Abstract:
Various embodiments may relate to a component. The component includes an optically active region designed for electrically controllably transmitting, reflecting, absorbing, emitting and/or converting an electromagnetic radiation, and an optically inactive region formed alongside the optically active region, wherein the optically inactive region and/or the optically active region have/has an adaptation structure designed to adapt the value of an optical variable in the optically inactive region to a value of the optical variable in the optically active region.
Abstract:
A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.
Abstract:
A radiation emitting apparatus including a substrate, at least one layer sequence arranged on the substrate and producing electromagnetic radiation in a wavelength range, having at least one first electrode surface, at least one second electrode surface, and at least one functional layer between the first electrode surface and the second electrode surface, wherein the functional layer produces electromagnetic radiation in the wavelength range in a switched-on operating state, and a scatter layer having a first region and a second region, wherein radiation produced by the functional layer is directly incident on the scatter layer only in the first region of the scatter layer, and the scatter layer at least partially scatters radiation incident upon the first region of the scatter layer so that said radiation enters the second region of the scatter layer.
Abstract:
An optical element includes a light guide plate with a first major surface and with a second major surface opposite the first major surface and with side faces connecting the first and second major surfaces, wherein the light guide plate includes a matrix material transparent to ultraviolet light in which scattering centers are embedded, at least one light-emitting semiconductor device that couples ultraviolet light into the light guide plate via a side face when in operation, a first filter layer on the first major surface and a second filter layer on the second major surface, wherein the filter layers opaque to ultraviolet light and at least partially transparent to visible light, and a first photochromic layer at least on the first major surface, between the light guide panel and the first filter layer, with a transparency to visible light by ultraviolet light.
Abstract:
An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.
Abstract:
An optoelectronic component may include an electrically conductive carrier structure having a first contact section and a carrier section, an organic functional layer structure which is formed above the carrier structure and which overlaps the carrier section and which does not overlap the first contact section, an electrically conductive covering structure, which is formed above the organic functional layer structure and which includes a covering section and a second contact section, wherein the covering section overlaps the organic functional layer structure and the carrier section, wherein the first contact section projects below the organic functional layer structure on a first side and on a third side of the optoelectronic component.