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1.发明授权公开(公告)号：US09099329B2
公开(公告)日：2015-08-04
申请号：US13782864
申请日：2013-03-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hee Suk Chung , Gyu Seok Kim , Han Wool Kang , Kyung Ho Lee , Mi Yang Kim , Suk Jin Ham
IPC: H01L29/06 , H01L21/033 , B82Y10/00 , B82Y40/00 , H01L29/66 , H01L29/775 , H01L21/02 , H01L33/18
CPC classification number: H01L29/0676 , B82Y10/00 , B82Y40/00 , H01L21/0254 , H01L21/02603 , H01L21/02614 , H01L29/66469 , H01L29/775 , H01L33/18
Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.
Abstract translation: 提供了一种In纳米线，其包括基板，形成在基板上的铟薄膜，形成在铟薄膜上并具有通过形成图案的至少一个通孔的绝缘膜，以及从铟垂直地突出的In纳米线 薄膜通过至少一个通孔。
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2.发明授权Insulating composition for substrate, and prepreg and substrate using the same 有权用于基材的绝缘组合物，以及使用其的预浸料和基材公开(公告)号：US09045646B2
公开(公告)日：2015-06-02
申请号：US13801087
申请日：2013-03-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Soo Young Ji , Seung Hwan Kim , Suk Jin Ham
CPC classification number: C09D5/00 , C08J5/24 , C08K3/042 , C08K3/20 , C08K5/057 , C08K5/56 , C08K7/02 , C08K7/14 , C08L63/00 , C08L79/085 , C09D179/085 , H01B3/40 , H01B3/448
Abstract: The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat.
Abstract translation: 本发明涉及包含可溶性液晶热固性低聚物，金属醇盐，石墨烯氧化物和短纤维的基材用绝缘组合物以及使用其的绝缘材料和基板。 根据本发明的绝缘组合物可以通过添加金属醇盐和石墨烯氧化物来有效地降低热膨胀系数。 因此，可以通过添加短纤维来提供具有大大提高的强度和刚性的基板材料，并且通过使用根据本发明的绝缘组合物制造具有改进的热稳定性的基板作为绝缘材料 使基板由于热而使尺寸变形最小化。
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公开(公告)号：US20140374870A1
公开(公告)日：2014-12-25
申请号：US14170325
申请日：2014-01-31
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Kyung Ho Lee , Suk Jin Ham , Seung Wan Woo , Yee Na Shin
IPC: H01L27/146
CPC classification number: H01L27/14618 , H01L25/041 , H01L25/105 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L2924/0002 , H01L2924/00
Abstract: Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a second groove having a stepped shape; and an image sensor mounted in a groove of the base substrate.
Abstract translation: 这里公开了图像传感器模块及其制造方法。 图像传感器包括：基底，具有安装有图像传感器的凹槽，该凹槽包括第一凹槽和具有台阶形状的第二凹槽; 以及安装在基底基板的凹槽中的图像传感器。
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公开(公告)号：US09470635B2
公开(公告)日：2016-10-18
申请号：US14048703
申请日：2013-10-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
Inventor： Seung Wan Woo , Young Nam Hwang , Po Chul Kim , Kyung Ho Lee , Suk Jin Ham
CPC classification number: G01N21/88 , G01B11/306 , G01N25/16
Abstract: Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement.
Abstract translation: 这里公开了测量翘曲的系统和测量翘曲的方法。 通过使用从光源扩散并在样品表面上反射的光通过分析由相机拍摄的图像并通过参考光栅部件到达相机的方式来测量样品的翘曲的系统，该系统包括： 一个摄取部分去除样品产生的烟雾。 通过该结构，可以根据测定翘曲时的试样的温度的上升而有效地除去样品产生的烟雾，能够测量翘曲，提高翘曲测定精度。
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公开(公告)号：US20140185244A1
公开(公告)日：2014-07-03
申请号：US13866619
申请日：2013-04-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jae Sang LEE , Ji Hyuk Lim , Suk Jin Ham
CPC classification number: H05K1/0209 , H01L23/36 , H01L23/3737 , H01L2924/0002 , H05K3/0061 , H05K2201/0187 , H05K2201/0209 , H01L2924/00
Abstract: There is provided a circuit board module including a heat radiation member, a thermally conductive film that is disposed on the heat radiation member and includes a thermally conductive filler, a circuit board formed on the thermally conductive film, and a heat generation device disposed on the circuit board, wherein the thermally conductive filler is distributed in an area of the thermally conductive film corresponding to the heat generation device and another area that is extended from the area corresponding to the heat generation device by a predetermined distance on a plane.
