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公开(公告)号:US10037836B2
公开(公告)日:2018-07-31
申请号:US14678270
申请日:2015-04-03
Applicant: Schlumberger Technology Corporation
Inventor: Joseph Varkey , Burcu Unal Altintas , Jushik Yun , Dong Yang , Sheng Chang , Ramnik Singh
IPC: E21B23/14 , H01B13/24 , C23C4/131 , C23C4/18 , B05D1/00 , C23C4/06 , C23C4/16 , B05D3/12 , B05D3/14 , B05D7/00
CPC classification number: H01B13/24 , B05D1/007 , B05D3/12 , B05D3/14 , B05D7/52 , B05D2202/00 , B05D2256/00 , B05D2401/00 , C23C4/06 , C23C4/131 , C23C4/16 , C23C4/18 , B05D2401/32
Abstract: A technique for manufacturing slickline with a jacket of enhanced bonding. The technique may include roughening an outer surface of a metal core and applying an initial insulating polymer layer to the roughened core in a non-compression manner such as by tubing extrusion. The insulated core may then be heated and run through a set of shaping rollers. Thus, the grip between the polymer and the underlying metal core may be enhanced at a time following the initial placement of the polymer on the core. In this manner, processing damage to the underlying core surface which might adversely affect maintaining the grip may be minimized. Other techniques such as powder spray delivery of the initial polymer layer may also be utilized in a similar manner.
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公开(公告)号:US20150075696A1
公开(公告)日:2015-03-19
申请号:US14551806
申请日:2014-11-24
Applicant: Schlumberger Technology Corporation
Inventor: Joseph Varkey , Vadim Protasov , Jushik Yun , Sheng Chang
CPC classification number: H01B13/22 , H01B7/046 , H01B7/226 , H01B13/0016 , H01B13/06 , H01B13/221
Abstract: A cable includes an electrically conductive cable core for transmitting electrical power and data, an insulative/protective layer circumferentially disposed around the core, an inner armor wire layer including a plurality of armor wires disposed around the cable core and the insulative layer, wherein at least one of the armor wires of the inner armor wire layer is bonded to the insulative layer, and an outer armor wire layer including a plurality of armor wires disposed around the inner armor wire layer. At least one of the armor wires of the outer armor wire layer can be bonded to the at least one of the armor wires of the inner armor wire layer.
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