Semiconductor device
    31.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08841662B2

    公开(公告)日:2014-09-23

    申请号:US12917548

    申请日:2010-11-02

    IPC分类号: H01L29/786 H01L27/12

    摘要: An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using a metal whose work function is lower than the work function of the oxide semiconductor layer or an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.

    摘要翻译: 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极电极层具有两层或多层的层叠结构,其中使用功函数低于氧化物半导体层的功函数或合金的金属形成与氧化物半导体层接触的层 含有这样的金属。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。

    Semiconductor device and manufacturing method for the same

    公开(公告)号:US08470650B2

    公开(公告)日:2013-06-25

    申请号:US12906553

    申请日:2010-10-18

    IPC分类号: H01L29/786

    摘要: An object is to provide a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor. A method for manufacturing a semiconductor device includes the steps of: forming an oxide semiconductor film over a gate electrode with a gate insulating film interposed between the oxide semiconductor film and the gate electrode, over an insulating surface; forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductor film; forming a second conductive film including a metal having lower electronegativity than hydrogen, over the first conductive film; forming a source electrode and a drain electrode by etching of the first conductive film and the second conductive film; and forming an insulating film in contact with the oxide semiconductor film, over the oxide semiconductor film, the source electrode, and the drain electrode.

    SEMICONDUCTOR DEVICE
    33.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20110108834A1

    公开(公告)日:2011-05-12

    申请号:US12917569

    申请日:2010-11-02

    IPC分类号: H01L29/24

    摘要: An object is, in a thin film transistor including an oxide semiconductor layer, to reduce contact resistance between the oxide semiconductor layer and source and drain electrode layers electrically connected to the oxide semiconductor layer. The source and drain electrode layers have a stacked-layer structure of two or more layers in which a layer in contact with the oxide semiconductor layer is formed using an oxide of a metal whose work function is lower than the work function of the oxide semiconductor layer or an oxide of an alloy containing such a metal. Layers other than the layer in contact with the oxide semiconductor layer of the source and drain electrode layers are formed using an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, an alloy containing any of these elements as a component, an alloy containing any of these elements in combination, or the like.

    摘要翻译: 在包括氧化物半导体层的薄膜晶体管中,目的是减少氧化物半导体层与与氧化物半导体层电连接的源电极层和漏电极层之间的接触电阻。 源极和漏极层具有两层或多层的层叠结构,其中使用其功函数低于氧化物半导体层的功函数的金属的氧化物形成与氧化物半导体层接触的层 或含有这种金属的合金的氧化物。 使用选自Al,Cr,Cu,Ta,Ti,Mo或W的元素形成与源极和漏极电极层的氧化物半导体层接触的层以外的层,包含任何这些元素作为 组分,包含任何这些元素组合的合金等。

    Light-emitting device and method for manufacturing light-emitting device
    34.
    发明授权
    Light-emitting device and method for manufacturing light-emitting device 有权
    发光装置及其制造方法

    公开(公告)号:US07850501B2

    公开(公告)日:2010-12-14

    申请号:US11687204

    申请日:2007-03-16

    IPC分类号: H01J1/62

    摘要: Techniques are provided for manufacturing a light-emitting device having high internal quantum efficiency, consuming less power, having high luminance, and having high reliability. The techniques include forming a conductive light-transmitting oxide layer comprising a conductive light-transmitting oxide material and silicon oxide, forming a barrier layer in which density of the silicon oxide is higher than that in the conductive light-transmitting oxide layer over the conductive light-transmitting oxide layer, forming an anode having the conductive light-transmitting oxide layer and the barrier layer, heating the anode under a vacuum atmosphere, forming an electroluminescent layer over the heated anode, and forming a cathode over the electroluminescent layer. According to the techniques, the barrier layer is formed between the electroluminescent layer and the conductive light-transmitting oxide layer.

    摘要翻译: 提供了用于制造具有高内部量子效率,消耗较少功率,具有高亮度并且具有高可靠性的发光装置的技术。 这些技术包括形成包含导电透光氧化物材料和氧化硅的导电透光氧化物层,形成阻挡层,其中氧化硅的密度高于导电光上的导电透光氧化物层的密度 形成具有导电透光性氧化物层和阻挡层的阳极,在真空气氛下加热阳极,在加热阳极上形成电致发光层,在电致发光层上形成阴极。 根据该技术,在电致发光层和导电透光性氧化物层之间形成阻挡层。

    Light-emitting device
    35.
    发明授权
    Light-emitting device 有权
    发光装置

    公开(公告)号:US07205716B2

    公开(公告)日:2007-04-17

    申请号:US10967281

    申请日:2004-10-19

    IPC分类号: H01J1/62 H01J63/04

    摘要: Techniques are provided for manufacturing a light-emitting device having high internal quantum efficiency, consuming less power, having high luminance, and having high reliability. The techniques include forming a conductive light-transmitting oxide layer comprising a conductive light-transmitting oxide material and silicon oxide, forming a barrier layer in which density of the silicon oxide is higher than that in the conductive light-transmitting oxide layer over the conductive light-transmitting oxide layer, forming an anode having the conductive light-transmitting oxide layer and the barrier layer, heating the anode under a vacuum atmosphere, forming an electroluminescent layer over the heated anode, and forming a cathode over the electroluminescent layer. According to the techniques, the barrier layer is formed between the electroluminescent layer and the conductive light-transmitting oxide layer.

