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31.
公开(公告)号:US07732251B2
公开(公告)日:2010-06-08
申请号:US11870618
申请日:2007-10-11
IPC分类号: H01L21/00
CPC分类号: H01L29/7869 , H01L29/78648 , Y10T408/5633
摘要: One exemplary embodiment includes a semiconductor device. The semiconductor device can include a channel including one or more of a metal oxide including zinc-gallium, cadmium-gallium, cadmium-indium.
摘要翻译: 一个示例性实施例包括半导体器件。 半导体器件可以包括包括一种或多种包括锌镓,镉镓,镉铟的金属氧化物的沟道。
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公开(公告)号:US20100078634A1
公开(公告)日:2010-04-01
申请号:US12630632
申请日:2009-12-03
CPC分类号: H01L29/7869 , H01L29/78648
摘要: One exemplary embodiment includes a semiconductor device. The semiconductor device can include a channel including one or more of a metal oxide including zinc-germanium, zinc-lead, cadmium-germanium, cadmium-tin, cadmium-lead.
摘要翻译: 一个示例性实施例包括半导体器件。 半导体器件可以包括包括一种或多种包括锌 - 锗,锌 - 铅,镉 - 锗,镉 - 锡,镉 - 铅的金属氧化物的通道。
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公开(公告)号:US20100047476A1
公开(公告)日:2010-02-25
申请号:US12195673
申请日:2008-08-21
CPC分类号: C01B33/021
摘要: A Si nanoparticle precursor, precursor fabrication process, and precursor deposition process are presented. The method for forming a silicon (Si) nanoparticle precursor provides a plurality of nanoparticle classes, including at least one Si nanoparticle class. The nanoparticles in each nanoparticle class are defined as having a predetermined diameter. A predetermined amount of each nanoparticle class is measured and combined. For example, a first Si nanoparticle class may be provided having a largest diameter and a second Si nanoparticle class having a second-largest diameter equal to about (0.43)×(the largest diameter). As another example, Si nanoparticle classes may foe provided having a diameter ratio of about 77:32:17.
摘要翻译: 提出了Si纳米颗粒前体,前体制备工艺和前体沉积工艺。 形成硅(Si)纳米颗粒前体的方法提供多个纳米颗粒类别,包括至少一种Si纳米颗粒类。 每个纳米颗粒级中的纳米颗粒被定义为具有预定直径。 测量并组合每个纳米粒子类的预定量。 例如,可以提供具有最大直径的第一Si纳米颗粒类别和具有等于约(0.43)×(最大直径)的第二大直径的第二Si纳米颗粒类。 作为另一个实例,可以提供具有约77:32:17的直径比的Si纳米颗粒类。
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公开(公告)号:US07642573B2
公开(公告)日:2010-01-05
申请号:US10799839
申请日:2004-03-12
IPC分类号: H01L29/76
CPC分类号: H01L29/7869 , H01L29/78648
摘要: One exemplary embodiment includes a semiconductor device. The semiconductor device can include a channel including one or more of a metal oxide including zinc-germanium, zinc-lead, cadmium-germanium, cadmium-tin, cadmium-lead.
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