公开(公告)号：US10455131B2

公开(公告)日：2019-10-22

申请号：US14932075

申请日：2015-11-04

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

IPC: G02B13/00 ,  H04N5/225 ,  B29D11/00 ,  B29C45/16 ,  B29C45/14 ,  B29L11/00 ,  B29L31/34

Abstract: A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.

公开(公告)号：US20190131771A1

公开(公告)日：2019-05-02

申请号：US15795130

申请日：2017-10-26

Applicant: OmniVision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen

IPC: H01S5/183 ,  H01S3/08 ,  H01L21/02

CPC classification number: H01S5/18388 ,  H01L21/02008 ,  H01S3/08009

Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.

公开(公告)号：US10122903B2

公开(公告)日：2018-11-06

申请号：US15193031

申请日：2016-06-25

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

IPC: H04N5/225 ,  H01L27/146

Abstract: A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.

公开(公告)号：US20170374252A1

公开(公告)日：2017-12-28

申请号：US15193031

申请日：2016-06-25

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Ping Chen ,  Tsung-Wei Wan

IPC: H04N5/225 ,  H01L27/146

CPC classification number: H04N5/2257 ,  H01L27/14687 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254

Abstract: A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip.

公开(公告)号：US20150358510A1

公开(公告)日：2015-12-10

申请号：US14301124

申请日：2014-06-10

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Tsung-Wei Wan ,  Jau-Jan Deng ,  Wei-Ping Chen

IPC: H04N5/225 ,  H04N5/235

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.

Abstract translation: 一种装置包括结合到间隔件的图像传感器。 间隔件具有在隔离件的第一端处限定了内壁中的台阶和凹部的变薄的壁。 图像传感器被结合到间隔件的凹部内的台阶上，使得图像传感器完全接受在间隔件的凹部内。 玻璃晶片安装在间隔件的第二端上。 透镜安装在玻璃晶片上，使得光被引导通过透镜到图像传感器。

公开(公告)号：US20150116562A1

公开(公告)日：2015-04-30

申请号：US14064813

申请日：2013-10-28

Applicant: Omnivision Technologies, Inc.

Inventor： Tsung-Wei Wan ,  Wei-Ping Chen ,  Jui-Yi Chiu

IPC: H04N5/378 ,  H04N5/369

CPC classification number: H04N5/2254 ,  H01L27/14627 ,  H01L2224/48227 ,  H04N5/2252

Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.

Abstract translation: 一种装置包括分割成N个图像传感器区域的图像传感器。 图像传感器连接到电路板。 包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。 将间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构 设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。