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    SUPERCONDUCTOR-SEMICONDUCTOR JOSEPHSON JUNCTION
    32.
    发明申请
    SUPERCONDUCTOR-SEMICONDUCTOR JOSEPHSON JUNCTION 有权

    公开(公告)号：US20230133709A1

    公开(公告)日：2023-05-04

    申请号：US18148145

    申请日：2022-12-29

    Applicant: International Business Machines Corporation

    Inventor： Devendra K. Sadana ,  Ning Li ,  Stephen W. Bedell ,  Sean Hart ,  Patryk Gumann

    IPC: H10N60/80 ,  G06N10/00 ,  H10N60/10

    Abstract: A gated Josephson junction includes a substrate and a vertical Josephson junction formed on the substrate and extending substantially normal the substrate. The vertical Josephson junction includes a first superconducting layer, a semiconducting layer, and a second superconducting layer. The first superconducting layer, the semiconducting layer, and the second superconducting layer form a stack that is substantially perpendicular to the substrate. The gated Josephson junction includes a gate dielectric layer in contact with the first superconducting layer, the semiconducting layer, and the second superconducting layer at opposing side surfaces of the vertical Josephson junction, and a gate electrically conducting layer in contact with the gate dielectric layer. The gate electrically conducting layer is separated from the vertical Josephson junction by the gate dielectric layer. In operation, a voltage applied to the gate electrically conducting layer modulates a current through the semiconducting layer of the vertical Josephson junction.

    TWO-SIDED MAJORANA FERMION QUANTUM COMPUTING DEVICES FABRICATED WITH ION IMPLANT METHODS
    38.
    发明申请
    TWO-SIDED MAJORANA FERMION QUANTUM COMPUTING DEVICES FABRICATED WITH ION IMPLANT METHODS 有权

    公开(公告)号：US20210143312A1

    公开(公告)日：2021-05-13

    申请号：US16680117

    申请日：2019-11-11

    Applicant: International Business Machines Corporation

    Inventor： Steven J. Holmes ,  Stephen W. Bedell ,  Sean Hart ,  Devendra K. Sadana ,  Ning Li ,  Patryk Gumann

    IPC: H01L39/10 ,  H01L27/18 ,  H01L39/24

    Abstract: A quantum computing device is fabricated by forming, on a superconductor layer, a first resist pattern defining a device region and a sensing region within the device region. The superconductor layer within the sensing region is removed, exposing a region of a first surface of an underlying semiconductor layer outside the device region. The exposed region of the semiconductor layer is implanted, forming an isolation region surrounding the device region. The sensing region and a portion of the device region of the superconductor layer are exposed. A sensing region contact is formed by coupling the first surface of the semiconductor layer with a first metal layer. A nanorod contact using the first metal within the portion of the device region outside the sensing region is formed. By depositing a second metal layer on a second surface of the semiconductor layer within the sensing region, a tunnel junction gate is formed.

    Superconducting interposer for optical transduction of quantum information
    39.
    发明授权
    Superconducting interposer for optical transduction of quantum information 有权

    公开(公告)号：US11005574B2

    公开(公告)日：2021-05-11

    申请号：US16455043

    申请日：2019-06-27

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Nicholas T. Bronn ,  Daniela F. Bogorin ,  Patryk Gumann ,  Sean Hart ,  Salvatore B. Olivadese ,  Jason S. Orcutt

    IPC: H04B10/04 ,  H04B10/70 ,  G06N10/00

    Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.

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