摘要:
Disclosed is a method for controlling a drum-type washing machine including the steps of (a) switching on a water supply valve and switching on a circulation pump and a heater, (b) switching off the water supply valve after the switching-on of the water supply valve, and (c) switching off the circulation pump and the heater after the switching-off of the water supply valve. The method allows laundry to be effectively cleaned using a small quantity of the wash water and minimizes a power consumption rate required to operate the heater through several repetitions of the steps (a) to (c).
摘要:
The present invention relates to a ski type motorbike whose driving force is enhanced and whose wheels are prevented from slipping, in order to provide a reliable braking force. The present invention includes a main body; an air suction section provided in the main body; a front rear wheel assembly provided in the front and rear side of the main body; a connection bar and a connection link; a brake mechanism constituted by a brake disc fixed to the rotation shaft of the main body and a caliper which presses portions of the brake disc to apply a braking force; and a controller constituted by an acceleration pedal and a braking pedal which are respectively connected to the engine and the brake mechanism through a flexible cable, the acceleration pedal and the braking pedal being hinge-joined to each other at one end thereof to control driving of the engine and braking of the rear wheel shaft, respectively.
摘要:
A thermal method of making a hydrogen permeable composition is disclosed. A mixture of metal oxide powder and ceramic oxide powder and optionally a pore former is formed and pressed to form an article. The article is dried at elevated temperatures and then sintered in a reducing atmosphere to provide a dense hydrogen permeable portion near the surface of the sintered mixture. The dense hydrogen permeable portion has a higher initial concentration of metal than the remainder of the sintered mixture and is present in the range of from about 20 to about 80 percent by volume of the dense hydrogen permeable portion.
摘要:
Provided are a dishwasher and a method of supplying water in the dishwasher. The dishwasher includes a tub enclosing a washing chamber, a sump holding washing water to be supplied to the tub, and an air brake assembly having a steam generating unit that heats the washing water to be supplied to the tub.
摘要:
Provided are a dishwasher and a method of supplying water in the dishwasher. The dishwasher includes a tub defining a washing chamber; a sump retaining washing water that is supplied to the tub; a steam generating device mounted on a side of the tub and having a steam chamber provided with a heater heating washing water; a first passage through which the washing water is supplied to the steam chamber; a second passage supplying the steam generated by the steam generating device from the steam chamber to the tub; and a third passage that supplies the washing water remained in the steam chamber to the sump after the steam is generated.
摘要:
Provided herein are chemical mechanical polishing (CMP) slurries and methods for producing the same. Embodiments of the invention include CMP slurries that include (a) a metal oxide; (b) a quaternary ammonium base; and (c) a fluorinated surfactant. In some embodiments, the fluorinated surfactant is a non-ionic perfluoroalkyl sulfonyl compound. Also provided herein are methods of polishing a polycrystalline silicon surface, including providing a slurry composition according to an embodiment of the invention to a polycrystalline silicon surface and performing a CMP process to polish the polycrystalline silicon surface.
摘要:
An anti-warpage backgrinding tape (11) is secured to the circuit side (12) of a semiconductor wafer (14). The backside (16) of the wafer is background. The backside of the wafer is secured to dicing tape (18) so that the anti-warpage backgrinding tape is exposed. The wafer is diced to create individual die structure (34). The die structure comprises semiconductor die (22) with anti-warpage tape elements (36) on circuit sides of the semiconductor die. A die structure is removed from the dicing tape. The backside of the die of the die structure is adhered to a substrate (24). The anti-warpage tape element is removed from the die. The anti-warpage backgrinding tape is preferably partially or fully transparent to permit sensing of guide markings on the wafer during wafer dicing. The adhesive is preferably a curable adhesive. The adhesion between the anti-warpage tape element and the chosen die may be reduced by the application of heat (38).
摘要:
A light emitting device package and a back light unit for liquid crystal display using the same wherein a fan is used to forcibly cool an LED package and a back light unit for LCD to increase the heat radiation efficiency and to prevent the degradation of the device.
摘要:
A mounting structure of a heating element is provided. The structure includes: a heater supporting bracket that is interposed between a radiant heating element and a supporting panel and whose one side is fixed by a screw and whose other side is elastically supported so as to elastically support the radiant heating element.
摘要:
A backlight unit is disclosed, to remove an unnecessary portion from a PCB and to decrease the number of connectors and wires, which includes a plurality of light-emitting lamps arranged in one direction inside a lamp housing; first and second driving unit PCBs positioned at both sides on the rear surface of the lamp housing, to apply a power to the light-emitting lamps; first and second connection PCBs positioned at both sides of the lamp housing, wherein the respective first and second connection PCBs are separately provided from the first and second driving unit PCBs; and first and second power supplying wires for the respective connection between the first and second driving unit PCBs with the first and second connection unit PCBs.