摘要:
A semiconductor circuit pattern design method includes the following operations. A design pattern is created by placing a plurality of cells in each functional block as a unit of the semiconductor circuit and executing routing among the plurality of placed cells. Mask pattern data based on the design pattern is created. A predictive pattern to be formed on the substrate by the mask pattern data is predicted. A difference amount between the predictive pattern and a target pattern to be formed on the substrate by the mask pattern data is checked. The difference amount is compared with a predetermined allowable variation amount. If the difference amount is larger than the allowable variation amount in the comparison, at least one of placement and routing of the cells in the design pattern corresponding to the mask pattern data used to predict the predictive pattern is corrected.
摘要:
A transmission line, includes: a first input electrode located in a first level; a plurality of parallel stripe-shaped signal lines in the first level, one end of the signal lines connected to the first input electrode; a first output electrode connected to another end of the signal lines, facing to the first input electrode; a second input electrode adjacent to the first input electrode in a second level facing the first level; a plurality of stripe-shaped ground lines positioned alternately in between and at outer sides of each of the signal lines in the first level, one end of the ground lines connected to the second input electrode; and a second output electrode adjacent to the first output electrode in the second level and connected to another end of the ground lines.
摘要:
An inclination angle measurement apparatus includes a first ultrasonic sensor (3) for sending an ultrasonic wave toward a road surface (2), second and third ultrasonic sensors (4 and 5) each for receiving an ultrasonic wave reflected from the road surface (2), and a calculation control circuit (14) for calculating an angle of inclination of a vehicle with respect to the road surface (2) based on a phase difference between ultrasonic waves received by the second and third ultrasonic sensors (4 and 5). Thus the inclination angle measurement apparatus can accurately measure the angle of inclination of the vehicle with respect to the road surface (2).
摘要:
There are disclosed a semiconductor integrated circuit device, a semiconductor integrated circuit wiring method and a cell arranging method, which can reduce delay in a semiconductor integrated circuit and improve noise resistibility, achieve facility of wiring design, and reduce production cost. The present invention forms an X-Y reference wiring grid using wirings of a total of M (M≧2) layers in which an n-th (n≧2) layer wiring intersects orthogonally with a (n−1)-th layer wiring, and forms an oblique wiring grid which intersects with the reference wiring layer to have an angle of 45 degree or 135 degree is formed by a (m+1)-th layer wiring and a (m+2)-th layer wiring which are intersected orthogonally with each other, such that the (m+1)-th layer wiring and (m+2)-th layer wiring in the oblique wiring grid has a wiring pitch of {square root over ( )}2 times of that of wiring in the reference wiring grid, and also wiring widths of {square root over ( )}2 times of that of wiring in the reference wiring layer.
摘要:
With an automatic layout method, a first line having a firs line width is generated in a prescribed direction. A second line having a second line width and extending at an oblique angle with respect to the first line is generated, so that the second line terminates at an end portion of the first line with an overlapped area. One or more VIA patterns are read out of a database according to the shape of the overlapped area. The VIA patterns are placed in the overlapped area, so that one of the VIA patterns is located at the intersection of the center lines of the first and second lines. The VIA pattern is a combination of parallelograms, including squares and rectangles.
摘要:
There are disclosed a semiconductor integrated circuit device, a semiconductor integrated circuit wiring method and a cell arranging method, which can reduce delay in a semiconductor integrated circuit and improve noise resistibility., achieve facility of wiring design, and reduce production cost. The present invention forms a X-Y reference wiring grid using wirings of a total of M (M≧2) layers in which an n-th (n≧2) layer wiring intersects orthogonally with a (n−1)-th layer wiring, and forms an oblique wiring grid which intersects with the reference wiring layer to have an angle of 45 degree or 135 degree is formed by a (m+1)-th layer wiring and a (m+2)-th layer wiring which are intersected orthogonally with each other, such that the(m+1)-th layer wiring and(m+2)-th layer wiring in the oblique wiring grid has a wiring pitch of {square root over (2)} times of that of wiring in the reference wiring grid, and also wiring widths of {square root over (2)} times of that of wiring in the reference wiring layer.