Abstract translation: 提供了一种电路板模块，包括散热构件，设置在散热构件上并包括导热填料的导热膜，形成在导热膜上的电路板，以及设置在导热膜上的发热装置 电路板，其中所述导热填料分布在对应于所述发热装置的导热膜的区域中，以及从与所述发热装置相对应的区域在平面上延伸预定距离的另一区域。
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Patent Agency Ranking
公开(公告)号：US20140184933A1
公开(公告)日：2014-07-03
申请号：US13802458
申请日：2013-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
Inventor： Sung Yeol Park , Suk Jin Ham , Jung Eun Noh
IPC: G06F1/16
CPC classification number: G06F1/169 , G06F1/1633 , G06F3/044 , G06F2203/04103
Abstract: Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer.
Abstract translation: 本文公开了触摸面板和通孔电极的制造方法。 可以通过在盖玻璃中形成通孔，然后将通孔电极填充到通孔中来改善触摸灵敏度，从而缩小使用者的触摸点和电极层之间的间隔。
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7.发明申请INSULATING LAYER COMPOSITION FOR SUBSTRATE, AND PREPEG AND SUBSTRATE USING THE SAME 有权用于衬底的绝缘层组合物，以及使用该衬底的衬底和衬底公开(公告)号：US20130099149A1
公开(公告)日：2013-04-25
申请号：US13657296
申请日：2012-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Soo Young JI , Suk Jin Ham , Seung Hwan Kim , Do Young Kim
IPC: E04B1/78
CPC classification number: H05K1/0353 , C08G73/123 , C08G73/125 , C08G73/126 , C08G73/128 , C08J5/24 , C08J2367/02 , C08K5/057 , C09D167/02 , C09D177/00 , C09D177/10 , C09D179/085 , C09K19/3483 , C09K19/3823 , H05K1/0346 , H05K1/0366 , H05K2201/0141 , C08K3/04 , C08K5/0091 , C08K5/5415 , C08L63/00 , C08L79/085 , C08K3/20 , C08K3/042
Abstract: Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same.The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.
Abstract translation: 本文公开了一种用于基材的绝缘层组合物，包括可溶型液晶热固性低聚物，金属醇盐化合物和石墨烯氧化物，以及绝缘膜和使用其的基板。 根据本发明的绝缘层组合物可以有效地降低其热膨胀系数，因此当使用绝缘层组合物作为衬底的绝缘材料时，可以最小化由于热量引起的尺寸变化，导致衬底 具有改善的热稳定性。
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公开(公告)号：US09095063B2
公开(公告)日：2015-07-28
申请号：US14182206
申请日：2014-02-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Ju Yang , Gyu Seok Kim , Suk Jin Ham , Se Yoon Park , Jin Uk Cha , Hee Suk Chung , Mi Yang Kim
CPC classification number: H05K1/09 , C23C14/185 , C23C14/34 , C23C14/5833 , C23F4/00 , C23F4/04 , H05K1/03 , H05K1/0306 , H05K3/027 , H05K3/06 , H05K3/16 , H05K3/388 , H05K2201/0391 , H05K2203/092
Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
Abstract translation: 这里公开了一种印刷电路板及其制造方法。 具体地，根据本发明的优选实施例，印刷电路板包括：绝缘层; 以及形成在所述绝缘层上的金属层，其中在所述金属层中，（110）和（112）的晶体取向所占的比例为20〜80％。 通过这样做，本发明的优选实施例提供了一种印刷电路板，其包括具有不同晶体取向的金属层，以最小化妨碍诸如导电性的电特性的因素，并改善机械性能的各向同性和制造印刷电路板的方法 。
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公开(公告)号：US09030432B2
公开(公告)日：2015-05-12
申请号：US13802458
申请日：2013-03-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sung Yeol Park , Suk Jin Ham , Jung Eun Noh
CPC classification number: G06F1/169 , G06F1/1633 , G06F3/044 , G06F2203/04103
Abstract: Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer.
Abstract translation: 本文公开了触摸面板和通孔电极的制造方法。 可以通过在盖玻璃中形成通孔，然后将通孔电极填充到通孔中来改善触摸灵敏度，从而缩小使用者的触摸点和电极层之间的间隔。
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公开(公告)号：US20140131083A1
公开(公告)日：2014-05-15
申请号：US13831842
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Yeol Park , Suk Jin Ham , Jung Eun Noh
CPC classification number: H05K1/186 , H05K1/141 , H05K3/366 , H05K2201/048 , H05K2201/049 , Y10T29/4913 , Y10T29/49146
Abstract: Disclosed herein is a printed circuit board, including: a mounting substrate having a cavity formed therein; an electronic component inserted into the cavity; and a base substrate formed at least one of an upper part and a lower part of the electronic component, inserted into the cavity, and having an upper substrate pad and a lower substrate pad extended outwardly thereof and connected to each other.
Abstract translation: 这里公开了一种印刷电路板，包括：安装基板，其中形成有腔; 插入腔中的电子部件; 以及形成在所述电子部件的上部和下部中的至少一个插入到所述空腔中的基底基板，并且具有向上延伸并彼此连接的上基板焊盘和下基板焊盘。
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