公开(公告)号：US20140130347A1

公开(公告)日：2014-05-15

申请号：US13765650

申请日：2013-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Yeol PARK ,  Suk Jin Ham ,  Jung Tae Park ,  Seung Heon Han ,  Jung Eun Noh

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/4913

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.

Abstract translation: 本文公开了一种制造印刷电路板的方法，包括： 形成包括形成在主体的至少一侧的电极的电子部件; 在电极的上部形成端子和主体的上部; 提供其中形成空腔的基板; 将形成有端子的电子部件安装在基板的空腔中; 以及在所述基板的上部和所述电子部件的上部形成积聚层。

公开(公告)号：US20140111790A1

公开(公告)日：2014-04-24

申请号：US13848797

申请日：2013-03-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Jin Choi ,  Sang Phil Lee ,  Se Kyung Lee ,  Seon Young Ahn ,  Yun Hee Kim ,  Suk Jin Ham

IPC: G01N1/38

CPC classification number: G01N1/38 ,  G01N2001/383

Abstract: There is provided a method for performing a pretreatment on an unknown sample including: preparing a plurality of different types of first solutions; adding an unknown sample to the plurality of first solutions and determining whether or not the unknown sample is dissolved; selecting one among the plurality of first solutions in which the unknown sample is dissolved; preparing a plurality of second solution by differentiating concentrations of the selected solution; adding an unknown sample to the second solution and determining whether or not the unknown sample is dissolved; selecting a solution having the lowest concentration in which the unknown sample can be dissolved from among the second solutions; and dissolving the unknown sample by using the solution having the lowest concentration.

Abstract translation: 提供了对未知样品进行预处理的方法，包括：制备多种不同类型的第一溶液; 将未知样品添加到所述多个第一溶液中并确定未知样品是否溶解; 选择未知样品溶解的多个第一溶液之一; 通过分选所选溶液的浓度来制备多个第二溶液; 将未知样品添加到第二溶液中并确定未知样品是否溶解; 从第二溶液中选择具有可溶解未知样品的最低浓度的溶液; 并通过使用浓度最低的溶液溶解未知样品。

公开(公告)号：US20130281575A1

公开(公告)日：2013-10-24

申请号：US13801087

申请日：2013-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Young JI ,  Seung Hwan Kim ,  Suk Jin Ham

IPC: C09D5/00

CPC classification number: C09D5/00 ,  C08J5/24 ,  C08K3/042 ,  C08K3/20 ,  C08K5/057 ,  C08K5/56 ,  C08K7/02 ,  C08K7/14 ,  C08L63/00 ,  C08L79/085 ,  C09D179/085 ,  H01B3/40 ,  H01B3/448

Abstract: The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat.

Abstract translation: 本发明涉及包含可溶性液晶热固性低聚物，金属醇盐，石墨烯氧化物和短纤维的基材用绝缘组合物以及使用其的绝缘材料和基板。 根据本发明的绝缘组合物可以通过添加金属醇盐和石墨烯氧化物来有效地降低热膨胀系数。 因此，可以通过添加短纤维来提供具有大大提高的强度和刚性的基板材料，并且通过使用根据本发明的绝缘组合物制造具有改进的热稳定性的基板作为绝缘材料 使基板由于热而使尺寸变形最小化。

公开(公告)号：US20130107110A1

公开(公告)日：2013-05-02

申请号：US13664350

申请日：2012-10-30

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Sung Park ,  Seung Hwan Kim ,  Suk Jin Ham

IPC: H04N5/225

CPC classification number: H04N5/2252

Abstract: Disclosed herein is a camera module, including: a camera sensor; a case having the camera sensor accommodated therein; a transparent member mounted to penetrate through an inside and an outside of the case; and a humidity removing unit removing humidity of the transparent member. By this configuration, it is possible to automatically remove humidity formed on the transparent member (external window or external lens) contacting external air and automatically remove foreign materials such as dust attached on the surface of the transparent member. Therefore, even though the camera module according to the exemplary embodiments of the present invention is used in the outdoor environment, it is possible to obtain the clear image at all times.

Abstract translation: 本文公开了一种相机模块，包括：相机传感器; 容纳摄像机传感器的壳体; 安装成透过所述壳体的内部和外部的透明构件; 以及去除透明构件的湿度的除湿单元。 通过这种结构，可以自动除去与外部空气接触的透明构件（外部窗口或外部透镜）上形成的湿气，并自动去除附着在透明构件表面上的灰尘等异物。 因此，即使根据本发明的示例性实施例的相机模块在室外环境中使用，也可以始终获得清晰的图像。