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公开(公告)号：US10333277B2
公开(公告)日：2019-06-25
申请号：US15795130
申请日：2017-10-26
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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公开(公告)号：US20180324336A1
公开(公告)日：2018-11-08
申请号：US15585483
申请日：2017-05-03
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
CPC classification number: H04N5/2254 , A61B1/00096 , A61B1/00186 , A61B1/051 , G02B13/0055 , G02B13/0085 , G02B23/2407 , G02B23/2484 , G03B11/045 , G03B17/08 , H04N5/2257 , H04N2005/2255
Abstract: A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.
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公开(公告)号：US09386203B2
公开(公告)日：2016-07-05
申请号：US14064813
申请日：2013-10-28
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2254 , H01L27/14627 , H01L2224/48227 , H04N5/2252
Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.
Abstract translation: 一种装置包括分割成N个图像传感器区域的图像传感器。 图像传感器连接到电路板。 包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。 间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构 设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。
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公开(公告)号：US11280988B2
公开(公告)日：2022-03-22
申请号：US16120966
申请日：2018-09-04
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan , Jau-Jan Deng
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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5.发明授权公开(公告)号：US09902120B2
公开(公告)日：2018-02-27
申请号：US14616925
申请日：2015-02-09
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Jau-Jan Deng , Tsung-Wei Wan , Chuen-Yi Yin
CPC classification number: B29D11/0074 , B29K2995/0026 , G02B3/0006 , G02B3/0031 , G02B3/0056 , G02B5/045 , G02B13/006 , G02B13/0065
Abstract: A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.
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Patent Agency Ranking
公开(公告)号：US09467606B2
公开(公告)日：2016-10-11
申请号：US14301124
申请日：2014-06-10
Applicant: OMNIVISION TECHNOLOGIES, INC.
Inventor： Tsung-Wei Wan , Jau-Jan Deng , Wei-Ping Chen
IPC: H04N5/225
CPC classification number: H04N5/2254 , H04N5/2257
Abstract: An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.
Abstract translation: 一种装置包括结合到间隔件的图像传感器。 间隔件具有在隔离件的第一端处限定了内壁中的台阶和凹部的变薄的壁。 图像传感器被结合到间隔件的凹部内的台阶上，使得图像传感器完全接受在间隔件的凹部内。 玻璃晶片安装在间隔件的第二端上。 透镜安装在玻璃晶片上，使得光被引导通过透镜到图像传感器。
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7.发明申请公开(公告)号：US20200073097A1
公开(公告)日：2020-03-05
申请号：US16120966
申请日：2018-09-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Jau Jan Deng , Wei-Ping Chen
Abstract: A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.
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公开(公告)号：US10469718B2
公开(公告)日：2019-11-05
申请号：US15585483
申请日：2017-05-03
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
Abstract: A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.
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公开(公告)号：US09804367B2
公开(公告)日：2017-10-31
申请号：US14932368
申请日：2015-11-04
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei Wan , Wei-Ping Chen
CPC classification number: G02B13/0085 , B29D11/00307 , B29D11/00403 , B29K2995/0029 , G02B1/041 , G02B13/005
Abstract: A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.
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公开(公告)号：US09451137B2
公开(公告)日：2016-09-20
申请号：US14465292
申请日：2014-08-21
Applicant: OmniVision Technologies, Inc.
Inventor： Wei-Ping Chen , Tsung-Wei Wan
IPC: H04N5/225
CPC classification number: H04N5/2254
Abstract: A PCB-mountable lens adapter includes an adapter lens for being a component of an imaging system that has a second field of view different from the first field of view, the imaging system comprising the adapter lens and the camera lens; and an adapter housing for holding the adapter lens and for attaching to a PCB. A method for modifying the field of view of an camera module includes attaching a PCB-mountable lens adapter to a PCB, the PCB-mountable lens adapter including an adapter lens mounted in an adapter housing, the PCB being configured for surface-mounting of the camera module thereto.
Abstract translation: 一种可安装PCB的透镜适配器，包括：适配器透镜，用于成像系统的部件，该成像系统具有与第一视野不同的第二视野，该成像系统包括适配器透镜和照相机镜头; 以及用于保持适配器透镜并用于附接到PCB的适配器壳体。 一种用于修改相机模块的视野的方法包括将PCB可安装的镜头适配器附接到PCB，所述PCB可安装的镜头适配器包括安装在适配器壳体中的适配器镜头，所述PCB被配置为用于表面安装 相机模块。
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