公开(公告)号：US20140209582A1

公开(公告)日：2014-07-31

申请号：US14242390

申请日：2014-04-01

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Charles M. Watkins ,  William M. Hiatt

IPC: B23K26/03 ,  B23K26/36 ,  B23K26/38

CPC classification number: B23K26/382 ,  B23K26/03 ,  B23K26/0342 ,  B23K26/361 ,  B23K26/362 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/486 ,  H01L21/76898 ,  H05K3/0026 ,  H05K2203/163 ,  Y10T29/49165

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Abstract translation: 本文公开了用于在微特征工件中形成孔的系统和方法。 在一个实施例中，一种方法包括将激光束引向微特征工件以形成孔径并且感测激光束实时地通过微特征工件。 该方法还可以包括确定激光束的脉冲数量和/或经过的时间以形成孔径并且基于所确定的脉冲数量和/或确定的经过时间来控制激光束以形成第二孔径 微特工件。