公开(公告)号：US10112053B2

公开(公告)日：2018-10-30

申请号：US15897147

申请日：2018-02-14

Applicant: MEDTRONIC, INC.

Inventor： Michael J. Baade ,  Katherine J. Bach ,  Steven T. Deininger

IPC: A61N1/37 ,  A61N1/375

Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.

公开(公告)号：US20180015290A1

公开(公告)日：2018-01-18

申请号：US15650665

申请日：2017-07-14

Applicant: MEDTRONIC, INC.

Inventor： Steven T. Deininger ,  Michael J. Baade ,  Charles E. Peters

IPC: A61N1/375

Abstract: Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances.

公开(公告)号：US20170157405A1

公开(公告)日：2017-06-08

申请号：US15437429

申请日：2017-02-20

Applicant: Medtronic, Inc.

Inventor： Steven T. Deininger ,  Michael J. Baade ,  Rajesh V. Iyer

IPC: A61N1/375 ,  H01R43/26 ,  H01R13/52 ,  H05K7/14

CPC classification number: A61N1/3754 ,  A61N1/375 ,  H01G4/35 ,  H01R4/029 ,  H01R13/516 ,  H01R13/5224 ,  H01R24/58 ,  H01R43/26 ,  H01R2107/00 ,  H01R2201/12 ,  H05K7/02 ,  H05K7/1427 ,  Y10T29/4913 ,  Y10T29/49208

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.