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    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215641A1

    公开(公告)日：2023-07-06

    申请号：US17960927

    申请日：2022-10-06

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Hun Han ,  Jae Young Na ,  Sung Soo Kim ,  Jin Hyung Lim ,  Yun Sung Kang ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/2325 ,  H01G4/30

    Abstract: A multilayer electronic component includes a body having a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The body has a hexahedral shape. A first external electrode includes a first connection portion disposed on a third surface, and first and third band portions extending from the first connection portion respectively onto a portion of a first and a second surface. A second external electrode includes a second connection portion disposed on a fourth surface, and second and fourth band portions extending from the second connection portion respectively onto a portion of the first and second surfaces. An insulating layer including an oxide containing hafnium is disposed on the first and second connection portions and covers the second surface and the third and fourth band portions. First and second plating layers are disposed respectively on the first and second band portions.

    Thin film capacitor and method of manufacturing the same
    4.
    发明授权
    Thin film capacitor and method of manufacturing the same 有权

    公开(公告)号：US10410793B2

    公开(公告)日：2019-09-10

    申请号：US15404357

    申请日：2017-01-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Mo Lim ,  Hyun Ho Shin ,  Sang Jong Lee ,  Yun Sung Kang ,  Woong Do Jung ,  Sung Sun Kim

    IPC: H01G4/33 ,  H01G4/236 ,  H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H05K1/16

    Abstract: A thin film capacitor includes: a body formed by alternately stacking first and second electrode layers, with dielectric layers therebetween on a substrate. A plurality of first vias are disposed in the body and electrically connected to the first electrode layers. A plurality of second vias are disposed in the body, electrically connected to the second electrode layers, and disposed alternately with the first vias. A first connection electrode is disposed on an upper surface of the body and connected to the plurality of first vias, a second connection electrode is disposed on the upper surface of the body and connected to the plurality of second vias, and first and second electrode pads are disposed on the first and second connection electrodes, respectively, and formed to not overlap the plurality of first and second vias.

    Thin-film capacitor
    8.
    发明授权
    Thin-film capacitor 有权

    公开(公告)号：US10319526B2

    公开(公告)日：2019-06-11

    申请号：US15645339

    申请日：2017-07-10

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Ho Shin ,  Yun Sung Kang ,  Seung Mo Lim ,  Kyo Yeol Lee ,  Dong Joon Oh ,  Woong Do Jung ,  Ho Phil Jung ,  Hai Joon Lee

    IPC: H01G4/30 ,  H01G4/33 ,  H01G4/228 ,  H01G4/236

    Abstract: A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.

    POLLING SYSTEM AND POLLING METHOD USING THE SAME
    10.
    发明申请
    POLLING SYSTEM AND POLLING METHOD USING THE SAME 有权
    使用该方法的抛光系统和抛光方法

    公开(公告)号：US20140346892A1

    公开(公告)日：2014-11-27

    申请号：US14045585

    申请日：2013-10-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yun Sung Kang ,  Jung Won Lee ,  Sang Jin Kim ,  Jeong Suong Yang ,  Seung Mo Lim ,  Kyo Yeol Lee

    IPC: H02J4/00

    CPC classification number: G01P15/09 ,  G01C25/00 ,  G01R29/22 ,  G01R31/2829 ,  H01L41/22 ,  Y10T307/76

    Abstract: Disclosed herein is a polling system, including: a matrix element including individual elements including upper electrodes and lower electrodes, the individual elements being arrayed in plural, the upper electrodes of the individual elements being each connected in series to form upper electrode units which are arrayed in plural and the lower electrodes of the individual elements being each connected in series to form lower electrode units which are arrayed in plural; an upper switch connected to each of the upper electrode units which is arrayed in plural; a lower switch connected to each of the lower electrode units which is arrayed in plural; and a polling unit performing polling to apply voltage to the upper electrodes and the lower electrodes, respectively.

    Abstract translation: 本文公开了一种轮询系统，包括：包括单个元件的矩阵元件，包括上电极和下电极，各个元件排列成多个，各个元件的上电极各自串联连接以形成排列的上电极单元 并且各个元件的下电极各自串联连接以形成排列成多个的下电极单元; 连接到排列成多个的上部电极单元的上部开关; 连接到排列成多个的下部电极单元的下部开关; 以及轮询单元，执行轮询以分别向上电极和下电极施加电压。

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