公开(公告)号：US20150262918A1

公开(公告)日：2015-09-17

申请号：US14213042

申请日：2014-03-14

Applicant: Texas Instruments Incorporated

Inventor： Andy Quang Tran ,  Reynaldo Corpuz Javier ,  Alok Kumar Lohia

IPC: H01L23/495 ,  H01L23/24 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L24/97 ,  H01L21/4825 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/432 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48106 ,  H01L2224/48177 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1711 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/48095

Abstract: Semiconductor device package (100) comprises a metallic Quad Flat No-Lead/Small Outline No-Lead QFN/SON-type leadframe (101) with a pad (102) and a plurality of leads (103) with solderable surfaces (101a, 110a), at least one set of leads aligned in a row while having one surface in a common plane (170), each lead of the set having a protrusion (110) shaped as a metal sheet. A package material (160) encapsulates the assembly and the leadframe, the package material shaped by sidewalls (161) with the row of leads positioned along an edge of a sidewall and the protrusions extending away from the package sidewalls, the common-plane lead surfaces and the protrusions remaining un-encapsulated. The protruding metal sheets (110) are bent at an angle (171) from the common plane towards the package sidewalls.

Abstract translation: 半导体器件封装（100）包括具有焊盘（102）和多个具有可焊接表面（101a，110a）的引线（103）的金属四边形扁平无引脚/小外形无引线QFN / SON型引线框架 ），至少一组引线在一行中对准，同时在公共平面（170）中具有一个表面，该组的每个引线具有形成为金属片的突起（110）。 封装材料（160）封装组件和引线框架，封装材料由侧壁（161）成形，其中一排引线沿着侧壁的边缘定位，并且突出部远离封装侧壁延伸，共面引线表面 并且突起保持未封装。 突出的金属板（110）从公共平面朝向封装侧壁成一定角度（171）弯曲。