公开(公告)号：US09337402B2

公开(公告)日：2016-05-10

申请号：US14548102

申请日：2014-11-19

申请人： NICHIA CORPORATION

发明人： Tadaaki Ikeda

IPC分类号： H01L21/00 ,  H01L33/56 ,  H01L33/00 ,  H01L33/54

CPC分类号： H01L33/56 ,  H01L33/0079 ,  H01L33/54 ,  H01L2224/13 ,  H01L2924/10157 ,  H01L2933/0033

摘要： The method for manufacturing the semiconductor light emitting device includes steps of forming a plurality of semiconductor light emitting element regions on a substrate, forming a recess portion between the plurality of semiconductor light emitting element regions on a surface of the substrate, disposing a light reflective sealing resin on the substrate to cover the plurality of semiconductor light emitting element regions with the sealing resin and to fill the recess portion with a part of the sealing resin that covers the plurality of semiconductor light emitting element regions, removing the substrate, disposing a light transmissive resin on surfaces of the plurality of semiconductor light emitting element regions where the substrate has been removed, and dividing the plurality of semiconductor light emitting element regions into individual pieces, wherein the recess portion includes a first recess portion and one or more second recess portions shallower than the first recess portion.

摘要翻译： 半导体发光器件的制造方法包括以下步骤：在衬底上形成多个半导体发光元件区域，在衬底的表面上的多个半导体发光元件区域之间形成凹部，设置光反射密封 树脂，用密封树脂覆盖多个半导体发光元件区域，并且用覆盖多个半导体发光元件区域的密封树脂的一部分填充凹部，去除基板，设置透光的 在去除了基板的多个半导体发光元件区域的表面上的树脂，并将多个半导体发光元件区域分割成单独的片，其中凹部包括第一凹部和一个或多个第二凹部 比第一个凹槽 上。