Abstract:
A transflective liquid crystal display (LCD) includes at least a transmission pixel region and at least a reflection pixel region positioned in a pixel region. The transmission region includes at least a transmissive electrode connected to a first switching element. The reflection pixel region includes at least a reflective electrode connected to a second switching element. The transmissive and the reflective electrodes are controlled respectively by independent switching elements.
Abstract:
An LCD having semiconductor components. In one embodiment of the invention, the structure with multiple silicon layers comprises a substrate, a first silicon layer on the substrate, a gate dielectric layer on the first silicon layer, a gate on the gate dielectric layer, an interlayer dielectric layer on the gate, and a second silicon layer on the interlayer dielectric layer.
Abstract:
A shift register unit. The shift register unit outputs a shift register signal according to a clock signal, an inverse clock signal and a start signal. The shift register has first and second clock inversion circuits, and an inverter. In the first clock inversion circuit, a third PMOS transistor has a third source coupled to the first voltage, a third gate and a third drain. A fourth PMOS transistor has a fourth source coupled to the third drain, a fourth gate and a fourth drain coupled to the second voltage. A fifth PMOS transistor has a fifth source coupled to the third drain, a fifth drain coupled to the first gate, and a fifth gate. A sixth PMOS transistor having a sixth source coupled to the third gate, a sixth drain coupled to the second gate, and a sixth gate coupled to the fifth gate.
Abstract:
A method of fabricating a thin film transistor (TFT) with self-aligned structure. A substrate is provided, with a semiconductor layer and gate insulation layer formed in sequence thereon, followed by formation of a conductive layer on the gate insulation layer, and definition of the conductive layer to form a gate conductive layer and a dummy conductive layer. The dummy conductive layer is on both sides of the gate conductive layer and provided with a gap therebetween. A first ion implantation is performed via the gap to form a lightly doped region on the semiconductor layer thereunder, and a sacrificial layer is formed to fill the gap. The dummy conductive layer is removed. The gate conductive layer and the remaining sacrificial layer are used as a mask. Finally, a second ion implantation is performed to form a heavily doped source/drain region on the semiconductor layer.