摘要:
An apparatus and method for obtaining data for diagnosing the condition of a living body without harming living tissue using an ultrahigh frequency (UHF) signal includes a signal transmitter, a signal receiver, and a signal processor. Signal transmitter generates a UHF signal and radiates the UHF signal at a first of two acupuncture points of a living body. The signal receiver receives a UHF signal emitted from a second acupuncture point, detects and outputs the magnitude of the received UHF signal. The signal processor compares the detected magnitude of the received UHF signal with a magnitude of the UHF signal generated by the signal transmitter, calculates from the result of comparing and recording a conductivity of each of the acupuncture sections when the UHF signal passes through the corresponding acupuncture section, calculates at least one of a first variation, which indicates a degree of variation in conductivities of the acupuncture sections, and a second variation, which indicates a degree of variation in conductivities for a plurality of channels, using at least two recorded conductivities of the respective acupuncture sections, and outputs the result of calculation as data for diagnosing the condition of the living body.
摘要:
Integrated circuit devices include a first dielectric layer, an electrically insulating layer on the first dielectric layer and an an aluminum oxide buffer layer formed by atomic layer deposition (ALD) and stabilized by heat treatment at a temperature of less than about 600.degree. C., between the first dielectric layer and the electrically insulating layer. The first dielectric layer may comprise a high dielectric material such as a ferroelectric or paraelectric material. The electrically insulating layer may also comprise a material selected from the group consisting of silicon dioxide, borophosphosilicate glass (BPSG) and phosphosilicate glass (PSG). To provide a preferred integrated circuit capacitor, a substrate may be provided and an interlayer dielectric layer may be provided on the substrate. Here, a metal layer may also be provided between the interlayer dielectric layer and the first dielectric layer. The metal layer may comprise a material selected from the group consisting of Pt, Ru, Ir, and Pd.