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    Multilayer ceramic capacitor
    3.
    发明授权
    Multilayer ceramic capacitor 有权

    公开(公告)号：US11721489B2

    公开(公告)日：2023-08-08

    申请号：US17230430

    申请日：2021-04-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Joon Oh ,  Tae Joon Park ,  Sang Wook Lee ,  Sung Min Cho ,  Seung Mo Lim

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/2325 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
    4.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180286589A1

    公开(公告)日：2018-10-04

    申请号：US15919679

    申请日：2018-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Min Cho ,  Young Wook Kim ,  Seung Mo Lim ,  Jung Min Kim

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/008

    Abstract: A multilayer ceramic capacitor includes a body including first and second internal electrodes facing each other with respective dielectric layers interposed therebetween, and first and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first electrode layer containing any one selected from the group consisting of TiW, TiN, and TaN, or a combination thereof, and a second electrode layer disposed on the first electrode layer.

    Multilayer electronic component and method of manufacturing the same
    6.
    发明授权
    Multilayer electronic component and method of manufacturing the same 有权

    公开(公告)号：US10903011B2

    公开(公告)日：2021-01-26

    申请号：US16050480

    申请日：2018-07-31

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Hun Han ,  Sung Min Cho ,  Dong Joon Oh

    IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  C23C16/455

    Abstract: A multilayer electronic component includes: a capacitor body including first and second internal electrodes disposed to be alternately exposed through opposite surfaces, respectively, with respective dielectric layers interposed therebetween; first and second thin film layers including at least one of titanium nitride (TiN), ruthenium (Ru), platinum (Pt), iridium (Ir), or titanium (Ti), disposed on the surfaces of the capacitor body, and connected to the first and second internal electrodes, respectively; and first and second external electrodes formed on the first and second thin film layers. A thickness of the first or second thin film layer is less than or equal to 60 nm.

    Multilayer electronic component and method of manufacturing the same
    7.
    发明授权
    Multilayer electronic component and method of manufacturing the same 有权

    公开(公告)号：US10770232B2

    公开(公告)日：2020-09-08

    申请号：US16044898

    申请日：2018-07-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Hun Han ,  Sung Min Cho ,  Dong Joon Oh

    IPC: H01G4/30 ,  H01G4/005 ,  H01G4/224 ,  H01G4/232 ,  H01G4/12

    Abstract: A multilayer electronic component for enhancing damp proof reliability includes: a capacitor body including a plurality of dielectric layers, and first and second internal electrodes, alternately disposed across the dielectric layers to expose one end of the first and second electrodes through third and fourth surfaces of the capacitor body; first and second conductive layers disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively; first and second plating layers covering surfaces of the first and second conductive layers; and a plurality of coating layers configured in a multilayer structure on a surface of the capacitor body to expose the first and second plating layers and having an entire thickness of 10 nm to 200 nm.

    Multilayer capacitor
    9.
    发明授权
    Multilayer capacitor 有权

    公开(公告)号：US11749459B2

    公开(公告)日：2023-09-05

    申请号：US17307395

    申请日：2021-05-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jang Yeol Lee ,  Hye Min Bang ,  Ho Phil Jung ,  Sung Min Cho

    IPC: H01G4/30 ,  H01G4/248 ,  H01G4/14 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/14 ,  H01G4/248

    Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210233715A1

    公开(公告)日：2021-07-29

    申请号：US17230427

    申请日：2021-04-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Joon Oh ,  Tae Joon Park ,  Sang Wook Lee ,  Sung Min Cho ,  Seung Mo Lim

    IPC: H01G4/30 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.

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