摘要:
A programmable non-volatile semiconductor memory device includes a select gate 3, arranged in a first region on a substrate, a floating gate 6 arranged in a second region neighboring to the first region, a first diffusion region 7 provided in a third region neighboring to the second region, a control gate 11 arranged on the floating gate 6, and a driving circuit 22 adapted for controlling voltages applied to the substrate 1 (well 1a), select gate 3, first diffusion region 7 and control gate 11. The driving circuit performs control so that, during erasure operation, voltages applied to select gate 3 and the control gate 11 are negative, with the remaining voltage, applied to the substrate 1 (or well 1a), being positive. The device permits erasure operation at a lower voltage.
摘要:
A semiconductor memory device comprises diffusion regions, a floating gate, a third diffusion region, a selection gate electrode, and a control gate electrode that three-dimensionally crosses the selection gate electrode and extends in a direction orthogonal to the selection gate electrode are included. A channel formed immediately below the selection gate and which constitutes a passage connecting the two diffusion regions has a shape in a top view, including a first path extending in one direction, from one diffusion region, and a second path extending from the end of the first path to the other diffusion region in a direction orthogonal to a first direction.
摘要:
A programmable non-volatile semiconductor memory device having which a sufficient operational margin with miniaturized memory cells. The memory device includes select gates 3, arranged in a first region on a substrate 1, floating gates 6, arranged in a second region, neighboring to the first region, first diffusion regions 7, arranged in a third region neighboring to the second region, and control gates 11 arranged above the floating gates 6. It also includes a driving circuit 22 for controlling the voltages applied to the substrate 1, select gates 3, first diffusion areas 7 and the controlling gates 11. At the time of reprogramming, the driving circuit 22 controls the voltages for first control and second control. The first control sets a low threshold voltage state, inclusive of the depletion state, for the bits, connected to a selected one of the control gates 11. The second control sets a low threshold voltage state or a high threshold voltage state of a desired enhancement state from one bit to another.
摘要:
A drive circuit 22 controls voltages applied to a substrate 1, selection gates SG0 and SG1, a local bit line LB2, and a control gate CGn. By respectively applying a negative voltage to the control gate CGn, a positive voltage to the selection gate SG0, a voltage lower than the voltage applied to the selection gate SG0 to the selection gate SG1, and a positive voltage to the local bit line LB2, the drive circuit 22 controls so that electrons are selectively drawn out of a floating gate FG3 to the local bit line LB2 by F-N tunneling during writing operation. Sufficient operation margin is obtained even when memory cells are miniaturized.
摘要:
A nonvolatile semiconductor storage device in which one unit cell comprises a select gate 3 (3a-3i) provided in a first region on a substrate 1; a floating gate 6 provided in a second region adjacent to the first region; a diffused region 7b adjacent to the second region and provided in a third region on the surface of the substrate 1; and a control gate 11 provided on the floating gate 6. The select gate 3 is divided into three or more in an erase block 23 composed of all unit cells, from each of which electrons are extracted from the floating gate, at the same time when an erase operation is performed. Each of the select gates 3a-3i, created by the division, is formed in a comb-like shape in which, when viewed from the direction of a normal line to a plane, a plurality of comb teeth extend from a common line. The comb teeth of a select gate (for example, 3b) are arranged in gaps between the comb teeth of an adjacent select gate (for example, 3a, 3c) at a predetermined spacing.
摘要:
The present invention provides a flash memory having a split gate structure and virtual ground array structure, wherein a high impurity concentration region of a first conductivity type is provided in a drain adjacent region of a channel region under a floating gate electrode, and the high impurity concentration region has a highest impurity concentration in the channel region, and wherein a low impurity concentration region of a first conductivity type is provided in the channel region but at a part not covered by the floating gate.
摘要:
A nonvolatile semiconductor memory device having a semiconductor substrate of a first conductive type, a floating gate and a control gate provided on the semiconductor substrate, at least a pair of impurity diffusion layers of a second conductive type defining source and drain and disposed in the semiconductor substrate in a spaced relation to each other so as to define a channel having a region covered with the floating gate and a region uncovered with the floating gate, the region uncovered with the floating gate defining a split gate, a first impurity diffusion layer region formed in the semiconductor substrate so as to be disposed at least at an area between the pair of diffusion layers, and a second impurity diffusion layer region having an impurity concentration lower than the first impurity diffusion layer region and formed in the semiconductor substrate so as to be disposed at the split gate.
摘要:
Disclosed is a semiconductor storage device having a trench around a bit-line diffusion region in an area of a p-well, which constitutes a memory cell area, that is not covered by a word line and a select gate that intersects the word line. An insulating film is buried in the trench.
摘要:
A programmable non-volatile semiconductor memory device includes a select gate 3, arranged in a first region on a substrate, a floating gate 6 arranged in a second region neighboring to the first region, a first diffusion region 7 provided in a third region neighboring to the second region, a control gate 11 arranged on the floating gate 6, and a driving circuit 22 adapted for controlling voltages applied to the substrate 1 (well 1a), select gate 3, first diffusion region 7 and control gate 11. The driving circuit performs control so that, during erasure operation, voltages applied to select gate 3 and the control gate 11 are negative, with the remaining voltage, applied to the substrate 1 (or well 1a), being positive. The device permits erasure operation at a lower voltage.
摘要:
A semiconductor storage device in which product cost is reduced includes a memory cell section (cells belonging to word lines) and a bypass section (cells belonging to bypass word lines). The memory cell section has a select gate, floating gates, a first diffusion region, a second diffusion region and a first control gate. The bypass section has the first select gate, the first diffusion region, the second diffusion region and a second control gate. The second control gate controls a channel in an area between the select gate and the first diffusion region or between the select gate and the second diffusion region. The channel of the bypass section becomes a current supply path when a cell of the memory cell section is read out.