公开(公告)号：US07760509B1

公开(公告)日：2010-07-20

申请号：US12581168

申请日：2009-10-19

申请人： Pin-Qun Zhao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Pin-Qun Zhao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H05K7/20509

摘要： A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink having a bottom for in contact with the electronic component and a plurality of fasteners securing the heat sink onto the printed circuit board. Each fastener includes a first latching member, a second latching member rotatably connected to the first latching member and an operating member rotatably connected to the first latching member and having a pressing part engaging a curved portion defined on a top of the second latching member. The heat sink and the printed circuit board are located between the first and second latching members of each fastener. The operating member is rotated to force the first and the second latching members to rotate toward each other to closely clip the heat sink and printed circuit board together.

摘要翻译： 一种用于从安装在印刷电路板上的电子部件移除热量的散热装置，包括具有与电子部件接触的底部的散热器和将散热器固定在印刷电路板上的多个紧固件。 每个紧固件包括第一闩锁构件，可旋转地连接到第一闩锁构件的第二闩锁构件和可旋转地连接到第一闩锁构件并且具有接合限定在第二闩锁构件的顶部上的弯曲部分的按压部分的操作构件。 散热器和印刷电路板位于每个紧固件的第一和第二闩锁构件之间。 旋转操作构件以迫使第一和第二闩锁构件朝向彼此旋转以将散热器和印刷电路板紧密地夹在一起。

公开(公告)号：US07637311B2

公开(公告)日：2009-12-29

申请号：US11769664

申请日：2007-06-27

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.

摘要翻译： 一种用于至少两个发热电子部件的散热装置，包括用于与发热电子部件接触的基座，布置在基座的一部分上的第一翅片组，布置在基座的另一部分上的第二翅片组 以及至少夹在基座与第一和第二翅片组之间的热管。 第一翅片组包括在其间限定多个空气通道的多个翅片。 第二翅片组包括多个翅片。 每两个相邻的翅片在其间限定有与第一翅片组的相应空气通道连通的空气通道。 与第一和第二翅片组的空气通道平行并具有宽度的通道限定在第二翅片组的中间。

公开(公告)号：US20090314465A1

公开(公告)日：2009-12-24

申请号：US12202404

申请日：2008-09-01

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28F13/00

CPC分类号： H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

摘要翻译： 散热装置包括基座，安装在基座顶部的翅片组，安装在翼片组顶部的风扇，安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面，并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器，然后通过风扇到达散热片组。

公开(公告)号：US20090303718A1

公开(公告)日：2009-12-10

申请号：US12134163

申请日：2008-06-05

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F21V21/14

CPC分类号： F21V14/02 ,  F21K9/00 ,  F21K9/65 ,  F21V14/04 ,  F21V29/505 ,  F21V29/74 ,  F21V29/77 ,  F21V29/83 ,  F21Y2107/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a lamp cover consisting of a plurality of sector-shaped connecting bodies, a plurality of fins attached to the lamp cover and a plurality of LED modules attached to the lamp cover and opposing the fins. A locking device is pivotably mounted to the lamp cover and comprises a supporting pole extending in the lamp cover, a plurality of branches pivotably mounted to the lamp cover and the supporting pole. The branches are movable along the supporting pole to be locked at a desired position, whereby an illumination angle of the LED modules of the lamp cover relative to the supporting pole is changeable via movement of the branches along the supporting pole of the locking device. Thus, an illumination area and an illumination intensity of the LED lamp are adjustable.

摘要翻译： LED灯包括由多个扇形连接体组成的灯罩，附接到灯罩的多个灯片和附接到灯罩并与散热片相对的多个LED组件。 锁定装置可枢转地安装到灯罩，并且包括在灯罩中延伸的支撑杆，可枢转地安装到灯罩和支撑杆的多个分支。 分支可沿着支撑杆移动以被锁定在期望的位置，由此灯罩的LED模块相对于支撑杆的照明角度可以通过分支沿着锁定装置的支撑杆的移动而改变。 因此，LED灯的照明区域和照明强度是可调节的。

公开(公告)号：US20090244849A1

公开(公告)日：2009-10-01

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US06942020B2

公开(公告)日：2005-09-13

申请号：US10890049

申请日：2004-07-12

申请人： Chun-Chi Chen ,  Meng Fu

发明人： Chun-Chi Chen ,  Meng Fu

IPC分类号： H01L23/427 ,  F28D15/00

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a plurality of fins (40), a post (20) and a plurality of heat pipes (30). Each fin defines an opening (42) and a plurality of punctures (44) spaced from the opening. The post is received in the openings of the fins. The heat pipes are engaged at opposite portions thereof with the post and the punctures of the fins.

