PIXEL STRUCTURE FOR DISPLAY
    31.
    发明申请

    公开(公告)号:US20210159249A1

    公开(公告)日:2021-05-27

    申请号:US16463721

    申请日:2018-11-05

    Abstract: A pixel structure for a display is provided. The pixel structure includes a substrate; a first metal layer disposed on the substrate, the first metal layer including at least one scanning line; an insulating layer disposed on the first metal layer, the insulating layer comprising a plurality of through holes; and a second metal layer disposed on the insulating layer, the second metal layer including at least one data line and at least one second metal segment, and the data line separated from the second metal segment; wherein the second metal segment is electrically connected in parallel with the scanning line via the plurality of through holes.

    BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY

    公开(公告)号:US20210072449A1

    公开(公告)日:2021-03-11

    申请号:US16769609

    申请日:2019-05-09

    Abstract: A backlight module and a liquid crystal display are provided. The backlight module realizes a narrow border of the backlight module by arranging a light source between a first protrusion portion of a support part and a light incident surface of a light guide plate. The backlight module cooperates with the liquid crystal display panel having a second protrusion portion and second notches of a stepped area, and a flexible printed circuit board passes through the second notches of the liquid crystal display panel and the first notches of the backlight module.

    DISPLAY DEVICE COMPRISING A FLIP CHIP FILM CONNECTED TO A CONNECTING SURFACE OF A PLURALITY OF BONDING PINS AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210294137A1

    公开(公告)日:2021-09-23

    申请号:US16625795

    申请日:2019-08-02

    Abstract: A display device and a manufacturing method of the display device are provided. The display device includes a first substrate, and a flip chip film. The first substrate is provided with bonding pins, conductive adhesive layers, and barriers. Each bonding pin is extended to a side edge of the first substrate, and each bonding pin includes a connecting surface which is flush with the side edge of the first substrate. Each conductive adhesive layer covers one side of each bonding pin, each conductive adhesive layer is extended to the side edge of the first substrate, and the conductive adhesive layer includes an auxiliary connecting surface which is flush with the side edge of the first substrate. Each barrier surrounds side surfaces of each conductive adhesive layer. The flip chip film is connected to the connecting surface and the auxiliary connecting surface.

    DISPLAY PANEL AND DISPLAY DEVICE
    38.
    发明申请

    公开(公告)号:US20210231994A1

    公开(公告)日:2021-07-29

    申请号:US16631298

    申请日:2019-07-18

    Abstract: The disclosure provides a display panel and a display device. In an array substrate of the display panel, at least two protrusions are defined on a side of a non-display region away from a display region to form an extending portion. A recess is defined between adjacent protrusions. A driver chip is disposed in a space between a periphery of a display region and a periphery of a non-display region. Distances between the driver chip, the periphery of the display region, and the periphery of the non-display region are increased. A bending section of a flexible circuit board is disposed in the recess. As a result, width of the non-display region will not be increased.

    DRIVING CHIP AND DISPLAY PANEL
    39.
    发明申请

    公开(公告)号:US20200328172A1

    公开(公告)日:2020-10-15

    申请号:US16612785

    申请日:2019-09-10

    Abstract: A driving chip and a display panel are provided. The display panel includes the driving chip, and a plurality of first bonding pads and a plurality of second bonding pads disposed at two opposite sides of the driving chip. The driving chip includes a group of first input leads and a group of second input leads. There is an interval between the group of first input leads and the group of second input leads. The group of first input leads is disposed near the first bonding pads, and the group of second input leads is disposed near the second bonding pads.

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