    摘要翻译: 提供了用于制造具有高内部量子效率,消耗较少功率,具有高亮度并且具有高可靠性的发光装置的技术。 这些技术包括形成包含导电透光氧化物材料和氧化硅的导电透光氧化物层,形成阻挡层,其中氧化硅的密度高于导电光上的导电透光氧化物层的密度 形成具有导电透光性氧化物层和阻挡层的阳极,在真空气氛下加热阳极,在加热阳极上形成电致发光层,在电致发光层上形成阴极。 根据该技术,在电致发光层和导电透光性氧化物层之间形成阻挡层。

    Thin film transistor (TFT) having a protective layer and manufacturing method thereof
    38.
    发明授权
    Thin film transistor (TFT) having a protective layer and manufacturing method thereof 有权
    具有保护层的薄膜晶体管(TFT)及其制造方法

    公开(公告)号:US08383470B2

    公开(公告)日:2013-02-26

    申请号:US12634084

    申请日:2009-12-09

    摘要: One of factors that increase the contact resistance at the interface between a first semiconductor layer where a channel is formed and source and drain electrode layers is a film with high electric resistance formed by dust or impurity contamination of a surface of a metal material serving as the source and drain electrode layers. As a solution, a first protective layer and a second protective layer including a second semiconductor having a conductivity that is less than or equal to that of the first semiconductor layer is stacked successively over source and drain electrode layers without exposed to air, the stack of films is used for the source and drain electrode layers.

    摘要翻译: 增加在形成沟道的第一半导体层与源电极层与漏极电极层之间的界面处的接触电阻的因素之一是具有高电阻的膜,其由作为金属材料的金属材料的表面的灰尘或杂质污染形成 源极和漏极电极层。 作为解决方案,包括导电率小于或等于第一半导体层的导电率的第二半导体的第一保护层和第二保护层在不暴露于空气的情况下在源极和漏极电极层上依次层叠, 膜用于源电极层和漏电极层。

    DISPLAY DEVICE AND ELECTRONIC DEVICE
    39.
    发明申请
    DISPLAY DEVICE AND ELECTRONIC DEVICE 有权
    显示设备和电子设备

    公开(公告)号:US20110057918A1

    公开(公告)日:2011-03-10

    申请号:US12872861

    申请日:2010-08-31

    IPC分类号: G09G5/00

    摘要: A display device including a pixel having a memory. The pixel includes at least a display element, a capacitor, an inverter, and a switch. The switch is controlled with a signal held in the capacitor and a signal output from the inverter so that voltage is supplied to the display element. The inverter and the switch can be constituted by transistors with the same polarity. A semiconductor layer included in the pixel may be formed using a light-transmitting material. Moreover, a gate electrode, a drain electrode, and a capacitor electrode may be formed using a light-transmitting conductive layer. The pixel is formed using a light-transmitting material in such a manner, whereby the display device can be a transmissive display device while including a pixel having a memory.

    摘要翻译: 一种显示装置,包括具有存储器的像素。 像素至少包括显示元件,电容器,反相器和开关。 开关由保持在电容器中的信号和从逆变器输出的信号控制,使得电压被提供给显示元件。 逆变器和开关可以由具有相同极性的晶体管构成。 可以使用透光材料形成包括在像素中的半导体层。 此外,可以使用透光导电层来形成栅电极,漏电极和电容器电极。 以这种方式使用透光材料形成像素,由此显示装置可以是包括具有存储器的像素的透射显示装置。

    Semiconductor device and method for manufacturing the semiconductor device
    40.
    发明授权
    Semiconductor device and method for manufacturing the semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US08440502B2

    公开(公告)日:2013-05-14

    申请号:US13228486

    申请日:2011-09-09

    IPC分类号: H01L21/84

    摘要: An object is to suppress deterioration of element characteristics even when an oxide semiconductor is formed after a gate insulating layer, a source electrode layer, and a drain electrode layer are formed. A gate electrode layer is formed over a substrate. A gate insulating layer is formed over the gate electrode layer. A source electrode layer and a drain electrode layer are formed over the gate insulating layer. Surface treatment is performed on surfaces of the gate insulating layer, the source electrode layer, and the drain electrode layer which are formed over the substrate. After the surface treatment is performed, an oxide semiconductor layer is formed over the gate insulating layer, the source electrode layer, and the drain electrode layer.

    摘要翻译: 即使在形成了栅极绝缘层,源极电极层和漏极电极层之后形成氧化物半导体,也是要抑制元件特性的劣化。 在基板上形成栅极电极层。 在栅电极层上形成栅极绝缘层。 源极电极层和漏电极层形成在栅绝缘层上。 在形成在基板上的栅极绝缘层,源极电极层和漏极电极层的表面上进行表面处理。 在进行表面处理之后,在栅极绝缘层,源极电极层和漏极电极层上形成氧化物半导体层。