摘要翻译： 散热装置包括多个翅片（40），柱（20）和多个热管（30）。 每个翅片限定开口（42）和与开口间隔开的多个穿孔（44）。 该柱被容纳在翅片的开口中。 热管在其与柱的相对部分处接合并且翅片的穿刺。

公开(公告)号：US07663884B2

公开(公告)日：2010-02-16

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US07643300B1

公开(公告)日：2010-01-05

申请号：US12336482

申请日：2008-12-16

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device used for removing heat from a plurality of memory module cards, includes a first bracket, a second bracket placed on the first bracket and a fin set arranged on the second bracket. The first bracket has a plurality of first sheets extending downwardly from a bottom thereof and defines a plurality of slots therein. The second bracket has a plurality of second sheets extending downwardly from a bottom thereof. The first sheets are respectively attached to sides of the memory module cards. The second sheets are respectively extended through the slots of the first bracket and attached to opposite sides of the memory module cards and opposite to the first sheets.

摘要翻译： 用于从多个存储模块卡移除热量的散热装置包括第一支架，设置在第一支架上的第二支架和布置在第二支架上的散热片组。 第一支架具有从底部向下延伸并在其中限定多个槽的多个第一片。 第二支架具有从底部向下延伸的多个第二片。 第一张纸分别安装在存储模块卡的两侧。 第二片分别延伸穿过第一托架的狭槽并且附接到存储模块卡的相对侧并与第一片相对。

公开(公告)号：US06938682B2

公开(公告)日：2005-09-06

申请号：US10902457

申请日：2004-07-28

申请人： Chun-Chi Chen ,  Meng Fu

发明人： Chun-Chi Chen ,  Meng Fu

IPC分类号： H01L23/427 ,  H01L23/467 ,  F28D15/00

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base (10), fins (40), two plates (30), a post (50), a pair of heat pipes (20) and a fan (60). The fins are spaced from each other and defines a plurality of air passages therebetween. The plates are positioned at opposite sides of the fins. The post is perpendicularly engaged in central positions of the fins and the base. The post is coplanar with the base at lowest surfaces. The heat pipes have central segments (22) engaged in the base and end segments (24) sandwiched between the plates and the fins. The fan is positioned to the plates and in communication with the air passages.

摘要翻译： 散热装置包括基座（10），翅片（40），两个板（30），柱（50），一对热管（20）和风扇（60）。 翅片彼此间隔开并且在它们之间限定多个空气通道。 板位于翅片的相对侧。 该柱垂直地接合在翅片和基座的中心位置。 该柱与底部在最低表面共面。 热管具有接合在底座中的中心段（22）和夹在板和鳍之间的端段（24）。 风扇定位在板上并与空气通道连通。

公开(公告)号：US06924982B2

公开(公告)日：2005-08-02

申请号：US10756734

申请日：2004-01-12

申请人： Chun-Chi Chen ,  Chin Hsien Lan ,  Meng Fu

发明人： Chun-Chi Chen ,  Chin Hsien Lan ,  Meng Fu

IPC分类号： H01L23/40 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly (100) includes a retention frame (90), a heat sink (80), a fan holder (10), a pair of clips (60) and a fan (20). The heat sink is mounted on the retention frame and forms a pair of shoulders (822) at opposite sides thereof. The fan holder includes a fan duct (40) surrounding a top portion of the heat sink and including a pair of supports mounted on the shoulders, and a holding frame (30) detachably mounted on the fan duct. The clips are mounted on the supports and engaged with the retention frame. One side of the holding frame is pivotally engaged with the fan duct, an opposite side of the holding frame forms a latching leg (33) that is engaged with an ear (412) formed at the fan duct. Three catching arms extend from the holding frame and retain the fan in the holding frame.

摘要翻译： 散热组件（100）包括保持框架（90），散热器（80），风扇支架（10），一对夹子（60）和风扇（20）。 散热器安装在保持框架上，并在其相对侧形成一对肩部（822）。 风扇架包括围绕散热器的顶部的风扇导管（40），并包括安装在肩上的一对支架以及可拆卸地安装在风扇导管上的保持架（30）。 夹子安装在支撑件上并与保持框架接合。 保持框架的一侧与风扇管道枢转地接合，保持框架的相对侧形成与形成在风扇导管处的耳朵（412）接合的锁定腿部（33）。 三个抓臂从保持架延伸并将风扇保持在保持框架中。