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公开(公告)号：US20210247344A1
公开(公告)日：2021-08-12
申请号：US17236750
申请日：2021-04-21
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Malek Brahem , Hatem Majeri , Olivier Le Neel , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.
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公开(公告)号：US11009477B2
公开(公告)日：2021-05-18
申请号：US16397635
申请日：2019-04-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/01 , G01K7/16 , G01K7/18 , G01K7/20 , G01L9/12 , H01L25/00 , H01L27/02 , H01L29/78 , G01N27/22 , H01L25/065 , G01L19/00 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US10557812B2
公开(公告)日：2020-02-11
申请号：US15367081
申请日：2016-12-01
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Alexandre Le Roch , Ayoub Lahlalia , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor that includes an active sensor area that is exposed to an environment for detection of elements. The gas sensor may be an air quality sensor that can be fixed in position or carried by a user. The gas sensor includes a heater formed above chamber. The gas sensor includes an active sensor layer above the heater that forms the active sensor area. The gas sensor can include a passive conductive layer, such as a hotplate that further conducts and distributes heat from the heater to the active sensor area. The heater can include a plurality of extensions. The heater can also include a first conductive layer and a second conductive layer on the first conductive layer where the second conductive layer includes a plurality of openings to increase an amount of heat and to more evenly distribute heat from the heater to the active sensor area.
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公开(公告)号：US10094797B2
公开(公告)日：2018-10-09
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: H01L29/84 , G01N27/22 , H01L25/065 , H01L29/78 , G01L9/12 , G01K7/18 , G01K7/20 , G01L19/00 , G01K7/16 , H01L25/00 , H01L27/02 , G01K7/01 , G01D21/02
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US09689824B2
公开(公告)日：2017-06-27
申请号：US14887145
申请日：2015-10-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01P15/08 , H01L29/84 , G01N27/22 , H01L25/065 , H01L25/00 , G01L9/12 , G01K7/01 , H01L27/02 , H01L29/78 , G01K7/18 , G01K7/20 , G01L19/00 , G01K7/16 , G01D21/02
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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Patent Agency Ranking
公开(公告)号：US09651627B2
公开(公告)日：2017-05-16
申请号：US13853666
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Calvin Leung
CPC classification number: G01R31/3679 , G01R31/3662 , H02J7/0006 , H02J7/0016 , H02J7/0021 , H02J7/0036
Abstract: A device is provided for monitoring the total current discharged from a battery. The device includes a bridge circuit of resistors in which one of the resistors has a resistance which varies according to the current which has passed through it. Whenever the battery passes a current to a load, a small portion of the current is passed through the bridge circuit.
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公开(公告)号：US09618653B2
公开(公告)日：2017-04-11
申请号：US13853801
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian
Abstract: Sensors for air flow, temperature, pressure, and humidity are integrated onto a single semiconductor die within a miniaturized Venturi chamber to provide a microelectronic semiconductor-based environmental multi-sensor module that includes an air flow meter. One or more such multi-sensor modules can be used as building blocks in dedicated application-specific integrated circuits (ASICs) for use in environmental control appliances that rely on measurements of air flow. Furthermore, the sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. By integrating the Venturi chamber with accompanying environmental sensors, correction factors can be obtained and applied to compensate for temporal humidity fluctuations and spatial temperature variation using the Venturi apparatus.
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公开(公告)号：US09000542B2
公开(公告)日：2015-04-07
申请号：US13907708
申请日：2013-05-31
Applicant: STMicroelectronics Pte Ltd.
Inventor： Tien Choy Loh , Olivier Le Neel
IPC: H01L27/14 , H01L29/84 , H01L31/058 , B81B3/00 , B81C1/00
CPC classification number: B81C1/00158 , B81B3/0021 , B81B2203/0127
Abstract: The present disclosure is directed to a device that includes a substrate and a sensor formed on the substrate. The sensor includes a chamber formed from a plurality of integrated cavities, a membrane above the substrate, the membrane having a plurality of openings, each opening positioned above one of the cavities, and a plurality of diamond shaped anchors positioned between the membrane and the substrate, the anchors positioned between each of the cavities. A center of each opening is also a center of one of the cavities.
Abstract translation: 本公开涉及一种包括基板和形成在基板上的传感器的装置。 所述传感器包括由多个集成腔体形成的室，在所述衬底上方的膜，所述膜具有多个开口，每个开口位于所述空腔中的一个上方，以及多个位于所述膜和所述衬底之间的菱形锚定件 ，定位在每个空腔之间的锚固件。 每个开口的中心也是其中一个空腔的中心。
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公开(公告)号：US20140291829A1
公开(公告)日：2014-10-02
申请号：US13853886
申请日：2013-03-29
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Olivier Le Neel , Shian-Yeu Kam , Tien-Choy Loh , Ditto Adnan , Tze Wei Dennis Chew
CPC classification number: H01L25/16 , B81C1/0023 , G01N27/223 , H01L21/56 , H01L21/561 , H01L23/16 , H01L23/3121 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/00 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/854 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.
Abstract translation: 包括钝化保护ASIC模块和结合到图案化盖的微传感器模块的微传感器装置为信号调节电路提供保护，同时允许微传感器模块中的一个或多个感测元件暴露于周围环境 。 根据制造微传感器装置的方法，图案化盖可以使用与感测元件化学相容的平面化粘合剂结合到微传感器模块。 在一个实施例中，粘合剂材料是用于介电活性元件的材料，例如光敏聚酰亚胺膜。
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公开(公告)号：US20140291677A1
公开(公告)日：2014-10-02
申请号：US13853732
申请日：2013-03-29
Applicant: STMICROELECTRONICS PTE LTD.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
IPC: G01K7/16 , G01N27/22 , G01L9/12 , H01L25/065 , H01L25/00
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成在单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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