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公开(公告)号：US20180197523A1
公开(公告)日：2018-07-12
申请号：US15401976
申请日：2017-01-09
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
IPC: G10K11/16 , G10K11/175
CPC classification number: G10K11/161 , F04D25/166 , F04D29/663 , F04D29/664 , G10K11/175 , G11B33/08 , G11B33/128 , G11B33/142
Abstract: An anti-acoustics streamline apparatus is provided. The apparatus includes an air impedance wall having a front face, a rear face, and a plurality of openings extending from the front face to the rear face defining open areas; and a plurality of flow separating structures disposed adjacent to the front face, each of the plurality of flow separating structure extending vertically along the front face of the wall. The openings are configured to define first wall regions in the air impedance wall adjacent to each of the plurality of flow separating structures and second wall regions between the first wall regions. A first ratio of the open areas in the first wall regions to a total area in first wall regions is less than a second ratio of the open areas in the second wall regions to a total area in the second wall regions.
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公开(公告)号：US20210092877A1
公开(公告)日：2021-03-25
申请号：US16752367
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Tsung-Ta LI , Kuo-Wei LEE
Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.
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公开(公告)号：US20210092879A1
公开(公告)日：2021-03-25
申请号：US16752100
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Tsung-Ta LI , Kuo-Wei LEE
Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.
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公开(公告)号：US20180192545A1
公开(公告)日：2018-07-05
申请号：US15397437
申请日：2017-01-03
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: H05K7/20336 , F28D15/0266 , F28D15/0275 , F28F3/02 , F28F3/06 , F28F3/12 , F28F2215/04 , F28F2215/06 , H05K7/20409
Abstract: A heat dissipation apparatus having a base, a heat dissipater, and a plurality of fin arrays. The base has at least one horizontal portion disposed in the base and at least one vertical portion extending therefrom. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one vertical portion of the heat dissipater.
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Patent Agency Ranking
公开(公告)号：US20180003192A1
公开(公告)日：2018-01-04
申请号：US15197507
申请日：2016-06-29
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: F04D29/542 , F04D19/002 , F04D29/325 , H05K7/20727 , H05K7/20736
Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
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公开(公告)号：US20220225527A1
公开(公告)日：2022-07-14
申请号：US17236509
申请日：2021-04-21
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Tsung-Ta LI , Guo-Xiang HU
IPC: H05K7/20
Abstract: An immersion liquid cooling tank assembly includes a generally elliptical tank, at least one condenser including a plurality of condenser tubes, at least one cooling fan adjacent to the condenser, a manifold system coupled to the at least one condenser to assist in distributing liquid flow to and from the plurality of condenser tubes, and a top cover disposed over the generally elliptical tank. The top cover includes an air baffle.
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公开(公告)号：US20210092868A1
公开(公告)日：2021-03-25
申请号：US16743958
申请日：2020-01-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien Huang , Tsung-Ta LI , Kuo-Wei LEE
Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
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公开(公告)号：US20200214177A1
公开(公告)日：2020-07-02
申请号：US16413238
申请日：2019-05-15
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien Huang , Ching-Yu CHEN , Tsung-Ta LI
IPC: H05K7/20
Abstract: A dynamic air impedance mechanism is provided which has particular utility in changing the impedance of air flow within servers. The mechanism comprises an air duct having a plurality of vent holes, a control plate defining a plurality of openings, and relative movement between the openings in the control plate and the corresponding vent holes in the air duct to change the impedance of air flow through the server.
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公开(公告)号：US20190239386A1
公开(公告)日：2019-08-01
申请号：US15985336
申请日：2018-05-21
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
IPC: H05K7/20
Abstract: This disclosure relates to connecting a metal hose between a radiator and a cold plate that cools a CPU, or similar electronic heat generating component, whereby the metal hose is connected to the radiator with silicon casings. Waterproof spray plates are also provided to direct any water spray away from the electronic components. A water tray beneath the waterproof spray plates collects any water and directs it to a location outside the chassis.
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