公开(公告)号：US20090244849A1

公开(公告)日：2009-10-01

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US08199508B2

公开(公告)日：2012-06-12

申请号：US12503021

申请日：2009-07-14

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H05K5/00 ,  H01L23/10 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

摘要翻译： 散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。 印刷电路板限定多个第一通孔。 散热装置包括位于印刷电路板顶侧的散热器。 散热器分别限定与第一通孔相对应的多个第二通孔。 第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。 多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

公开(公告)号：US08002019B2

公开(公告)日：2011-08-23

申请号：US12051853

申请日：2008-03-20

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.

摘要翻译： 散热装置包括基座，位于基座上的翅片组，第一热管和第二热管。 翅片组包括布置在第一鳍片组上的第一鳍片组，第二鳍片组和布置在第二鳍片组上的第三鳍片组。 第一热管包括夹在基部和第一翅片组之间的蒸发部分，夹在第一翅片组和第二翅片组之间的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。 第二热管包括夹在基座和第一翅片组之间的蒸发部分，位于第二翅片组和第三翅片组之间的冷凝部分和将蒸发部分和其冷凝部分互连的连接部分。

公开(公告)号：US07597134B2

公开(公告)日：2009-10-06

申请号：US11683373

申请日：2007-03-07

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).

摘要翻译： 散热装置包括至少两个热管（10）和与热管（10）热连接的多个翅片（20）。 每个热管（10）包括平坦的蒸发部分（12）和冷凝部分（14）。 蒸发部分（12）彼此紧密连接。 热管（10）的蒸发部分（12）的平坦的底面（125）直接与电子部件接合。 热管（10）的蒸发部分（12）的平坦顶表面（120）直接与散热片（20）的底表面接合。 热管（10）的冷凝部分（14）延伸穿过翅片（20）。

公开(公告)号：US07753109B2

公开(公告)日：2010-07-13

申请号：US11752905

申请日：2007-05-23

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  F28F2210/10 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device.

摘要翻译： 适于从发热装置散热的散热装置包括热管组件和翅片组。 热管组件适于从发热装置吸收热量，并且包括多个弯曲热管，每个弯管具有顶面和底面。 与热管组件热接合的翅片组包括多个翅片，并且具有由翅片的底部边缘协作地形成的底面。 热管组件的热管彼此并置; 热管的顶面热连接到翅片组的底面; 热管的底面相互定位，形成与发热装置接触的接触面。

公开(公告)号：US07663884B2

公开(公告)日：2010-02-16

申请号：US12248004

申请日：2008-10-08

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device.

摘要翻译： 安装在安装在印刷电路板上的电子装置的顶表面上的散热装置包括散热器和将散热器固定在电子装置上的保持架。 保持器包括框架，多个挡板壁和从框架向下延伸的突出柱。 保持器的挡板壁的下端向下延伸穿过散热器并与电子设备的接合边缘接合。 散热装置还设置有分别围绕保持器的突出支柱的多个弹性构件，并且在保持器和散热器之间被压缩，从而将散热器向下推向电子装置。

公开(公告)号：US08411420B2

公开(公告)日：2013-04-02

申请号：US12914988

申请日：2010-10-28

申请人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

发明人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

IPC分类号： H05K7/12

CPC分类号： F16M13/00 ,  F16M2200/08 ,  G06F1/1632 ,  H04R5/02

摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

摘要翻译： 电子设备组件包括电子设备和固定电子设备的支架。 托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。 根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。 在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。 在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

公开(公告)号：US07537046B2

公开(公告)日：2009-05-26

申请号：US11695462

申请日：2007-04-02

申请人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.

摘要翻译： 散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。 热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。 热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。 连接部分（527,528）在它们之间形成夹角。 冷凝部分（525,526）彼此间隔开并且彼此延伸。

公开(公告)号：US07391615B2

公开(公告)日：2008-06-24

申请号：US11309839

申请日：2006-10-10

申请人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2224/16 ,  Y10T24/44427 ,  Y10T24/4447

摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

摘要翻译： 夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

公开(公告)号：US20060054307A1

公开(公告)日：2006-03-16

申请号：US11221285

申请日：2005-09-07

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.

摘要翻译： 一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管 基础。 第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。