公开(公告)号：US20200183085A1

公开(公告)日：2020-06-11

申请号：US16313503

申请日：2016-06-30

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad MENTOVICH ,  Itshak KALIFA ,  Sylvie ROCKMAN ,  Anna SANDOMIRSKY ,  Giannis POULOPOULOS ,  Dimitrios KALAVROUZIOTIS ,  Paraskevas BAKOPOULOS ,  Hercules AVRAMOPOULOS ,  Xin YIN ,  Geert VAN STEENBERGE

IPC: G02B6/122

Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

公开(公告)号：US20250055562A1

公开(公告)日：2025-02-13

申请号：US18933039

申请日：2024-10-31

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Paraskevas BAKOPOULOS ,  Ioannis (Giannis) PATRONAS ,  Nikolaos ARGYRIS ,  Dimitrios SYRIVELIS ,  Elad MENTOVICH ,  Dimitrios KALAVROUZIOTIS ,  Avraham GANOR ,  Nimer HAZIN

IPC: H04B10/038 ,  H04B10/112 ,  H04B10/40

Abstract: A datacenter environment having a plurality of servers, leaf switches, and spine switches is presented. A transceiver module facilitates reliable data transmission across network layers. The transceiver module includes a first optical module to facilitate data transmission between a server and a leaf switch, and a second optical module to facilitate data transmission between the leaf switch and a spine switch. An adapter operatively coupled to both optical modules manages data flow under different configurations. In a first configuration, the adapter receives first data from the server via the first optical module and second data from the leaf switch via the second optical module. Upon detecting an operational failure in the first optical module, the adapter terminates reception of second data from the leaf switch and switches to a second configuration, in which it redirects the first data from the server through the second optical module.

公开(公告)号：US20250004200A1

公开(公告)日：2025-01-02

申请号：US18883522

申请日：2024-09-12

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Elad MENTOVICH ,  Dimitrios KALAVROUZIOTIS ,  Jonathan LUFF ,  Wei QIAN ,  Dazeng FENG

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/30 ,  G02F1/015

Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.

公开(公告)号：US20240310662A1

公开(公告)日：2024-09-19

申请号：US18120802

申请日：2023-03-13

Applicant: Mellanox Technologies, Ltd.

Inventor： Moshe B. ORON ,  Oren STEINBERG ,  Isabelle CESTIER ,  Elad MENTOVICH ,  Timothy DE KEULENAER

IPC: G02F1/035 ,  G02F1/03

CPC classification number: G02F1/035 ,  G02F1/0311 ,  G02F1/0316

Abstract: Systems and methods are described herein for an electro-absorption modulator (EAM) device. An example EAM device comprises an optical waveguide comprising a waveguide core configured to facilitate a propagation of an optical signal therethrough; a segmented traveling wave electrode structure comprising electrode segments disposed on the optical waveguide; and an electrical transmission line operatively coupled to the electrode segments via conducting bridges, wherein the electrical transmission line is configured to facilitate a propagation of an electrical signal therethrough, wherein the electrode segments are configured to overcome bandwidth and extinction ratio constraints of a lumped EAM.

公开(公告)号：US20230408573A1

公开(公告)日：2023-12-21

申请号：US18227127

申请日：2023-07-27

Applicant: Mellanox Technologies, Ltd.

Inventor： Tatyana Antonenko ,  Yaakov GRIDISH ,  Tamir SHARKAZ ,  Itshak KALIFA ,  Elad MENTOVICH

IPC: G01R31/26 ,  G01R1/04 ,  H01S5/00

CPC classification number: G01R31/2642 ,  G01R1/0441 ,  H01S5/0021

Abstract: Disclosed are a testing unit, system, and method for testing and predicting failure of optical receivers. The testing unit and system are configured to apply different values of current, voltage, heat stress, and illumination load on the optical receivers during testing. The test methods are designed to check dark current, photo current, forward voltage, and drift over time of these parameters.

