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    PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS
    4.
    发明申请
    PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS AND PRINTED CIRCUIT BOARDS 有权

    公开(公告)号：US20220377907A1

    公开(公告)日：2022-11-24

    申请号：US17305233

    申请日：2021-07-01

    申请人： Mellanox Technologies, Ltd. ,  Bar-Ilan University

    发明人： Elad MENTOVICH ,  Boaz ATIAS ,  Doron NAVEH ,  Eilam Zigi Ben SMOLINSKY ,  Adi LEVI

    IPC分类号： H05K3/22 ,  H05K1/02 ,  C01B32/188

    摘要： Processes for localized lasering of a lamination stack and graphene-coated printed circuit board (PCB) are disclosed. An example PCB may include a lamination stack, post-lamination, that may further include a core, an adhesive layer, and at least one graphene-metal structure. A top layer of graphene of the graphene-metal structure may have never been grown before the lamination process or may have been removed post-lamination such that a portion of the top layer of graphene is missing. The localized lasering process described herein may grow (for the first time) or re-grow the graphene layer of the exposed portion of the metal layer without adverse effects to the rest of the lamination stack or PCB and while promoting a uniform layer of graphene on the top surface. A process of growing graphene through application of molecular layer and a self-assembled monolayer (SAM), are also described herein.

    PROCESS FOR APPLYING A TWO-DIMENSIONAL MATERIAL TO A TARGET SUBSTRATE POST-LAMINATION
    5.
    发明申请
    PROCESS FOR APPLYING A TWO-DIMENSIONAL MATERIAL TO A TARGET SUBSTRATE POST-LAMINATION 有权

    公开(公告)号：US20230007789A1

    公开(公告)日：2023-01-05

    申请号：US17305238

    申请日：2021-07-01

    申请人： Mellanox Technologies, Ltd. ,  Bar-Ilan University

    发明人： Elad MENTOVICH ,  Boaz Atias ,  Doron Naveh ,  Adi Levi

    IPC分类号： H05K3/46

    摘要： Processes for creating a two-dimensional-target structure are disclosed. An example process to create a two-dimensional-target structure may include the process of providing two-dimensional material grown on an initial substrate to create a two-dimensional-substrate structure; applying the two-dimensional-substrate structure to a target substrate via an adhesion promoter to create a lamination stack; applying a lamination process to the lamination stack; and then removing the initial substrate from the lamination stack, post-lamination, to create the two-dimensional-target structure. The two-dimensional-target structure may then be used in such rigid or flexible electronic devices and/or non-standard devices as the target substrate may be rigid or flexible and/or translucent in contrast to the initial substrate first used to grow the two-dimensional material.

    SEALED OPTOELECTRONIC COMPONENTS AND ASSOCIATED OPTICAL DEVICES
    7.
    发明公开
    SEALED OPTOELECTRONIC COMPONENTS AND ASSOCIATED OPTICAL DEVICES 审中-公开

    公开(公告)号：US20230246419A1

    公开(公告)日：2023-08-03

    申请号：US17672936

    申请日：2022-02-16

    申请人： Mellanox Technologies, Ltd.

    发明人： Anders LARSSON ,  Dimitrios KALAVROUZIOTIS ,  Attila FULOP ,  Filip Leonard Hjort ,  Elad MENTOVICH

    IPC分类号： H01S5/183 ,  H04B10/50 ,  H04B10/40 ,  H01S5/022

    CPC分类号： H01S5/183 ,  H01S5/022 ,  H04B10/40 ,  H04B10/503

    摘要： Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.

    INTERNALLY WIRELESS DATACENTER RACK
    8.
    发明申请
    INTERNALLY WIRELESS DATACENTER RACK 审中-公开

    公开(公告)号：US20190098793A1

    公开(公告)日：2019-03-28

    申请号：US15717399

    申请日：2017-09-27

    申请人： Mellanox Technologies, Ltd.

    发明人： Yaakov GRIDISH ,  Elad MENTOVICH ,  Eitan ZAHAVI ,  Sylvie ROCKMAN

    IPC分类号： H05K7/14 ,  H04B7/24

    摘要： An internally wireless datacenter rack configured to support datacenter computing equipment is provided. The datacenter rack includes a housing configured to receive a first networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The housing includes a second networking box including a printed circuit board assembly and one or more wireless connectors in electrical communication with the printed circuit board assembly. The one or more wireless connectors convert between electrical signals and optical signals. The datacenter rack includes a wireless free space region within the housing, and the wireless free space region includes a wireless reflective backplane that allows free space wireless communication between the first networking box and the second networking box.

    DYNAMIC BANDWIDTH CONNECTIONS
    9.
    发明申请
    DYNAMIC BANDWIDTH CONNECTIONS 有权

    公开(公告)号：US20220283973A1

    公开(公告)日：2022-09-08

    申请号：US17636484

    申请日：2019-08-21

    申请人： Mellanox Technologies, Ltd.

    发明人： Dotan LEVI ,  Elad MENTOVICH ,  Ran RAVID ,  Roee SHAPIRO ,  Avraham GANOR ,  Paraskevas BAKOPOULOS ,  Dimitrios KALAVROUZIOTIS

    IPC分类号： G06F13/40 ,  G06F13/42

    摘要： Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.

    OPTICAL COMPONENTS WITH REDUCED INTERFERENCE
    10.
    发明申请
    OPTICAL COMPONENTS WITH REDUCED INTERFERENCE 有权

    公开(公告)号：US20220163740A1

    公开(公告)日：2022-05-26

    申请号：US17341645

    申请日：2021-06-08

    申请人： Mellanox Technologies, Ltd.

    发明人： Dimitrios KALAVROUZIOTIS ,  Sylvie ROCKMAN ,  Elad MENTOVICH ,  Tamir SHARKAZ ,  Yaakov GRIDISH ,  Anna SANDOMIRSKY

    IPC分类号： G02B6/42

    摘要： Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.