公开(公告)号：US20140231852A1

公开(公告)日：2014-08-21

申请号：US14181094

申请日：2014-02-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Duk Il Suh ,  Kyoung Wan Kim ,  Yeo Jin Yoon ,  Sang Won Woo ,  Shin Hyoung Kim

IPC: H01L27/15

CPC classification number: H01L33/387 ,  H01L27/15 ,  H01L29/861 ,  H01L33/145 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting diode chip and a light emitting diode package including the same. The light emitting diode chip includes a substrate, a light emitting diode section disposed on the substrate, an inverse parallel diode section disposed on the substrate and connected inversely parallel to the light emitting diode section. In the light emitting diode chip, the light emitting diode section is disposed together with the inverse parallel diode section.

Abstract translation: 发光二极管芯片和包括该发光二极管芯片的发光二极管封装。 发光二极管芯片包括衬底，设置在衬底上的发光二极管部分，设置在衬底上并且与发光二极管部分反向并联连接的反并联二极管部分。 在发光二极管芯片中，发光二极管部分与逆并联二极管部分一起设置。