公开(公告)号：US20140033814A1

公开(公告)日：2014-02-06

申请号：US13562853

申请日：2012-07-31

申请人： Jian Wen ,  William G. McDonald

发明人： Jian Wen ,  William G. McDonald

IPC分类号： H01L29/84 ,  B60C23/04 ,  H01L21/50

CPC分类号： G01L19/14 ,  G01L19/0038 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.

摘要翻译： 提供了包覆成型的压力传感器封装。 压力传感器模具（Pcell）被封盖，使得Pcell具有增强的刚度以承受由模制密封剂产生的应力效应。 Pcell帽包括一个远离Pcell隔膜的孔，使得Pcell能够承受外部气体压力，同时将水分从隔膜引导出来。 凝胶不需要使用，相反，如果需要，可以在Pcell上沉积软膜以保护Pcell隔膜免受过多的水分。 Pcell帽可以采取例如虚拟硅晶片或功能ASIC的形式。

公开(公告)号：US20110173910A1

公开(公告)日：2011-07-21

申请号：US12691405

申请日：2010-01-21

申请人： Kenneth Franklin ,  William G. McDonald

发明人： Kenneth Franklin ,  William G. McDonald

IPC分类号： E04C2/24 ,  E04D3/18 ,  B32B27/06 ,  B32B7/04

CPC分类号： E04D13/1681 ,  B32B7/12 ,  B32B21/08 ,  B32B27/06 ,  B32B27/065 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2266/0228 ,  B32B2266/025 ,  B32B2266/0278 ,  B32B2307/712 ,  B32B2419/06 ,  C09J7/29 ,  C09J2201/162 ,  C09J2400/243 ,  C09J2423/106 ,  C09J2425/006 ,  C09J2433/00 ,  C09J2475/006 ,  E04D12/00 ,  Y10T428/1452 ,  Y10T428/1462 ,  Y10T428/1476

摘要： Composite roofing boards and methods for installing a composite roofing board are presented herein. In one embodiment, the roofing board comprises at least nine layers: two outer polymeric layers; two adhesive layers disposed between the two outer polymeric layers; two inner polymeric layers disposed between the two adhesive layers; and a substrate layer disposed between the two inner polymeric layers. A polymeric adhesive, such as an acrylate-polymer adhesive, is preformed on an outer surface of the first and/or second outer polymeric layer. A removable release liner, such as a siliconized polyester film, covers the polymeric adhesive.

摘要翻译： 本文介绍了复合屋面板和安装复合屋面板的方法。 在一个实施例中，屋顶板包括至少九层：两个外部聚合物层; 两个粘合层设置在两个外部聚合物层之间; 设置在两个粘合剂层之间的两个内部聚合物层; 以及设置在两个内部聚合物层之间的基底层。 聚合物粘合剂，例如丙烯酸酯 - 聚合物粘合剂，在第一和/或第二外部聚合物层的外表面上预成型。 可移除的剥离衬垫，例如硅化聚酯膜，覆盖聚合物粘合剂。

公开(公告)号：US20090152710A1

公开(公告)日：2009-06-18

申请号：US12350547

申请日：2009-01-08

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.

摘要翻译： 提供四方扁平无铅（QFN）封装。 QFN封装的一个实施例包括半导体芯片，其包括有源表面和非活性表面，多个引线，被配置为将多个引线耦合到半导体芯片的多个引线键合，以及包括安装侧和 有一个周长。 活性表面朝向安装侧定向，多个引线接合位于模具材料内的活性表面和安装侧之间，并且多个引线在安装侧暴露并且至少部分地封装在周边内 的模具材料。

公开(公告)号：US20080099899A1

公开(公告)日：2008-05-01

申请号：US11590327

申请日：2006-10-31

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material 340, 440 substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds 330, 430 disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.

摘要翻译： 提供了将Quad Flat No-Lead（QFN）封装（300,400）的尺寸缩小到芯片级封装的方法和装置。 这种QFN封装包括第一半导体芯片（310,410），具有模具锁定特征的多个凹陷引线（306,406,408,411）以及基本上封装半导体芯片的所有侧面的模具材料340,440。 半导体芯片的有源表面（314,414）朝向QFN封装的安装侧（307,407）取向，并且设置在有源表面和安装侧之间的多个引线接合330,430将活动侧 到线索 QFN封装还可以包括以类似于第一半导体芯片的方式通过引线键合（431,432）耦合到多个引线（408）的第二半导体芯片（452）和第一半导体芯片（431）。