公开(公告)号：US20230345672A1

公开(公告)日：2023-10-26

申请号：US17825433

申请日：2022-05-26

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20509

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

公开(公告)号：US20230345671A1

公开(公告)日：2023-10-26

申请号：US17851365

申请日：2022-06-28

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20318 ,  H05K7/2039

Abstract: A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

公开(公告)号：US20230262934A1

公开(公告)日：2023-08-17

申请号：US17725053

申请日：2022-04-20

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20354 ,  H05K7/20318 ,  H05K7/20309 ,  H05K7/20381

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

公开(公告)号：US20230262930A1

公开(公告)日：2023-08-17

申请号：US17654115

申请日：2022-03-09

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Chang-Yu CHIANG

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20318 ,  H05K7/20381

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.

公开(公告)号：US20230046075A1

公开(公告)日：2023-02-16

申请号：US17453063

申请日：2021-11-01

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Chang-Yu CHIANG

IPC: H05K7/20

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component. The nozzle allows liquid coolant to pass the first heat-generating component at a faster rate than the second heat-generating component.

公开(公告)号：US20220225528A1

公开(公告)日：2022-07-14

申请号：US17236557

申请日：2021-04-21

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Guo-Xiang HU

IPC: H05K7/20

Abstract: An immersion liquid cooling tank assembly includes a generally hexagonal tank, a condenser, a manifold system, and at least one top cover. The tank includes a base and a plurality of side walls. The base and the plurality of sidewalls are connected. The condenser includes a plurality of condenser tubes. The manifold system is coupled to the condenser to assist in distributing liquid flow to and from the plurality of condenser tubes. The at least one top cover is located generally opposite to the base.

公开(公告)号：US20220225527A1

公开(公告)日：2022-07-14

申请号：US17236509

申请日：2021-04-21

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Tsung-Ta LI ,  Guo-Xiang HU

IPC: H05K7/20

Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.

公开(公告)号：US20210392790A1

公开(公告)日：2021-12-16

申请号：US17070194

申请日：2020-10-14

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuan-Hsiang LIAO

IPC: H05K7/20

Abstract: A cooling system is disclosed for a server rack holding one or more servers. The cooling system includes a cooling module configured to condition coolant to provide cooling within the server rack. The cooling system further includes at least one evaporator configured to couple to an upstream side of the server rack, relative to airflow through the server rack, and cool the airflow flowing into the server rack with the coolant. The cooling system further includes at least one condenser configured to couple to a downstream side of the server rack, relative to the airflow through the server rack, and cool the coolant after the coolant passes through the at least one evaporator.

公开(公告)号：US20200303283A1

公开(公告)日：2020-09-24

申请号：US16358250

申请日：2019-03-19

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Kuen-Hsien WU ,  Shih-I LIANG

IPC: H01L23/40 ,  H01L23/427 ,  F28D15/02 ,  F28F3/00

Abstract: A heat sink having a flexible heat sink base is disclosed in order to flex the heat sink into contact with concave heat sources. Flexibility is achieved by providing a series of concentric grooves on the heat sink base on a surface opposite the surface contacting the heat source. A central cylinder is provided at the center of the concentric grooves. A biasing device, such as a spring, exerts a force on the central cylinder to flex the heat sink base.

公开(公告)号：US20200214172A1

公开(公告)日：2020-07-02

申请号：US16393380

申请日：2019-04-24

Applicant: QUANTA COMPUTER INC.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Ching-Yu CHEN ,  Kuo-Wei LEE

IPC: H05K7/20

Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.