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。 空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

    HEAT DISSIPATION DEVICE WITH A HEAT PIPE
    35.
    发明申请
    HEAT DISSIPATION DEVICE WITH A HEAT PIPE 审中-公开
    带散热管的散热装置

    公开(公告)号：US20080121370A1

    公开(公告)日：2008-05-29

    申请号：US11564274

    申请日：2006-11-28

    申请人： Wen-Li Luo ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Wen-Li Luo ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a heat spreader (20), a heat sink (10) attached to the heat spreader (20), a sleeve (40) and a heat pipe (30). The heat spreader (20) is for contacting a heat-generating electronic device. The heat sink (10) includes a base (12) and a plurality of fins (14, 15) extending from the base (12). The sleeve (40) is inserted into a through hole (16) defined in the fins (14, 15). The heat pipe (30) includes an evaporating portion (31) sandwiched between the heat spreader (20) and the base (12), and a condensing portion (33) received in the sleeve (40).

    摘要翻译： 散热装置包括散热器（20），附接到散热器（20）的散热器（10），套筒（40）和热管（30）。 散热器（20）用于接触发热电子设备。 散热器（10）包括基部（12）和从基部（12）延伸的多个散热片（14,15）。 套筒（40）插入到限定在翅片（14,15）中的通孔（16）中。 热管（30）包括夹在散热器（20）和基座（12）之间的蒸发部分（31）和容纳在套筒（40）中的冷凝部分（33）。

    HEAT DISSIPATION DEVICE WITH HEAT PIPES
    36.
    发明申请
    HEAT DISSIPATION DEVICE WITH HEAT PIPES 有权
    带热管的散热装置

    公开(公告)号：US20080017351A1

    公开(公告)日：2008-01-24

    申请号：US11309305

    申请日：2006-07-24

    申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

    发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

    摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。 第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。 第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。 至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。

    HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN
    37.
    发明申请
    HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN 失效
    具有相变介质的热释放装置

    公开(公告)号：US20070159798A1

    公开(公告)日：2007-07-12

    申请号：US11306700

    申请日：2006-01-09

    申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

    IPC分类号： H05K7/20

    CPC分类号： H01L23/467 ,  F28F2215/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

    摘要翻译： 散热装置包括散热体和与散热装置热结合的​​导热体。 散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。 每个翅片在其一端分支多个部分。 导热体包括热嵌合在散热体的中心部分的通孔中的柱。 在该散热体的中心部分之间限定空腔。 空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

    Method of manufacturing heat sink
    39.
    发明授权
    Method of manufacturing heat sink 有权
    制造散热片的方法

    公开(公告)号：US08341842B2

    公开(公告)日：2013-01-01

    申请号：US12537267

    申请日：2009-08-07

    申请人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： B21D53/00

    CPC分类号： H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49368 ,  H01L2924/00

    摘要： A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.

    摘要翻译： 一种制造散热片的方法，首先是提供多个翅片，每个翅片均具有从头部延伸的头部和主体，提供具有从其顶表面突出的多个螺柱的基座，以及提供限定多个 的底部中的凹部用于接收翅片的头部和用于接收螺栓的多个凸起部。 接下来，按压盖和基座以将翅片的头部夹在其间。 然后冲压底座的螺栓以扩展螺柱，并使螺柱与盖子紧密接合。

    HEAT DISSIPATION DEVICE
    40.
    发明申请
    HEAT DISSIPATION DEVICE 有权
    散热装置

    公开(公告)号：US20110024090A1

    公开(公告)日：2011-02-03

    申请号：US12641340

    申请日：2009-12-18

    申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

    IPC分类号： F28D15/02

    CPC分类号： F28D15/0233 ,  F28D15/0275 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.

    摘要翻译： 示例性的散热装置包括基板，两个翅片组，芯，连接到芯的顶部的风扇支架，位于翅片组上方并由风扇支架固定的风扇和两个热管。 两个翅片组协作以在其中心形成中心孔并具有从中心孔径向向外延伸的多个翅片。 芯放置在基板上并接收在中心孔中。 每个热管包括夹在核心和基板之间的蒸发部分，夹在两个翅片组之间的弧形冷凝部分和连接蒸发部分和冷凝部分的绝热部分。