公开(公告)号：US09818968B2

公开(公告)日：2017-11-14

申请号：US14917028

申请日：2014-09-03

Applicant: OSRAM OLED GmbH

Inventor： Andrew Ingle ,  Kilian Regau

IPC: H01L29/08 ,  H01L51/52 ,  H05B33/08 ,  H01L51/44 ,  H01L51/56

CPC classification number: H01L51/52 ,  H01L51/44 ,  H01L51/56 ,  H01L2251/5361 ,  H05B33/0848

Abstract: Various embodiments may relate to an optoelectronic component. The optoelectronic component may include a planar optically active structure and an electric circuit structure. The planar optically active structure is designed to receive and/or provide electromagnetic radiation. The electric circuit structure is designed such that it provides an output value. The output value is dependent on at least one operational parameter of the optically active structure.

公开(公告)号：US09651203B2

公开(公告)日：2017-05-16

申请号：US14650551

申请日：2013-11-29

Applicant: OSRAM OLED GmbH

Inventor： Karsten Diekmann ,  Christoph Gärditz ,  Christian Kristukat ,  Stefan Gschlöβl ,  Benjamin Claus Krummacher ,  Jörg Farrnbacher ,  Kilian Regau

IPC: H01L51/50 ,  F21K99/00 ,  F21V23/00 ,  F21V23/06 ,  F21V19/00 ,  F21V29/70 ,  F21S8/00 ,  F21K9/20 ,  F21Y105/00 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y115/15

CPC classification number: F21K9/20 ,  F21S8/00 ,  F21V19/002 ,  F21V23/005 ,  F21V23/06 ,  F21V29/70 ,  F21Y2105/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  F21Y2115/15 ,  H01L2251/5361 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In at least one embodiment, a light panel system includes a system carrier with a carrier front face. Multiple organic light emitting diodes are arranged in a uniform grid on the carrier front face. An electronics driver is fitted to or in the system carrier. The light panel system can be handled and mounted as a single unit.

公开(公告)号：US20160118622A1

公开(公告)日：2016-04-28

申请号：US14979624

申请日：2015-12-28

Applicant: OSRAM OLED GmbH

Inventor： Benjamin Krummacher ,  Joerg Farrnbacher ,  Simon Schicktanz ,  Kilian Regau

IPC: H01L51/52 ,  H01L51/44 ,  H01L51/56

CPC classification number: H01L51/5253 ,  H01L51/441 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/524 ,  H01L51/56 ,  H01L2251/5361 ,  H01L2251/558

Abstract: Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.

Abstract translation: 各种实施例可以涉及光电子部件，包括形成用于吸收和/或提供电磁辐射的光学有源区域，至少一个第一接触结构，其中光学有源区域电导耦合到第一接触结构，以及 具有第二接触结构的封装结构，其中所述封装结构形成在所述光学有源区域和所述第一接触结构上或上方，以及形成用于将所述第一接触结构导电连接到所述第二接触结构的导电结构，其中所述封装 结构至少部分地由电绝缘模塑料形成，其中电绝缘模塑料至少部分地围绕导电结构。