公开(公告)号：US12015114B2

公开(公告)日：2024-06-18

申请号：US18311834

申请日：2023-05-03

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L21/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L33/64 ,  H01L25/075

CPC classification number: H01L33/64 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/52 ,  H01L33/644 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0075 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US11688842B2

公开(公告)日：2023-06-27

申请号：US17588576

申请日：2022-01-31

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L21/00 ,  H01L33/64 ,  H01L33/50 ,  H01L33/44 ,  H01L33/52 ,  H01L25/075

CPC classification number: H01L33/64 ,  H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L33/52 ,  H01L33/644 ,  H01L25/0753 ,  H01L33/508 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0075 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US10403805B2

公开(公告)日：2019-09-03

申请号：US15652632

申请日：2017-07-18

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L21/00 ,  H01L33/64 ,  H01L33/50 ,  H01L33/44 ,  H01L33/52 ,  H01L25/075

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US09452492B2

公开(公告)日：2016-09-27

申请号：US14242390

申请日：2014-04-01

Applicant: Micron Technology, Inc.

Inventor： Charles M. Watkins ,  William M. Hiatt

IPC: B23K26/03 ,  B23K26/38 ,  H01L21/768 ,  H05K3/00 ,  H01L21/48 ,  B23K26/36 ,  B23K26/40

CPC classification number: B23K26/382 ,  B23K26/03 ,  B23K26/0342 ,  B23K26/361 ,  B23K26/362 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/486 ,  H01L21/76898 ,  H05K3/0026 ,  H05K2203/163 ,  Y10T29/49165

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

公开(公告)号：US20140238298A1

公开(公告)日：2014-08-28

申请号：US14269348

申请日：2014-05-05

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/00

CPC classification number: H01L33/005 ,  B05C11/00

Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

Abstract translation: 本文公开了半导体系统的几个实施例和颜色校正的相关联的方法。 在一个实施例中，一种制造发光二极管（LED）的方法包括在衬底上形成（LED），测量所形成的LED的基极发射特性，并且基于所形成的LED的测量的基极发射特性来选择荧光体 使得来自LED和磷光体的组合发射至少近似于白光。 该方法还包括通过例如喷墨印刷将所选择的荧光体引入到LED上。

公开(公告)号：US08669179B2

公开(公告)日：2014-03-11

申请号：US13940034

申请日：2013-07-11

Applicant: Micron Technology, Inc.

Inventor： Salman Akram ,  Charles M. Watkins ,  William M. Hiatt ,  David R. Hembree ,  James M. Wark ,  Warren M. Farnworth ,  Mark E. Tuttle ,  Sidney B. Rigg ,  Steven D. Oliver ,  Kyle K. Kirby ,  Alan G. Wood ,  Lu Velicky

IPC: H01L21/4763

CPC classification number: H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract translation: 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。

公开(公告)号：US20230275202A1

公开(公告)日：2023-08-31

申请号：US18311834

申请日：2023-05-03

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/64 ,  H01L33/50 ,  H01L33/44 ,  H01L33/52

CPC classification number: H01L33/64 ,  H01L33/507 ,  H01L33/644 ,  H01L33/44 ,  H01L33/50 ,  H01L33/52 ,  H01L2924/0002 ,  H01L25/0753

Abstract: Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

公开(公告)号：US20210343892A1

公开(公告)日：2021-11-04

申请号：US17373200

申请日：2021-07-12

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/00 ,  B05C11/00

Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

公开(公告)号：US20190296183A1

公开(公告)日：2019-09-26

申请号：US16434956

申请日：2019-06-07

Applicant: Micron Technology, Inc.

Inventor： Kevin Tetz ,  Charles M. Watkins

IPC: H01L33/00 ,  B05C11/00

Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.

公开(公告)号：US09530927B2

公开(公告)日：2016-12-27

申请号：US14874231

申请日：2015-10-02

Applicant: Micron Technology, Inc.

Inventor： Cem Basceri ,  Thomas Gehrke ,  Charles M. Watkins

IPC: H01L21/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/06 ,  H01L33/08 ,  H01L33/38

CPC classification number: H01L33/0075 ,  H01L33/005 ,  H01L33/06 ,  H01L33/08 ,  H01L33/38 ,  H01L33/502 ,  H01L33/508 ,  H01L2933/0033 ,  H01L2933/0041

Abstract: Various embodiments of light emitting devices with built-in chromaticity conversion and associated methods of manufacturing are described herein. In one embodiment, a method for manufacturing a light emitting device includes forming a first semiconductor material, an active region, and a second semiconductor material on a substrate material in sequence, the active region being configured to produce a first emission. A conversion material is then formed on the second semiconductor material. The conversion material has a crystalline structure and is configured to produce a second emission. The method further includes adjusting a characteristic of the conversion material such that a combination of the first and second emission has a chromaticity at least approximating a target chromaticity of the light emitting device.