公开(公告)号：US20230007789A1

公开(公告)日：2023-01-05

申请号：US17305238

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  Bar-Ilan University

Inventor： Elad MENTOVICH ,  Boaz Atias ,  Doron Naveh ,  Adi Levi

IPC: H05K3/46

Abstract: Processes for creating a two-dimensional-target structure are disclosed. An example process to create a two-dimensional-target structure may include the process of providing two-dimensional material grown on an initial substrate to create a two-dimensional-substrate structure; applying the two-dimensional-substrate structure to a target substrate via an adhesion promoter to create a lamination stack; applying a lamination process to the lamination stack; and then removing the initial substrate from the lamination stack, post-lamination, to create the two-dimensional-target structure. The two-dimensional-target structure may then be used in such rigid or flexible electronic devices and/or non-standard devices as the target substrate may be rigid or flexible and/or translucent in contrast to the initial substrate first used to grow the two-dimensional material.

公开(公告)号：US20220377912A1

公开(公告)日：2022-11-24

申请号：US17305205

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  BAR-ILAN UNIVERSITY ,  PCB Technologies Ltd

Inventor： Boaz ATIAS ,  Elad MENTOVICH ,  Yaniv ROTEM ,  Doron NAVEH ,  Adi LEVI ,  Yosi BEN-NAIM ,  Yaad ELIYA ,  Shlomo DANINO ,  Eran LIPP

IPC: H05K3/46 ,  H05K3/38 ,  C01B32/184

Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

公开(公告)号：US20220372621A1

公开(公告)日：2022-11-24

申请号：US17305206

申请日：2021-07-01

Applicant: MELLANOX TECHNOLOGIES, LTD. ,  BAR-ILAN UNIVERSITY ,  RAMOT AT TEL-AVIV UNIVERSITY LTD. ,  SIMTAL NANO-COATINGS LTD

Inventor： Elad MENTOVICH ,  Yaniv ROTEM ,  Yaakov GRIDISH ,  Doron NAVEH ,  Chen STERN ,  Yosi BEN-NAIM ,  Ariel ISMACH ,  Eran BAR-RABI ,  Tal KAUFMAN

IPC: C23C16/458

Abstract: A substrate carrier and a mechanism for moving the substrate carrier through a chemical vapor deposition system are provided. The substrate carrier includes a cylindrical housing having an interior surface. A plurality of plurality of shelves fixed to the interior surface, each shelf configured to support at least one substrate. The substrate carrier may include a connector configured to engage the substrate carrier with the mechanism. The mechanism may include a moveable arm and a motor configured to actuate the moveable arm. The moveable arm may include an actuating member connected to the motor and configured to move the moveable arm between a retracted state and an extended state. The moveable arm may be configured to operate in a chamber having a first pressure and a first temperature and the motor may be configured to operate in an environment having a second pressure.

公开(公告)号：US20220365293A1

公开(公告)日：2022-11-17

申请号：US17755388

申请日：2019-11-06

Applicant: MELLANOX TECHNOLOGIES LTD.

Inventor： Dimitrios KALAVROUZIOTIS ,  Tamir SHARKAZ ,  Yuri BERK ,  Elad MENTOVICH

IPC: G02B6/42 ,  G03F7/00

Abstract: Various embodiments provide a method for fabricating a couplable electro-optical device. In an example embodiment, the method includes fabricating at least one raw electro-optical device on a substrate; applying lens material to a working stamp; aligning the substrate and the working stamp; pressing the substrate onto the lens material until the distance between the substrate and the working stamp is a predetermined distance; and curing the lens material to form an integrated lens secured to the at least one electro-optical device on the substrate. An anti-reflective coating layer may be optionally applied on top of the molded lens. The couplable electro-optical device may be incorporated into a receiver, transmitter, and/or transceiver using passive alignment to align the couplable electro-optical device to an optical fiber.

公开(公告)号：US20220352985A1

公开(公告)日：2022-11-03

申请号：US17306210

申请日：2021-05-03

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad MENTOVICH ,  Itshak KALIFA ,  Hanan SHUMACHER ,  Yoram ZER ,  Yaakov GRIDISH ,  Eyal WALDMAN

IPC: H04B10/25 ,  H04B10/50 ,  H04B10/60

Abstract: Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.