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    POLLING SYSTEM AND POLLING METHOD USING THE SAME
    31.
    发明申请
    POLLING SYSTEM AND POLLING METHOD USING THE SAME 有权
    使用该方法的抛光系统和抛光方法

    公开(公告)号：US20140346892A1

    公开(公告)日：2014-11-27

    申请号：US14045585

    申请日：2013-10-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yun Sung Kang ,  Jung Won Lee ,  Sang Jin Kim ,  Jeong Suong Yang ,  Seung Mo Lim ,  Kyo Yeol Lee

    IPC: H02J4/00

    CPC classification number: G01P15/09 ,  G01C25/00 ,  G01R29/22 ,  G01R31/2829 ,  H01L41/22 ,  Y10T307/76

    Abstract: Disclosed herein is a polling system, including: a matrix element including individual elements including upper electrodes and lower electrodes, the individual elements being arrayed in plural, the upper electrodes of the individual elements being each connected in series to form upper electrode units which are arrayed in plural and the lower electrodes of the individual elements being each connected in series to form lower electrode units which are arrayed in plural; an upper switch connected to each of the upper electrode units which is arrayed in plural; a lower switch connected to each of the lower electrode units which is arrayed in plural; and a polling unit performing polling to apply voltage to the upper electrodes and the lower electrodes, respectively.

    Abstract translation: 本文公开了一种轮询系统，包括：包括单个元件的矩阵元件，包括上电极和下电极，各个元件排列成多个，各个元件的上电极各自串联连接以形成排列的上电极单元 并且各个元件的下电极各自串联连接以形成排列成多个的下电极单元; 连接到排列成多个的上部电极单元的上部开关; 连接到排列成多个的下部电极单元的下部开关; 以及轮询单元，执行轮询以分别向上电极和下电极施加电压。

    Coil component
    34.
    发明授权
    Coil component 有权

    公开(公告)号：US11664156B2

    公开(公告)日：2023-05-30

    申请号：US16931872

    申请日：2020-07-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： No Il Park ,  Seung Mo Lim ,  Byung Soo Kang ,  Byeong Cheol Moon

    IPC: H01F27/32 ,  H01F27/29 ,  H01F27/24

    CPC classification number: H01F27/324 ,  H01F27/292 ,  H01F27/24

    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body, in which the support substrate and the coil portion are disposed, having one surface and the other surface opposing each other, a first external electrode and a second external electrode disposed on the other surface of the body to be spaced apart from each other and connected to the coil portion, a marking portion disposed on the one surface of the body, and a first insulating layer disposed on the one surface of the body and having an opening exposing the marking portion. The marking portion has a thickness less than or equal to a thickness of the first insulating layer.

    COIL COMPONENT
    35.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20220392697A1

    公开(公告)日：2022-12-08

    申请号：US17733047

    申请日：2022-04-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yoon Mi Cha ,  Ju Hwan Yang ,  Seung Mo Lim ,  No Il Park ,  Tai Yon Cho ,  Byeong Cheol Moon

    IPC: H01F27/32 ,  H01F27/29 ,  H01F27/28

    Abstract: A coil component may include a body, a coil portion including first and second lead-out portions spaced apart from each other, first and second slit portions formed at an edge portion and exposing the first and second lead-out portions, first and second external electrodes disposed to be spaced apart from each other on one surface of the body, and extending onto the first and second slit portions, respectively, to be connected to the first and second lead-out portions, a slit insulating layer covering at least portions of the first and second external electrodes in the first and second slit portions, and a surface insulating layer disposed on the slit insulating layer and extending to cover at least portions of the first or second external electrodes disposed on the one surface of the body.

    Coil component
    36.
    发明授权
    Coil component 有权

    公开(公告)号：US11367561B2

    公开(公告)日：2022-06-21

    申请号：US16357795

    申请日：2019-03-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Mo Lim ,  Byeong Cheol Moon ,  Tai Yon Cho ,  Tae Jun Choi ,  Jeong Hoon Ryou ,  Dong Sik Yoo ,  No Il Park ,  Seung Hee Oh

    IPC: H01F27/29 ,  H01F27/28

    Abstract: A coil component includes a body and a coil portion disposed in the body and including first and second lead-out portions. Recesses are disposed along edges of one surface of the body, and expose the first and second lead-out portions to internal walls and lower surfaces of the recesses. First and second external electrodes are disposed in the recesses, and are connected to the first and second lead-out portions. A third external electrode is disposed in the recesses, and is connected to a connection electrode disposed on side surfaces of the body and on another surface of the body opposite to the one surface. An external insulating layer covers the connection electrode, and has an opening exposing at least a portion of the connection electrode. A shielding layers is disposed on the external insulating layer and in the opening and connects to the connection electrode.

    Coil component
    37.
    发明授权
    Coil component 有权

    公开(公告)号：US11335496B2

    公开(公告)日：2022-05-17

    申请号：US16294575

    申请日：2019-03-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byung Soo Kang ,  Tai Yon Cho ,  Yoon Mi Cha ,  Ju Hwan Yang ,  Jeong Suong Yang ,  No Il Park ,  Byeong Cheol Moon ,  Tae Jun Choi ,  Seung Mo Lim

    IPC: H01F27/29 ,  H01F27/28

    Abstract: A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; recesses respectively formed in both front and rear surfaces of the body opposing each other among the plurality of walls of the body and extending up to the bottom surface of the body; a coil portion buried in the body and including first and second lead-out portions exposed to internal walls and lower ledge surfaces of the recesses; first and second external electrodes respectively including connection portions disposed in the recesses and extended portions disposed on the bottom surface of the body, and connected to the coil portion; a shielding layer including a cap portion disposed on the top surface of the body and side wall portions respectively disposed on the plurality of walls of the body; and an insulating layer disposed between the body and the shielding layer and extending onto lower ledge surfaces and internal walls of the recesses to cover the connection portions.

    COIL COMPONENT
    38.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20210350980A1

    公开(公告)日：2021-11-11

    申请号：US16931872

    申请日：2020-07-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： No Il Park ,  Seung Mo Lim ,  Byung Soo Kang ,  Byeong Cheol Moon

    IPC: H01F27/32 ,  H01F27/29

    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body, in which the support substrate and the coil portion are disposed, having one surface and the other surface opposing each other, a first external electrode and a second external electrode disposed on the other surface of the body to be spaced apart from each other and connected to the coil portion, a marking portion disposed on the one surface of the body, and a first insulating layer disposed on the one surface of the body and having an opening exposing the marking portion. The marking portion has a thickness less than or equal to a thickness of the first insulating layer.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    39.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210233715A1

    公开(公告)日：2021-07-29

    申请号：US17230427

    申请日：2021-04-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Joon Oh ,  Tae Joon Park ,  Sang Wook Lee ,  Sung Min Cho ,  Seung Mo Lim

    IPC: H01G4/30 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

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